|Publication number||US7393712 B2|
|Application number||US 11/350,662|
|Publication date||Jul 1, 2008|
|Filing date||Feb 8, 2006|
|Priority date||Jul 15, 2003|
|Also published as||CN1576229A, EP1498385A2, EP1498385A3, US20050012197, US20070042565|
|Publication number||11350662, 350662, US 7393712 B2, US 7393712B2, US-B2-7393712, US7393712 B2, US7393712B2|
|Inventors||Mark A. Smith, William R Boucher, Charles C Haluzak|
|Original Assignee||Hewlett-Packard Development Company, L.P.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (22), Non-Patent Citations (4), Referenced by (16), Classifications (14), Legal Events (4)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This Application is a continuation of commonly assigned U.S. patent application Ser. No. 10/620,968 filed Jul. 15, 2003 and hereby incorporated by reference.
Certain fluidic micro-electro-mechanical systems (MEMS) applications include fluid in a hermetically sealed inner cavity of a MEMS package. Such hermetic MEMS packages may comprise rigid and/or brittle materials. The volumetric expansion rate of fluids hermetically sealed in MEMS packaging, upon increases in temperature, may be as much as 20 to 100 times greater, for example, than the expansion rate of the inner cavity of the package based on the linear expansion rate of the packaging materials. The fluid may also be incompressible or have a very low degree of compressibility. As a result, thermal excursions may result in an increase of fluid pressure in the inner cavity which may lead to fluid leakage and/or fracture of the packaging materials.
An exemplary embodiment of a MEMS package comprises a substrate and a cover plate. A MEMS structure is fabricated on the substrate. The cover plate may be bonded to the substrate by a bond ring. The cover plate, the bond ring and the substrate may define an inner cavity. The cover plate, the substrate and a breach in the bond ring may define a fill port.
These and other features and advantages of the invention will readily be appreciated by persons skilled in the art from the following detailed description of exemplary embodiments thereof, as illustrated in the accompanying drawings, in which:
In the following detailed description and in the several figures of the drawing, like elements are identified with like reference numerals.
The exposed portions 33 may be defined in an opening 22, for example a slot or hole in the cover plate, or may be defined in a partial slot or hole which, for example, may remain in a cover plate after singulation from a wafer-scale assembly (
In an exemplary embodiment illustrated in
Exemplary fluidic MEMS devices may be assembled using various techniques. In one exemplary process, a cover plate is attached by a bond ring to a substrate to define an inner cavity. The size of the substrate and cover plate may be chosen to permit access to bond pads in exposed areas of the substrate. For example, the cover plate may be smaller than the substrate defining exposed portions of the primary surface of the substrate after the cover plate is attached. The exemplary embodiment illustrated in
In an alternate pick-and-place embodiment illustrated in
Each cover plate 2 is attached to the wafer 300 by a bond ring 4 at a die location 35. The wafer 300, the cover plates 2 and the bond rings 4 define a plurality of inner cavities. Bond pads 34 are provided for making electrical connections to the MEMS device structures. Individual MEMS devices or dies may be singulated from the wafer after the cover plates are attached. Attaching the cover plates at the wafer level may provide some protection to the MEMS structures on the substrate during any subsequent manufacturing, assembly or handling. The individual MEMS devices could be filled with fluid at the wafer level, prior to singulation, as discussed below. The exemplary embodiments illustrated in
In an alternate
The openings 22 may provide access to fill ports 111 for filling and sealing, as discussed below, and/or access to bond pads 34 for making electrical connections. When the cover plate is attached to the wafer, the access openings define exposed portions on the primary surface of the substrate or wafer. In the exemplary embodiment of
The exposed portions 33 a at the fill ports may provide access to fill the inner cavity through the fill port, may provide a platform adapted to receive fluid to be provided for use in filling the inner cavity and may provide a platform for placing a seal at the fill port after filling the inner cavity. Exposed portions 33 adjacent fill ports in other exemplary embodiments may also provide a platform for providing fluid for use in filling the inner cavity and may provide a platform for placing a seal at the fill port after filling the inner cavity. The exposed portions 33 b on which the bond pads 34 are arranged provide access to the bond pads to make electrical connections to the individual MEMS devices or dies after singulation from the assembly 100. Exposed portions 33 in other exemplary embodiments may also provide access to bond pads to make electrical connections to MEMS devices.
In the exemplary embodiment illustrated in
In an exemplary embodiment of a MEMS device 1, it may be desirable to fill the inner cavity 11 with fluid 6. Such fluidic MEMS device applications include without limitation micromirror arrays, micromotors, microswitches or accelerometers. Fluids used in these applications may comprise aromatic solvents, such as 1,1, Diphenylethylene, organosilianes, such as 3-chloropropyl triethoxysilane, perfluoroethers, such as Galden HT-100 (™), silicones and silanes, such as polymethylphenylsiloxane, and polydimethylsiloxane, water, mixtures of water and water-soluble organics, ionic materials dissolved in water, pigmented fluids, colloidal suspensions.
Fluid may be introduced into an inner cavity by a method illustrated in
When the inner cavity is provided with a vacuum, an amount of fluid at least sufficient to fill the inner cavity may be provided at the feed port 111. In an exemplary embodiment illustrated in
The fluid provided at the fluid port should be arranged such that an increase in the pressure of the environment 7 surrounding the MEMS assembly or in the chamber causes fluid to enter the inner cavity through the feed port. In an exemplary embodiment illustrated in
The rate of pressure increase should be selected such that the differential pressure between the increased pressure in the environment or chamber and the low pressure or vacuum in the inner cavity causes the fluid to enter the cavity through the breach in the bond ring and completely fill the space between the silicon wafer and the cover plate. For viscous fluids, the fill time may be dominated by the time it takes the fluid to work its way in through the fill port. For fluids of lower viscosity, the fill time may be dominated by the time it takes to fully create the vacuum and evacuate air from the chamber and/or the inner cavity. A variety of factors may influence the length of the fill process, including fluid viscosity, temperature, fill port geometry, gap height, surface tension between the fluid and the cavity surfaces, and/or MEMS geometry. The duration of the fill process may be decreased by using higher than atmospheric pressure to increase the flow rate into the cavity.
