|Publication number||US7408260 B2|
|Application number||US 11/487,263|
|Publication date||Aug 5, 2008|
|Filing date||Jul 14, 2006|
|Priority date||Oct 31, 1995|
|Also published as||US6284563, US6465878, US6847101, US6847107, US7112879, US7872344, US8338925, US20010007375, US20020100961, US20020195685, US20040227225, US20060237836, US20060261476, US20110095441|
|Publication number||11487263, 487263, US 7408260 B2, US 7408260B2, US-B2-7408260, US7408260 B2, US7408260B2|
|Inventors||Joseph Fjelstad, Konstantine Karavakis|
|Original Assignee||Tessera, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (106), Non-Patent Citations (1), Referenced by (45), Classifications (89), Legal Events (3)|
|External Links: USPTO, USPTO Assignment, Espacenet|
The present application is a continuation of U.S. patent application Ser. No. 11/474,199, filed Jun. 23, 2006, which is a continuation of U.S. patent application Ser. No. 10/873,883, filed Jun. 22, 2004, now allowed, which is a continuation of U.S. patent application Ser. No. 10/219,902 filed Aug. 15, 2002 which is a continuation of U.S. patent application Ser. No. 10/107,094 filed Mar. 26, 2002, which is a continuation of U.S. patent application Ser. No. 09/777,782, filed Feb. 6, 2001, which is a continuation of U.S. patent application Ser. No. 09/071,412, filed May 1, 1998, which is a continuation-in-part of U.S. patent application Ser. No. 08/739,303, filed Oct. 29, 1996, now U.S. Pat. No. 6,211,572, which, in turn, claims benefit of U.S. Provisional Application No. 60/007,128, filed Oct. 31, 1995, the disclosures of which are hereby incorporated by reference herein.
The present invention relates to semiconductor chip packaging. More particularly, the present invention relates to an improved compliant semiconductor package structure and methods for making the same.
Complex microelectronic devices such as modern semiconductor chips require numerous connections to other electronic components. For example, a complex microprocessor chip may require many hundreds of connections to external devices.
Semiconductor chips commonly have been connected to electrical traces on mounting substrates by one of three methods: wire bonding, tape automated bonding, and flip-chip bonding. In wire bonding, the chip is positioned on a substrate with a bottom or back surface of the chip abutting the substrate and with the contact-bearing front or top surface of the chip facing upwardly, away from the substrate. Individual gold or aluminum wires are connected between the contacts on the chip and pads on the substrate. In tape automated bonding a flexible dielectric tape with a prefabricated array of leads thereon is positioned over the chip and substrate and the individual leads are bonded to the contacts on the chip and to pads on the substrate. In both wire bonding and conventional tape automated bonding, the pads on the substrate are arranged outside of the area covered by the chip, so that the wires or leads fan out from the chip to the surrounding pads. The area covered by the subassembly as a whole is considerably larger than the area covered by the chip. This makes the entire assembly substantially larger than it otherwise would be. Because the speed with which a microelectronic assembly can operate is inversely related to its size, this presents a serious drawback. Moreover, the wire bonding and tape automated bonding approaches are generally most workable with chips having contacts disposed in rows extending along the periphery of the chip. They generally do not lend themselves to use with chips having contacts disposed in a so-called area array, i.e., a grid-like pattern covering all or a substantial portion of the chip front surface.
In the flip-chip mounting technique, the contact-bearing surface of the chip faces towards the substrate. Each contact on the chip is joined by a solder bond to the corresponding pad on the substrate, as by positioning solder balls on the substrate or chip, juxtaposing the chip with the substrate in the front-face-down orientation and momentarily melting or reflowing the solder. The flip-chip technique yields a compact assembly, which occupies an area of the substrate no larger than the area of the chip itself. However, flip-chip assemblies suffer from significant problems with thermal stress. The solder bonds between the chip contacts and substrate are substantially rigid. Changes in the size of the chip and of the substrate due to thermal expansion and contraction in service create substantial stresses in these rigid bonds, which in turn can lead to fatigue failure of the bonds. Moreover, it is difficult to test the chip before attaching it to the substrate, and hence difficult to maintain the required outgoing quality level in the finished assembly, particularly where the assembly includes numerous chips.
