|Publication number||US7405924 B2|
|Application number||US 11/090,774|
|Publication date||Jul 29, 2008|
|Filing date||Mar 25, 2005|
|Priority date||Sep 27, 2004|
|Also published as||CA2516638A1, EP1640329A2, EP1640329A3, US20060076648|
|Publication number||090774, 11090774, US 7405924 B2, US 7405924B2, US-B2-7405924, US7405924 B2, US7405924B2|
|Inventors||Brian Gally, Lauren Palmateer, William J. Cummings|
|Original Assignee||Idc, Llc|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (117), Non-Patent Citations (32), Referenced by (9), Classifications (10), Legal Events (3)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This application claims the benefit of earlier filing date of U.S. Provisional Application No. 60/613,408 filed Sep. 27, 2004, which is hereby incorporated herein by reference in its entirety. Also, this application is related to U.S. patent application Ser. No. (not assigned), filed concurrently herewith and entitled “System and Method for Protecting Microelectromechanical Systems Array Using Back-Plate with Non-Flat Portion,” which is hereby incorporated by reference herein.
1. Field of Technology
The disclosure relates to microelectromechanical systems (MEMS), and more particularly to protection of MEMS devices from damage.
2. Description of the Related Technology
Microelectromechanical systems (MEMS) include micro mechanical elements, actuators, and electronics. Micromechanical elements may be created using deposition, etching, and or other micromachining processes that etch away parts of substrates and/or deposited material layers or that add layers to form electrical and electromechanical devices. One type of MEMS device is called an interferometric modulator. An interferometric modulator may comprise a pair of conductive plates, one or both of which may be transparent and/or reflective in whole or part and capable of relative motion upon application of an appropriate electrical signal. One plate may comprise a stationary layer deposited on a substrate, the other plate may comprise a metallic membrane separated from the stationary layer by an air gap.
Such devices have a wide range of applications, and it would be beneficial in the art to utilize and/or modify the characteristics of these types of devices so that their features can be exploited in improving existing products and creating new products that have not yet been developed. In designing commercial products utilizing this MEMS technology, packaging is developed in consideration of the requirements of cost, reliability and manufacturability. The packaging associated with the MEMS devices can incorporate various features to protect MEMS elements from being damaged by external forces.
The system, method, and devices of the invention each have several aspects, no single one of which is solely responsible for its desirable attributes. Without limiting the scope of this invention, its more prominent features will now be discussed briefly. After considering this discussion, and particularly after reading the section entitled “Detailed Description of Certain Embodiments” one will understand how the features of this invention provide advantages over other display devices.
One aspect of the invention provides an electronic device. The electronic device comprises a substrate having a surface, an array of microelectromechanical devices and a back-plate. The array of the microelectronic devices is formed on the surface of the substrate and has a back-surface facing away from the substrate. The back-plate is placed over the array and has an interior surface and an exterior surface. The interior surface of the back-plate faces the back-surface of the array with a gap therebetween. The exterior surface faces away from the substrate. The electronic device further comprises one or more reinforcing structures which are integrated with the back-plate. The reinforcing structures add stiffness to the back-plate. In the electronic device, a distance between the interior surface of the back-plate and the surface of the substrate may change over the surface of the substrate.
Another aspect of the invention provides an electronic device. The electronic device comprises a substrate having a surface; a microelectromechanical array and a back-plate. The array is formed on the substrate surface and has a back-surface facing away from the substrate. The back-plate is placed over the array and has an interior surface. The interior surface faces the back-surface of the array with a gap therebetween. The back-plate has a thickness varying along an edge thereof.
Still another aspect of the invention provides an electronic device. The electronic device comprises: a substrate; an array of interferometric modulators and a back-plate. The array is formed on the substrate and has a back-surface facing away from the substrate. The back-plate is placed over the array and has an interior surface facing the back-surface of the array with a gap between the interior surface of the back-plate and the back-surface of the array. The electronic device further comprises means for preventing the interior surface of the back-plate from directly contacting the back-surface of the array.