The pressure of the environment or the chamber may be increased while the MEMS assembly is completely submerged in fluid or when the MEMS assembly has been removed from the liquid, leaving amounts of fluid sufficient for filling the cavities at the fill ports, or after a sufficient amount of fluid has been placed at the fill ports by other means. The amount of fluid provided at the fill port should be sufficient to fill the inner cavity and to prevent the introduction of air and/or gas into the inner cavity during the fill process. Where the MEMS assembly is submerged in fluid, the pressure due to the fluid alone may cause some fluid to enter the inner cavity before the pressure of the environment is increased. Capillary forces may also contribute to causing fluid to enter the inner cavity. The wafer is cleaned of excess fluid by an appropriate method, for example using a solvent, evaporation or wiping.
Certain alternative, optional embodiments may include several purge cycles with a gas or gasses, for example, carbon dioxide or helium, to help ensure that all of the air is removed from the inner cavity. Purge gases suitable for use in purging the inner cavity may be selected so that the gas or gases have high solubility in the fluid, the gases are inert with respect to the fluid and with respect to other materials present in the inner cavity. Suitable gases may comprise helium or carbon dioxide. In those embodiments in which a purge gas is used, the use of purge gases with high solubility in the fluid helps reduce the formation of residual gas bubbles in the fluid. The fluid used to fill the inner cavity may also be degassed prior to filling. Degassing the fluid may prevent absorbed gas from coming out of solution and nucleating a bubble in the fluid.
In exemplary embodiments, it may be desirable to remove adsorbed fluid, which may comprise water, from the surfaces of the inner cavity. The adsorbed fluid may be removed during the evacuation step. Elevated temperatures may be used to speed up the removal of adsorbed fluid.
In an alternative exemplary embodiment, capillary forces alone may be sufficient to fill the cavity without using a vacuum. The MEMS assembly may comprise a bond ring with a plurality of breaches, for example two breaches.
An amount of adhesive, which may be curable adhesive, is applied to the location of the breach or breaches and cured to complete the containment of the fluid. Suitable adhesives may comprise organic adhesives, such as epoxies, which are thermally or UV cured, solders or glass-based sealants. Suitable sealants may be chemically inert or compatible with the fluid, may have a thermal expansion coefficient compatible for use with other components, may have good adhesion to all surfaces, high reliability, hermeticity. In the exemplary embodiments illustrated in
The height 41 of the inner cavity may be selected such that the volume of the fluid contained within the inner cavity is sufficiently small so that the change in volume upon expansion is sufficiently small to be accommodated by a slight deflections of the cover plate, substrate, bond ring, adhesive seal, thereby reducing the risk of damage to the cover plate.
In an exemplary embodiment of the fluidic MEMS device and method of manufacturing a fluidic MEMS device, a plurality of inner cavities defined on a wafer may be filled with fluid simultaneously. In one exemplary embodiment, a plurality of cover plates may be individually attached to each die location on a single substrate or wafer, as illustrated in
In an exemplary embodiment, a method for filling MEMS assemblies does not require drilling holes in the substrate or silicon wafer, which may result in increased simplicity and cost savings. The fluid containment may be accomplished virtually entirely by hermetic materials, thereby increasing reliability by reducing the risks of vapor loss from and/or air ingress into the inner cavities. The fluid filling process may occur at the wafer level. Many devices are filled at once, yielding a throughput gain.
Attaching the cover plate or plates at the wafer stage may provide protection to the active silicon MEMS structures during the manufacturing process. This may be particularly advantageous for devices where particle sensitivities are high or where the silicon contains delicate structures. Assembling the MEMS device packages or assemblies at the wafer stage may also permit fully functional testing at the wafer level. This may permit faulty parts to be identified at an early stage of the manufacturing process, thereby saving further manufacturing costs. The MEMS device and methods of this disclosure may reduce or eliminate the number of fluid interconnections and/or flexible diaphragms, resulting in fewer manufacturing steps and reduced manufacturing costs.
Providing an inner cavity with sufficiently small volume will reduce the total volumetric expansion of fluid in the fluidic MEMS device, thereby reducing the risk of leakage or other structural damage to the MEMS package due to the fluid expansion. The thermal expansion of the fluid may be entirely accommodated by deflections in the cover plate, substrate and bond ring without fracturing or damaging the packaging materials.
It is understood that the above-described embodiments are merely illustrative of the possible specific embodiments which may represent principles of the present invention. Other arrangements may readily be devised in accordance with these principles by those skilled in the art without departing from the scope and spirit of the invention.
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|U.S. Classification||438/51, 438/53, 257/E21.503, 438/26, 257/E21.502, 438/52|
|International Classification||B81B7/02, B81C1/00, B81B7/00, H01L21/00, B81C3/00, H01L23/24|
|Nov 11, 2008||CC||Certificate of correction|
|Apr 26, 2011||AS||Assignment|
Owner name: SAMSUNG ELECTRONICS CO., LTD., KOREA, REPUBLIC OF
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;HEWLETT-PACKARD COMPANY;REEL/FRAME:026198/0139
Effective date: 20101019
|Dec 28, 2011||FPAY||Fee payment|
Year of fee payment: 4
|Dec 16, 2015||FPAY||Fee payment|
Year of fee payment: 8