Numerous attempts have been made to solve the foregoing problem. Useful solutions are disclosed in commonly assigned U.S. Pat. Nos. 5,148,265 and 5,148,266. Preferred embodiments of the structures disclosed in these patents incorporate flexible, sheet-like structures referred to as “interposers” or “chip carriers”. The preferred chip carriers have a plurality of terminals disposed on a flexible, sheet-like top layer. In use, the interposer is disposed on the front or contact-bearing surface of the chip with the terminals facing upwardly, away from the chip. The terminals are then connected to the contacts of the chip. Most preferably, this connection is made by bonding prefabricated leads on the interposer to the chip contacts, using a tool engaged with the lead. The completed assembly is then connected to a substrate, as by bonding the terminals of the chip carrier to the substrate. Because the leads and the dielectric layer of the chip carrier are flexible, the terminals on the chip carrier can move relative to the contacts on the chip without imposing significant stresses on the bonds between the leads and the chip, or on the bonds between the terminals and the substrate. Thus, the assembly can compensate for thermal effects. Moreover, the assembly most preferably includes a compliant layer disposed between the terminals on the chip carrier and the face of the chip itself as, for example, an elastomeric layer incorporated in the chip carrier and disposed between the dielectric layer of the chip carrier and the chip. Such a compliant structure permits displacement of the individual terminals independently towards the chip. This permits effective engagement between the subassembly and a test fixture. Thus, a test fixture incorporating numerous electrical contacts can be engaged with all of the terminals in the subassembly despite minor variations in the height of the terminals. The subassembly can be tested before it is bonded to a substrate so as to provide a tested, known, good part to the substrate assembly operation. This in turn provides very substantial economic and quality advantages.
Commonly owned U.S. Pat. No. 5,455,390 describes a further improvement. Components according to preferred embodiments of the '390 patent use a flexible, dielectric top sheet having top and bottom surfaces. A plurality of terminals is mounted on the top sheet. A support layer is disposed underneath the top sheet, the support layer having a bottom surface remote from the top sheet. A plurality of electrically conductive, elongated leads are connected to the terminals on the top sheet and extend generally side by side downwardly from the terminals through the support layer. Each lead has a lower end at the bottom surface of the support layer. The lower ends of the leads have conductive bonding materials as, for example, eutectic bonding metals. The support layer surrounds and supports the leads.
Components of this type can be connected to microelectronic elements such as semiconductor chips or wafers by juxtaposing the bottom surface of the support layer with the contact-bearing surface of the chip so as to bring the lower ends of the leads into engagement with the contacts on the chip, and then subjecting the assembly to elevated temperature and pressure conditions. All of the lower ends of the leads bond to the contacts on the chip substantially simultaneously. The bonded leads connect the terminals of the top sheet with the contacts on the chip. The support layer desirably is either formed from a relatively low-modulus, compliant material, or else is removed and replaced after the lead bonding step with such a compliant material. In the finished assembly, the terminals desirably are movable with respect to the chip to permit testing and to compensate for thermal effects. However, the components and methods of the '390 patent provide further advantages, including the ability to make all of the bonds to the chip or other component in a single lamination-like process step. The components and methods of the '390 application are especially advantageous when used with chips or other microelectronic elements having contacts disposed in an area array.
Despite the positive results of the aforementioned commonly owned inventions, still further improvements would be desirable.
The present invention contemplates a method of creating a compliant semiconductor chip package assembly and the semiconductor chip package assembly created therefrom.
In a fabrication process according to one aspect of the invention, a first dielectric protective layer is provided on a contact bearing surface of a semiconductor chip. The semiconductor chip has a central region bounded by the chip contacts and a set of apertures. The apertures in the dielectric protective layer are provided such that the chip contacts are exposed. This first dielectric protective layer may actually be the silicon dioxide passivation layer of the semiconductor chip.