A further aspect of the invention provides a method of making an electronic device. The method comprises providing an intermediate device, providing a back-plate, placing the back-plate over the intermediate device and binding the back-plate and the substrate. The intermediate device comprises a substrate and an array of microelectromechanical devices formed on the substrate. The back-plate has an interior surface and an exterior surface. The back-plate is integrated with one or more reinforcing structures formed on at least one of the interior surface and the exterior surface. The back-plate is placed over the array of the intermediate device such that the interior surface of the back-plate faces the back-surface of the array with a gap therebetween. A further aspect of the invention provides an electronic device produced by the foregoing method of making such an electronic device.
Still another aspect of the invention provides an electronic device. The device comprises a substrate, an array of microelectromechanical devices formed on the substrate and a back-plate placed over the array. The back-plate has an interior surface and an exterior surface. The interior surface of the back-plate faces the array with a gap therebetween. The exterior surface faces away from the substrate. A distance between the interior surface of the back-plate and the substrate varies across the substrate.
A further aspect of the invention provides an electronic device. The electronic device comprises a substrate; an array of interferometric modulators formed on the substrate and a means for covering the array. The means comprises an interior surface and an exterior surface. The interior surface faces the array with a gap therebetween. The exterior surface faces away from the substrate. A distance between the interior surface of the covering means and the substrate varies across the substrate.
A still further aspect of the invention provides a method of making an electronic device. The method comprises providing an intermediate device which comprises a substrate and an array of microelectromechanical devices formed on the substrate. The method further comprises forming a back-plate over the array of the intermediate device with a gap between the back-plate and the array. The back-plate has an interior surface facing the array, and a distance between the interior surface and the substrate varies across the substrate. A further aspect of the invention provides an electronic device produced by the foregoing method of making such an electronic device.
Various reinforcing structures are formed on a back-plate of MEMS devices. The reinforcing structures increase the stiffness of the back-plate and therefore prevent the back-plate from contacting and damaging the MEMS elements or array of the device. The reinforcing structures are integrated with the back-plate on either or both of the surfaces thereof. The back-plate can be formed in various configurations which improve the stiffness thereof or reduce the likelihood of it contacting the MEMS array when the back-plate is subject to an external force. The configurations include a curved back-plate, curved surfaces of the back-plate, a back-plate having one or more recesses, varying thickness of the back-plate, etc. The reinforcing structures and the various configurations can be combined to further prevent damage to the MEMS array when an external force is applied to the back-plate of a MEMS device.
The following detailed description is directed to certain specific embodiments of the invention. However, the invention can be embodied in a multitude of different ways. In this description, reference is made to the drawings wherein like parts are designated with like numerals throughout. As will be apparent from the following description, the invention may be implemented in any device that is configured to display an image, whether in motion (e.g., video) or stationary (e.g., still image), and whether textual or pictorial. More particularly, it is contemplated that the invention may be implemented in or associated with a variety of electronic devices such as, but not limited to, mobile telephones, wireless devices, personal data assistants (PDAs), hand-held or portable computers, GPS receivers/navigators, cameras, MP3 players, camcorders, game consoles, wrist watches, clocks, calculators, television monitors, flat panel displays, computer monitors, auto displays (e.g., odometer display, etc.), cockpit controls and/or displays, display of camera views (e.g., display of a rear view camera in a vehicle), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., display of images on a piece of jewelry). MEMS devices of similar structure to those described herein can also be used in non-display applications such as in electronic switching devices.
One interferometric modulator display embodiment comprising an interferometric MEMS display element is illustrated in
The depicted portion of the pixel array in
The fixed layers 16 a, 16 b are electrically conductive, partially transparent and partially reflective, and may be fabricated, for example, by depositing one or more layers each of chromium and indium-tin-oxide onto a transparent substrate 20. The layers are patterned into parallel strips, and may form row electrodes in a display device as described further below. The movable layers 14 a, 14 b may be formed as a series of parallel strips of a deposited metal layer or layers (orthogonal to the row electrodes 16 a, 16 b) deposited on top of posts 18 and an intervening sacrificial material deposited between the posts 18. When the sacrificial material is etched away, the deformable metal layers are separated from the fixed metal layers by a defined air gap 19. A highly conductive and reflective material such as aluminum may be used for the deformable layers, and these strips may form column electrodes in a display device.
With no applied voltage, the cavity 19 remains between the layers 14 a, 16 a and the deformable layer is in a mechanically relaxed state as illustrated by the pixel 12 a in
In one embodiment, the processor 21 is also configured to communicate with an array controller 22. In one embodiment, the array controller 22 includes a row driver circuit 24 and a column driver circuit 26 that provide signals to a pixel array 30. The cross section of the array illustrated in
In typical applications, a display frame may be created by asserting the set of column electrodes in accordance with the desired set of actuated pixels in the first row. A row pulse is then applied to the row 1 electrode, actuating the pixels corresponding to the asserted column lines. The asserted set of column electrodes is then changed to correspond to the desired set of actuated pixels in the second row. A pulse is then applied to the row 2 electrode, actuating the appropriate pixels in row 2 in accordance with the asserted column electrodes. The row 1 pixels are unaffected by the row 2 pulse, and remain in the state they were set to during the row 1 pulse. This may be repeated for the entire series of rows in a sequential fashion to produce the frame. Generally, the frames are refreshed and/or updated with new display data by continually repeating this process at some desired number of frames per second. A wide variety of protocols for driving row and column electrodes of pixel arrays to produce display frames are also well known and may be used in conjunction with the present invention.
The details of the structure of interferometric modulators that operate in accordance with the principles set forth above may vary widely. For example,
The MEMS array 111 and its elements 103, 105, 107 form a robust construction. For example, although depicted as narrow columns in
The sealing 123 may be a non-hermetic seal made of a material, such as a conventional epoxy-based adhesive. In other embodiments, the sealing material may be a polyisobutylene (sometimes called butyl rubber, and other times PIB), o-rings, polyurethane, thin film metal weld, liquid spin-on glass, solder, polymers, or plastics, among other types of seals that may have a range of permeability of water vapor of about 0.2-4.7 g mm/m2 kPa day. In still other embodiments, the sealing 123 may be a hermetic seal.
In some embodiments, the packaged MEMS device 100 includes a desiccant (not shown) configured to reduce moisture within the cavity 124. The skilled artisan will appreciate that a desiccant may not be necessary for a hermetically sealed package, but may be desirable to control moisture resident within the package. In one embodiment, the desiccant is positioned between the MEMS array 111 and the back-plate 121. Desiccants may be used for packages that have either hermetic or non-hermetic seals. In packages having a hermetic seal, desiccants are typically used to control moisture resident within the interior of the package. In packages having a non-hermetic seal, a desiccant may be used to control moisture moving into the package from the environment. Generally, any substance that can trap moisture while not interfering with the optical properties of the interferometric modulator array may be used as the desiccant. Suitable desiccant materials include, but are not limited to, zeolites, molecular sieves, surface adsorbents, bulk adsorbents, and chemical reactants.
The desiccant may be in different forms, shapes, and sizes. In addition to being in solid form, the desiccant may alternatively be in powder form. These powders may be inserted directly into the package or they may be mixed with an adhesive for application. In an alternative embodiment, the desiccant may be formed into different shapes, such as cylinders or sheets, before being applied inside the package.
The skilled artisan will understand that the desiccant can be applied in different ways. In one embodiment, the desiccant is deposited as part of the MEMS array 111. In another embodiment, the desiccant is applied inside the package 100 as a spray or a dip coat.
The substrate 101 may be a semi-transparent or transparent substance capable of having thin film, MEMS devices built upon it. Such transparent substances include, but are not limited to, glass, plastic, and transparent polymers. The MEMS array 111 may comprise membrane modulators or modulators of the separable type. The skilled artisan will appreciate that the back-plate 121 may be formed of any suitable material, such as glass, metal, foil, polymer, plastic, ceramic, or semiconductor materials (e.g., silicon).
The packaging process may be accomplished in a vacuum, pressure between a vacuum up to and including ambient pressure, or pressure higher than ambient pressure. The packaging process may also be accomplished in an environment of varied and controlled high or low pressure during the sealing process. There may be advantages to packaging the MEMS array 111 in a completely dry environment, but it is not necessary. Similarly, the packaging environment may be of an inert gas at ambient conditions. Packaging at ambient conditions allows for a lower cost process and more potential for versatility in equipment choice because the device may be transported through ambient conditions without affecting the operation of the device.