Second, a compliant layer, preferably consisting of silicone, flexibilized epoxy, a thermosetting polymer or polyimide is provided atop the first dielectric protective layer is provided within the central region. The compliant layer is formed such that it has a substantially flat top surface and edges that gradually slope down to the top surface of the first dielectric protective layer. The sloping edges of the compliant layer may be manufactured to have a first transition region near the top surface of the compliant layer and a second transition region near the bottom surface of the compliant layer such that both the first transition region and the second transition region have a radius of curvature.
Finally, bond ribbons are selectively formed atop both the first dielectric protective layer and the compliant layer such that each bond ribbon electrically connects each chip contact to a respective terminal position on the compliant layer. The bond ribbons may be selectively formed using a variety of techniques, such as by electroplating or by electroless plating followed by selective etching. The terminal positions are the conductive elements that connect the finished assembly to a separate substrate, e.g. a printed circuit board.
The method described above may further include the step of providing for a second dielectric protective layer atop the bond ribbons and the compliant layer after the bond ribbon electroplating step is performed. This optional second dielectric protective layer is fabricated with a set of apertures that expose the underlying terminal positions on the compliant layer.
Additionally, the method described above may further include the optional step of providing for an encapsulant layer above the bond ribbons. If this optional step is performed, it is performed after the step of selectively electroplating the bond ribbons. Like the first dielectric layer, the encapsulant layer is fabricated with a set of apertures so that the terminal positions are exposed. The encapsulant layer material consists preferably of either a curable liquid, such as silicone, a flexibilized epoxy or a gel. This optional step may also be performed just prior to the optional step of providing for a second dielectric protective layer.
In another aspect of the invention, a method of making a compliant microelectronic assembly includes providing a microelectronic element, such as a semiconductor chip, having a first surface and a plurality of contacts disposed on the first surface thereof and forming a compliant layer over the first surface of the microelectronic element. The compliant layer typically has a bottom surface facing toward the first surface of the microelectronic element, a top surface facing upwardly away from the microelectronic element and one or more edge surfaces extending between the top and bottom surfaces. The edge surfaces of the compliant layer are preferably sloping surfaces that extend in both vertical and horizontal directions. At least some of the sloping edge surfaces preferably have first transition regions near the top surface of the compliant layer and second transition regions near the bottom surface of the compliant layer, the first and second transition regions having respective radii of curvature.
In certain embodiments, before the compliant layer is formed, a first dielectric protective layer, such as a layer including a silicon dioxide passivation layer, may be provided on the first surface of the microelectronic element. The first dielectric protective layer may have a plurality of apertures therein so that the contacts are accessible therethrough. The compliant layer described above can then be provided over the dielectric protective layer.
Bond ribbons may then be selectively formed over the compliant layer. The bond ribbons preferably extend over both the top surface of the compliant layer and one or more edge surfaces of the compliant layer. The bond ribbons electrically connect the contacts to conductive terminals overlying the top surface of the compliant layer. Before the bond ribbons are formed, a barrier metal layer may be deposited over the contacts so as to prevent undesired chemical reactions between the contacts and the bond ribbons. In one embodiment, the bond ribbons are formed by selectively electroplating the bond ribbons atop the first dielectric protective layer and the compliant layer. After the bond ribbons have been formed, a dielectric cover layer may be formed over the compliant layer and the bond ribbons. The dielectric cover layer may have a plurality of apertures therein so that the terminals are accessible therethrough. In other embodiments, an encapsulant layer may be provided atop the exposed surfaces of the bond ribbons. The encapsulant layer is generally a material selected from the group consisting of silicone, flexibilized epoxy, thermoplastic and gel. Next, a second dielectric protective layer or cover layer may be provided over the encapsulant layer. The second dielectric protective layer also preferably has a plurality of apertures therein so that the terminals are accessible therethrough.
The compliant layer may include one or more apertures therein so that the contacts are accessible through the apertures. The one or more apertures may include one or more groups of apertures encompassing a plurality of the contacts. The edge surfaces of the compliant layer may include one or more aperture edge surfaces bounding the apertures, with at least some of the bond ribbons being formed over the aperture edge surfaces. The compliant layer may be formed by engaging the microelectronic element with a mold so that one or more projections on the mold contact the first surface of the microelectronic element. A flowable composition may be introduced around the projections and the flowable composition set to provide a compliant layer. The microelectronic layer may then be separated from the mold. The one or more apertures are typically formed in the space occupied by the projections.