Generally, it is desirable to minimize the permeation of water vapor into the package structure and thus control the environment inside the MEMS device 100 and hermetically seal it to ensure that the environment remains constant. When the humidity within the package exceeds a level beyond which surface tension from the moisture becomes higher than the restoration force of a movable element (not shown) in the interferometric modulator 10, the movable element may become permanently stuck to the surface. If the humidity level is too low, the moisture charges up to the same polarity as the movable element when the element comes into contact with the coated surface.
As noted above, a desiccant may be used to control moisture resident within the MEMS device 100. However, the need for a desiccant can be reduced or eliminated with the implementation of a hermetic seal to prevent moisture from traveling from the atmosphere into the interior of the MEMS device 100.
The continued reduction in display device dimensions restricts available methods to manage the environment within the MEMS device 100 because there is less area to place a desiccant within the MEMS device 100. The elimination of the need for a desiccant also allows the MEMS device 100 to be thinner, which is desirable in some embodiments. Typically, in packages containing desiccants, the lifetime expectation of the packaged device may depend on the lifetime of the desiccant. When the desiccant is fully consumed, the interferometric modulator device may fail as sufficient moisture enters the package structure and damages the interferometric modulator array.
It is preferable that the back-plate 121 is assembled to the MEMS device 100 with the gap 124 between the MEMS array 111 and the back-plate 121. However, no-gap constructions (not illustrated) are also possible. The gap 124 can provide some protection against damaging of the MEMS array 111 by an external force applied on the back-plate 121. As illustrated in
Although the gap 124 protects the MEMS device 100 as discussed, it is not always desirable to have a large gap because of the resulting increase in the overall thickness of the MEMS device 100. Further, in MEMS display devices having a large display area, forming a gap 124 between the MEMS array 111 and the back-plate 121 may not effectively protect the MEMS array 111 from being damaged. Referring to
In the embodiment illustrated in
Moreover, in the curved construction of the back-plate 121 a, the depth of the gap 124 is greater in the central area than in the other areas of the back plate. Accordingly, even in a large display, an external force applied onto the central area 126 would not necessarily be more easily transferred to the MEMS array 111 than forces applied onto the other areas 130. Thus, the area of the MEMS array 111 corresponding to the central area 126 of the back-plate 121 a would be better protected from being damaged by external forces or pressure than in the case of the flat back-plate 121 embodiment of
A perspective view of the curved back-plate 121 a is showing in
In embodiments of the invention, the back-plate 121 a is curved such that the radius of the curvature (R) may be constant or vary over the curvature of the back-plate 121 a. In another embodiment, the curved back-plate 121 a may include a flat section. The radius of the curvature (R) is, for example, from about 50 mm to about 5000 mm, whether it varies or is a constant. Preferably, the radius of the curvature is selected from about 100 mm to about 700 mm. The thickness of the back-plate 121 a is from about 0.1 mm to about 5.0 mm although not limited thereto. Preferably, the thickness is from about 0.4 mm to about 1.5 mm. One of ordinary skill in the art will be able to adjust appropriate thicknesses within the described ranges of thickness in consideration of the characteristics of the materials for use in the back-plate 121 a.
The curved back-plate 121 a can be made of a variety of materials. For example, the materials for the back-plate 121 a can be steel alloys, including stainless steel alloys, metals, metal alloys, glass, polymers, oxides of metallic or semiconductor materials, ceramics, etc. Preferably, the materials are chosen from those having a thermal expansion coefficient which matches that of the substrate 101 upon which the MEMS array 111 is fabricated. Examples of such a material include KOVAR® alloy, which is an iron alloy containing Ni and Co as principal alloying elements.