In certain embodiments, the contacts on the microelectronic element are disposed in an area array, and the one or more apertures in the compliant layer include a plurality of apertures disposed in an array corresponding to the array of contacts so that each contact is encompassed in a respective aperture. In other embodiments, the contacts on the microelectronic element may be disposed in a first region of the first surface, with the compliant layer overlying a second region of the first surface, and one or more edge surfaces including one or more border edge surfaces extending along one or more borders between the first and second regions. In still other embodiments, the contacts on the microelectronic element are disposed in a central region of the first surface and the compliant layer overlies a peripheral region of the first surface.
In another embodiment, a method of making a compliant microelectronic package includes providing a supporting element having an upwardly-facing top surface and juxtaposing a microelectronic element including a first surface having a plurality of contacts thereon with the supporting element so that the first surface of the microelectronic element is disposed alongside the top surface of the supporting element. The first surface of the microelectronic element and the top surface of the supporting element may be substantially coplanar after the juxtaposing step.
A compliant layer may then be provided over the top surface of the supporting element, the compliant layer having a top surface remote from the top surface of the supporting element, a bottom surface and an edge surface extending between the top surface and the bottom surface. In certain embodiments, a portion of the compliant layer extends over the first surface of the microelectronic element, with one or more edge surfaces of the compliant layer overlying the first surface of the microelectronic element. Bond ribbons may then be selectively formed atop the compliant layer, the bond ribbons electrically interconnecting the contacts of the microelectronic element with conductive terminals overlying the top surface of the compliant layer.
The supporting structure described above may have a central aperture therein so that the microelectronic element may be placed in the central aperture after being juxtaposed with the supporting element. After the juxtaposing step, the first surface of the microelectronic element and the top surface of the supporting structure are preferably substantially coplanar.
In certain embodiments, the compliant chip assembly may include a ground plane electrically interconnected with at least one of the bond ribbons. The ground plane may include a plurality of apertures therein so that the terminals are accessible through the apertures.
The methods described above can be applied simultaneously to a multiplicity of undiced semiconductor chips on a wafer to form a corresponding multiplicity of compliant semiconductor chip packages. After the bond ribbons have been formed on the packages, individual packages may be severed or diced from the wafer to provide separate and distinct chip packages. The methods may also be applied to a multiplicity of adjacent semiconductor chips arranged in an array to form a corresponding multiplicity of compliant semiconductor chip packages, whereby the packages are diced after the bond ribbons have been formed.
A further aspect of the present invention includes the structure of a unique compliant semiconductor chip package having fan-in type leads. The compliant semiconductor chip package is comprised of (1) a semiconductor chip having a plurality of peripheral bonding pads on a face surface thereof and a central region bound by the peripheral bonding pads; (2) a first dielectric protective layer having a first surface, a second surface and apertures, wherein the first surface of the first dielectric layer is joined to the face surface of the semiconductor chip and the peripheral bonding pads are exposed through the apertures; (3) a compliant layer having a top surface and a bottom surface, wherein the bottom surface of the compliant layer is joined to the second surface of the first dielectric layer within the central region of the semiconductor chip package; and (4) a plurality of electrically conductive bond ribbons, each bond ribbon having a first end that electrically couples to a respective peripheral bonding pad of the semiconductor chip and a second end that joins to the top surface of the compliant layer to form a package terminal.
The package terminals of the completed package are configured in an array that has an area smaller than the area bound by the peripheral bonding pads on the face of the semiconductor chip. In other words, the package has fan-in leads that permit minimization of the overall package size.
For increased reliability, the compliant layer has sloped peripheral edges so that the overlying bond ribbons are curved rather than kinked.
The compliant semiconductor chip package may also have a compliant layer characterized by an array of bumped protrusions. The bumped protrusions support the overlying conductive terminal position ends of the bond ribbons and function as conductive balls that join to a substrate thus forming a ball grid array type interconnection. Alternate to the bumped protrusions, the compliant layer may have an array of concavities that are useful for placement of solder balls into each concavity. This arrangement is also useful for a ball grid array type interconnect.
The foregoing and other objects and advantages of the present invention will be better understood from the following Detailed Description of a Preferred Embodiment, taken together with the attached figures.
In the next step, as illustrated in
A plating seed layer 150 is then deposited atop the aforementioned assembly, as shown in
As shown in
Typically, a solder ball or a solid-core solder ball will be used to create this electrical connection. The dielectric layer 180 is thus used as a solder mask to ensure that the solder does not electrically short between adjacent bond ribbons 170. Oxide layers and other surface contaminates typically build up on the surface of many types of metal (copper, nickel, etc.). Although not shown in
The configuration of the above described chip package allows the package to mechanically decouple the chip 100 from an attached circuitized substrate (not shown). Typically, solder connections between the chip and the circuitized substrate are woefully inadequate to compensate for the thermal mismatch problem during temperature cycling of the chip. The combination of the compliant layer 140 and the flexible bond ribbons plated thereon allow the package to compensate for much of the TCE mismatch problem by giving limited movement of the terminals in the X, Y and Z directions with respect to the chip contacts 110 thereby minimizing the stress placed on the solder connections themselves, without imposing substantial forces on the bond between the ribbons 170 and the chip contacts 110. Further, because the compliant layer 140 is compressible, it also has the effect of compensating for any terminals 175 which are not perfectly planar with respect to its adjacent terminals when the terminals 175 are abutted against and coupled to the circuitized substrate. However, the top surface 147 of the compliant layer 140 should be made as flat and planar as possible so that the terminals 175 all lie in or near the same plane in order to minimize the amount of pressure needed to be placed on the bottom surface 125 of the chip 100 to ensure that all of the terminals/solder balls are electrically connected to a circuitized substrate.
As illustrated in
In the alternate embodiment shown in
In another alternate embodiment, a conductive material such as beryllium copper, or a super plastic or shape memory alloy (such as Nitinol), is sputtered or otherwise deposited across the entire exposed surface of the chip/passivation layer/compliant layer (100/130/140) combination, shown in
Next, as illustrated in
In the next step, illustrated in
As illustrated in
In still another embodiment, illustrated in
The method steps described above are then utilized to provide a final compliant chip package, as shown in
In a further embodiment, illustrated in
In still another embodiment, illustrated in
In another embodiment, illustrated in
These and other variations and combinations of the features described above may be utilized without departing from the present invention as defined by the claims. For example, the low modulus encapsulant material shown in
As these and other variations and combinations of the features discussed above can be utilized without departing from the present invention as defined by the claims, the foregoing description of the preferred embodiments should be taken by way of illustration rather than by way of limitation of the invention set forth in the claims.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US3680206 *||Jun 23, 1969||Aug 1, 1972||Ferranti Ltd||Assemblies of semiconductor devices having mounting pillars as circuit connections|
|US4001870||Nov 30, 1973||Jan 4, 1977||Hitachi, Ltd.||Isolating protective film for semiconductor devices and method for making the same|
|US4021838||Oct 20, 1975||May 3, 1977||International Business Machines Corporation||Semiconductor integrated circuit devices|