The curved back-plate 121 a can be produced by a variety of methods. In one embodiment, for example, a substantially flat sheet is subject to warping or stress so as to produce the curved back-plate 121 a. The substantially flat sheet may be subject to sheet forming or drawing. In another embodiment illustrated in
In some embodiments, forming the back-plate 121 a may be produced in the assembly process of the MEMS device 100. In one embodiment, a substrate 101, a flat panel 136 and a thermally curable material for the perimeter sealing 123 are configured as illustrated in
In other embodiments, the back-plate 121 a may be formed into a bowed configuration by use of a substantially flat panel that has a single thermal expansion coefficient as opposed to the flat panel 136 having two or more layers with different thermal expansion coefficients. The single thermal expansion coefficient of the back-plate material may be different from that of the substrate 101. Preferably, the thermal expansion coefficient of the back-plate material is smaller than that of the substrate 101. As with the embodiment described previously, the intermediate configuration in the assembly process is as illustrated in
In still another embodiment, an intermediate device in the assembly process is configured as illustrated in
The back-plate 121 b of
In the embodiment of
In some embodiments (not illustrated,) the thickness of the back-plate 121 b may change linearly or stepwise. In other embodiments (not illustrated,) the back-plate thickness may vary along the other edge 135, where the thickness may change gradually or stepwise. In still other embodiments (not illustrated,) the interior surface 129 is bulged toward the MEMS array 111 while the exterior surface 130 remains substantially flat. Still in another embodiment (not illustrated,) both of the interior surface 129 and exterior surface 130 are curved away from each other. In one of such embodiment, the maximum distance between the interior and exterior surfaces is in the center of the back-plate. In a further embodiment, both the interior surface 129 and exterior surface 130 are curved like the embodiment of
In some embodiments, the back-plate 121 b of
In the embodiment of
In the back-plates 121 c and 121 d (
In the back-plate 121 e illustrated in
In the back-plate 121 f illustrated in
In another embodiment, the protrusions or spacers 131 are formed or located such that they contact only predetermined portions of the MEMS array 111 when external force is applied to the back-plate. In this embodiment, the external force is transferred substantially only to the predetermined portions of the MEMS array. Preferably, the predetermined portions are the portions of the MEMS array that are not likely affecting the operation of the MEMS device even if damaged. Additionally or alternatively, the predetermined portions are portions of the MEMS array that are less susceptible to damage by external forces. In still another embodiment, the protrusions or spacers 131 may be formed on only certain areas, for example, the central area of the back-plate 121 f. As discussed, the protrusions or spacers 131 provide one means for preventing the back-plate from directly contacting the MEMS array 111. Also, the protrusions or spacers 131 provide one means for distributing forces applied to the back-plate and/or one means for minimizing or preventing damage to the MEMS array.
The reinforcing structures and/or spacers of the back-plate 121 c, 121 d, 121 e, 121 f, 121 g or 121 h may be formed on an intermediate structure for the back-plate. In one embodiment, for example, the intermediate structure comprises a back-plate which does not have any reinforcing structures formed thereon. Attaching reinforcing structures on a surface of the intermediate back-plate 121 a produces the back-plate 121 c, 121 d, 121 e, 121 f or 121 g. In the curved back-plate constructions, the reinforcing structures may be attached onto a substantially flat panel or sheet prior to bending it or after bending. Alternatively, the reinforcing structures and/or spacers can be produced as part of the manufacturing process of the back-plate 121 c, 121 d, 121 e, 121 f, 121 g or 121 h. In an embodiment, for example, a blank is machined to remove some material in some regions while leaving the material elsewhere, thereby producing the back-plates with the reinforcing structures and/or spacers. In still another embodiment, for example, the back-plate with the reinforcing structures and/or spacers is produced by molding or forming. One of ordinary skill in the art will appreciate appropriate methods available for producing the back-plate, reinforcing structures and/or spacers. The methods of producing reinforcing structures and spacers can be used in the methods of producing the lip protrusion 125, and vice versa.
The materials for use in the foregoing reinforcing structures are, for example, polymers, glass, ceramics, metals, oxides of metallic or semiconductor materials, spin-on-glasses, frits, photo-patternable polymers, polymers containing desiccants, etc. The reinforcing structures may be made of the same material for the back-plate 121, 121 a or 121 b, on which the reinforcing structures are formed. The materials for the protrusions are, for example, polymers, glass, ceramics, metals, oxides of metallic or semiconductor materials, spin-on-glasses, frits, photo-patternable polymers, polymers containing desiccants, etc. Preferably, the reinforcing structures are made of the same material for the reinforcing structures 127 a, 127 b and/or 121 c on which the protrusions are formed.
The reinforcing structures and the protrusions may be formed of one or more desiccants solely or in combination with one or more structural materials such as polymers. Forming the reinforcing structures with desiccant will eliminate or at least reduce the need for an extra space and/or a container for a desiccant within the package of the display, which requires humidity control to insure the proper operation of the MEMS mechanisms. Any of the desiccants described above can be used. Preferably, applicable desiccants are, for example, molecular sieves including aluminum complexes, calcium oxides, zeolites and carbon nano-tubes. One of ordinary skill in the art will appreciate the kinds and amounts of structural materials in case desiccants are selected for use in the reinforcing structures and/or protrusions.
The embodiment of
Proceeding to step S2705, the sacrificial layer is patterned and selectively etched away to form recesses (not shown) using photolithographic techniques. The recesses formed in the sacrificial layer are used as a negative to make the reinforcing structures 127 d and 127 e therein. The recesses are formed in the depth and shape sufficient to create the reinforcing structures 127 d and 127 e. Then, in step S2707, the recesses are filled with a material to form the reinforcing structures 127 d and 127 e. The reinforcing structures 127 d and 127 e may be any type of materials including, not limited to, semiconductors, metals, alloys, polymers or plastics and composite materials. Continuing to the step S2709, then a thin film back-plate 121 i is deposited over the entire structure including the substrate 101, the sacrificial layer and the recesses filled with the material for the reinforcing structures 127 d and 127 e. In some embodiments, the thin film back-plate 121 i may be any type of material that is impermeable or hydrophobic, including, but not limited to, nickel, aluminum, and other types of metals and foils. The thin film may also be formed of an insulator, including, but not limited to, silicon dioxide, aluminum oxide, or nitrides. Alternatively, the thin film may be formed of a permeable material. Suitable permeable materials include polymers, such as, for example, PMMA, epoxies, and organic or inorganic spin-on glass (SOG) type materials. In some embodiments, the thin film back-plate 121 i and the reinforcing structures 127 d and 127 e may be formed of the same material.
Next at step S2711, the thin film back-plate 121 i is patterned and etched to form at least one opening through the back-plate 121 i. The thin film back-plate 121 i may be further patterned and processed to allow electrical connections and contacts to the MEMS array 111 and other parts of the device. Continuing to step S2713, the sacrificial layer located between the MEMS array 111 and the back-plate 121 i and/or the reinforcing structures 127 d and 127 e is selectively removed. The gap 124 is formed where the sacrificial layer is removed. An etchant is supplied via the opening formed in the thin film back-plate 121 i. As the etchant contacts and reacts with the exposed area of the sacrificial layer, the sacrificial layer material is selectively etched away. For example, to remove a sacrificial layer of molybdenum (Mo), silicon (Si), tungsten (W), or titanium (Ti), xenon diflouride (XeF2) may be introduced into the interior of the MEMS device through the at least one opening. After the sacrificial layer is removed and the gap 124 is created, the opening in the thin film back-plate 121 i is sealed. One of ordinary skill in the art in the field of semiconductor processing or photolithography will appreciate the process described herein and determine appropriate parameters to produce the back-plate 121 i with the reinforcing structures 127 d and 127 e.
In the foregoing embodiments, particularly those of
It is to be understood that persons of skill in the appropriate arts may modify the invention here described while still achieving the favorable results of this invention. Accordingly, the foregoing description is to be understood as being a broad, teaching disclosure directed to persons of skill in the appropriate arts, and not as limiting upon the invention.
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|U.S. Classification||361/679.01, 257/678|
|International Classification||H01L23/10, H05K5/00|
|Cooperative Classification||G02B26/001, B81C2203/0163, B81B3/007, B81B7/0058|
|European Classification||G02B26/00C, B81B3/00S2B|
|Feb 17, 2009||CC||Certificate of correction|
|Oct 30, 2009||AS||Assignment|
Owner name: QUALCOMM MEMS TECHNOLOGIES, INC., CALIFORNIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:IDC,LLC;REEL/FRAME:023449/0614
Effective date: 20090925
|Sep 23, 2011||FPAY||Fee payment|
Year of fee payment: 4