|US4190855||Aug 10, 1977||Feb 26, 1980||Sharp Kabushiki Kaisha||Installation of a semiconductor chip on a glass substrate|
|US4300153||Sep 25, 1980||Nov 10, 1981||Sharp Kabushiki Kaisha||Flat shaped semiconductor encapsulation|
|US4365264||May 19, 1981||Dec 21, 1982||Hitachi, Ltd.||Semiconductor device with high density low temperature deposited Siw Nx Hy Oz passivating layer|
|US4381602||Dec 29, 1980||May 3, 1983||Honeywell Information Systems Inc.||Method of mounting an I.C. chip on a substrate|
|US4396936||Dec 29, 1980||Aug 2, 1983||Honeywell Information Systems, Inc.||Integrated circuit chip package with improved cooling means|
|US4618878||Jun 15, 1984||Oct 21, 1986||Kabushiki Kaisha Toshiba||Semiconductor device having a multilayer wiring structure using a polyimide resin|
|US4642889||Apr 29, 1985||Feb 17, 1987||Amp Incorporated||Compliant interconnection and method therefor|
|US4671849||May 6, 1985||Jun 9, 1987||International Business Machines Corporation||Method for control of etch profile|
|US4716049||Jun 30, 1986||Dec 29, 1987||Hughes Aircraft Company||Compressive pedestal for microminiature connections|
|US4783594||Nov 20, 1987||Nov 8, 1988||Santa Barbara Research Center||Reticular detector array|
|US4813129 *||Jun 19, 1987||Mar 21, 1989||Hewlett-Packard Company||Interconnect structure for PC boards and integrated circuits|
|US4885126||Mar 18, 1988||Dec 5, 1989||Polonio John D||Interconnection mechanisms for electronic components|
|US4902606||Aug 1, 1988||Feb 20, 1990||Hughes Aircraft Company||Compressive pedestal for microminiature connections|
|US4924353||Aug 1, 1988||May 8, 1990||Hughes Aircraft Company||Connector system for coupling to an integrated circuit chip|
|US4955132||Nov 15, 1988||Sep 11, 1990||Sharp Kabushiki Kaisha||Method for mounting a semiconductor chip|
|US4962985||Oct 2, 1989||Oct 16, 1990||At&T Bell Laboratories||Protective coatings for optical devices comprising Langmuir-Blodgett films|
|US4977441||Apr 30, 1990||Dec 11, 1990||Hitachi, Ltd.||Semiconductor device and tape carrier|
|US5001542||Nov 30, 1989||Mar 19, 1991||Hitachi Chemical Company||Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips|
|US5070297||Jun 4, 1990||Dec 3, 1991||Texas Instruments Incorporated||Full wafer integrated circuit testing device|
|US5072520||Oct 23, 1990||Dec 17, 1991||Rogers Corporation||Method of manufacturing an interconnect device having coplanar contact bumps|
|US5082811||Feb 28, 1990||Jan 21, 1992||E. I. Du Pont De Nemours And Company||Ceramic dielectric compositions and method for enhancing dielectric properties|
|US5110388||Feb 8, 1991||May 5, 1992||Lintec Corporation||Method of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tape|
|US5140404||Apr 19, 1991||Aug 18, 1992||Micron Technology, Inc.||Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape|
|US5148265 *||Mar 21, 1991||Sep 15, 1992||Ist Associates, Inc.||Semiconductor chip assemblies with fan-in leads|
|US5148266||Sep 24, 1990||Sep 15, 1992||Ist Associates, Inc.||Semiconductor chip assemblies having interposer and flexible lead|
|US5180311||Jan 22, 1991||Jan 19, 1993||Hughes Aircraft Company||Resilient interconnection bridge|
|US5187020||Nov 5, 1991||Feb 16, 1993||Texas Instruments Incorporated||Compliant contact pad|
|US5194930||Sep 16, 1991||Mar 16, 1993||International Business Machines||Dielectric composition and solder interconnection structure for its use|
|US5203076||Dec 23, 1991||Apr 20, 1993||Motorola, Inc.||Vacuum infiltration of underfill material for flip-chip devices|
|US5225966||Jul 24, 1991||Jul 6, 1993||At&T Bell Laboratories||Conductive adhesive film techniques|
|US5249101||Jul 6, 1992||Sep 28, 1993||International Business Machines Corporation||Chip carrier with protective coating for circuitized surface|
|US5265329||Jun 12, 1991||Nov 30, 1993||Amp Incorporated||Fiber-filled elastomeric connector attachment method and product|
|US5302550 *||Apr 13, 1988||Apr 12, 1994||Mitsubishi Denki Kabushiki Kaisha||Method of bonding a microelectronic device|
|US5310699||Jun 29, 1992||May 10, 1994||Sharp Kabushiki Kaisha||Method of manufacturing a bump electrode|
|US5316788||Jul 26, 1991||May 31, 1994||International Business Machines Corporation||Applying solder to high density substrates|
|US5349240||Oct 26, 1992||Sep 20, 1994||Nippondenso Co., Ltd.||Semiconductor device package having a sealing silicone gel with spherical fillers|
|US5355283||Apr 14, 1993||Oct 11, 1994||Amkor Electronics, Inc.||Ball grid array with via interconnection|
|US5363277||Dec 16, 1992||Nov 8, 1994||Rohm Co., Ltd.||Structure and method for mounting semiconductor device|
|US5371404||Feb 4, 1993||Dec 6, 1994||Motorola, Inc.||Thermally conductive integrated circuit package with radio frequency shielding|
|US5393697||May 6, 1994||Feb 28, 1995||Industrial Technology Research Institute||Composite bump structure and methods of fabrication|
|US5414298||Mar 26, 1993||May 9, 1995||Tessera, Inc.||Semiconductor chip assemblies and components with pressure contact|
|US5430329||May 26, 1994||Jul 4, 1995||Mitsubishi Denki Kabushiki Kaisha||Semiconductor device with bonding pad electrode|
|US5431328||May 6, 1994||Jul 11, 1995||Industrial Technology Research Institute||Composite bump flip chip bonding|
|US5431571||Nov 22, 1993||Jul 11, 1995||W. L. Gore & Associates, Inc.||Electrical conductive polymer matrix|
|US5455390||Feb 1, 1994||Oct 3, 1995||Tessera, Inc.||Microelectronics unit mounting with multiple lead bonding|
|US5477611||Sep 20, 1993||Dec 26, 1995||Tessera, Inc.||Method of forming interface between die and chip carrier|
|US5483106||Jul 29, 1994||Jan 9, 1996||Nippondenso Co., Ltd.||Semiconductor device for sensing strain on a substrate|
|US5489749||Jun 29, 1994||Feb 6, 1996||Tessera, Inc.||Semiconductor connection components and method with releasable lead support|
|US5508228||Feb 14, 1994||Apr 16, 1996||Microelectronics And Computer Technology Corporation||Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same|
|US5525545||Nov 3, 1994||Jun 11, 1996||Tessera, Inc.||Semiconductor chip assemblies and components with pressure contact|
|US5563445||Apr 4, 1994||Oct 8, 1996||Seiko Epson Corporation||Semiconductor device|
|US5604380||Mar 10, 1995||Feb 18, 1997||Mitsubishi Denki Kabushiki Kaisha||Semiconductor device having a multilayer interconnection structure|
|US5656862||May 6, 1993||Aug 12, 1997||International Business Machines Corporation||Solder interconnection structure|
|US5659952 *||Dec 29, 1994||Aug 26, 1997||Tessera, Inc.||Method of fabricating compliant interface for semiconductor chip|
|US5666270||Jul 25, 1994||Sep 9, 1997||Fujitsu Limited||Bump electrode, semiconductor integrated circuit device using the same, multi-chip module having the semiconductor integrated circuit devices and method for producing semicondutcor device having the bump electrode|
|US5679977||Apr 28, 1993||Oct 21, 1997||Tessera, Inc.||Semiconductor chip assemblies, methods of making same and components for same|
|US5682061 *||Jun 5, 1995||Oct 28, 1997||Tessera, Inc.||Component for connecting a semiconductor chip to a substrate|
|US5707902||Jul 26, 1995||Jan 13, 1998||Industrial Technology Research Institute||Composite bump structure and methods of fabrication|
|US5734547||Aug 26, 1996||Mar 31, 1998||Iversen; Arthur H.||Power switchgear|
|US5749997||Dec 27, 1995||May 12, 1998||Industrial Technology Research Institute||Composite bump tape automated bonding method and bonded structure|
|US5766987||Sep 22, 1995||Jun 16, 1998||Tessera, Inc.||Microelectronic encapsulation methods and equipment|
|US5772451||Oct 18, 1995||Jun 30, 1998||Form Factor, Inc.||Sockets for electronic components and methods of connecting to electronic components|
|US5777379||Aug 18, 1995||Jul 7, 1998||Tessera, Inc.||Semiconductor assemblies with reinforced peripheral regions|
|US5789271||Mar 18, 1996||Aug 4, 1998||Micron Technology, Inc.||Method for fabricating microbump interconnect for bare semiconductor dice|
|US5790377||Sep 12, 1996||Aug 4, 1998||Packard Hughes Interconnect Company||Integral copper column with solder bump flip chip|
|US5874781||Nov 1, 1996||Feb 23, 1999||Micron Technology, Inc.||Angularly offset stacked die multichip device and method of manufacture|
|US5874782||Aug 24, 1995||Feb 23, 1999||International Business Machines Corporation||Wafer with elevated contact structures|
|US5885849||Feb 6, 1998||Mar 23, 1999||Tessera, Inc.||Methods of making microelectronic assemblies|
|US5929517 *||Dec 29, 1994||Jul 27, 1999||Tessera, Inc.||Compliant integrated circuit package and method of fabricating the same|
|US5937758||Nov 26, 1997||Aug 17, 1999||Motorola, Inc.||Micro-contact printing stamp|
|US5956235||Feb 12, 1998||Sep 21, 1999||International Business Machines Corporation||Method and apparatus for flexibly connecting electronic devices|
|US6030856||Jun 10, 1997||Feb 29, 2000||Tessera, Inc.||Bondable compliant pads for packaging of a semiconductor chip and method therefor|
|US6043563||Oct 20, 1997||Mar 28, 2000||Formfactor, Inc.||Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals|
|US6084301||Oct 14, 1997||Jul 4, 2000||Industrial Technology Industrial Research||Composite bump structures|
|US6086386||May 22, 1997||Jul 11, 2000||Tessera, Inc.||Flexible connectors for microelectronic elements|
|US6130116||Dec 4, 1997||Oct 10, 2000||Tessera, Inc.||Method of encapsulating a microelectronic assembly utilizing a barrier|
|US6133639||Apr 24, 1997||Oct 17, 2000||Tessera, Inc.||Compliant interface for semiconductor chip and method therefor|
|US6147401||Feb 8, 2000||Nov 14, 2000||Tessera, Inc.||Compliant multichip package|
|US6177636||Jun 30, 1997||Jan 23, 2001||Tessera, Inc.||Connection components with posts|
|US6184576||Sep 21, 1998||Feb 6, 2001||Advantest Corp.||Packaging and interconnection of contact structure|
|US6197613||Mar 23, 1999||Mar 6, 2001||Industrial Technology Research Institute||Wafer level packaging method and devices formed|
|US6211572||Oct 29, 1996||Apr 3, 2001||Tessera, Inc.||Semiconductor chip package with fan-in leads|
|US6249051||Apr 24, 1995||Jun 19, 2001||Industrial Technology Research Institute||Composite bump flip chip bonding|
|US6255738||Sep 30, 1997||Jul 3, 2001||Tessera, Inc.||Encapsulant for microelectronic devices|
|US6277669||Sep 15, 1999||Aug 21, 2001||Industrial Technology Research Institute||Wafer level packaging method and packages formed|
|US6284563||May 1, 1998||Sep 4, 2001||Tessera, Inc.||Method of making compliant microelectronic assemblies|
|US6313402||Oct 29, 1997||Nov 6, 2001||Packard Hughes Interconnect Company||Stress relief bend useful in an integrated circuit redistribution patch|
|US6326678||Sep 3, 1993||Dec 4, 2001||Asat, Limited||Molded plastic package with heat sink and enhanced electrical performance|
|US6337445||Mar 12, 1999||Jan 8, 2002||Texas Instruments Incorporated||Composite connection structure and method of manufacturing|
|US6359335||Nov 13, 2000||Mar 19, 2002||Tessera, Inc.||Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures|
|US6373141||Aug 16, 1999||Apr 16, 2002||Tessera, Inc.||Bondable compliant pads for packaging of a semiconductor chip and method therefor|
|US6433427||Jan 16, 2001||Aug 13, 2002||Industrial Technology Research Institute||Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabrication|
|US6458411||Oct 5, 2001||Oct 1, 2002||Aralight, Inc.||Method of making a mechanically compliant bump|
|US6507095||Mar 23, 2000||Jan 14, 2003||Seiko Epson Corporation||Wiring board, connected board and semiconductor device, method of manufacture thereof, circuit board, and electronic instrument|
|US6525429||Mar 2, 2000||Feb 25, 2003||Tessera, Inc.||Methods of making microelectronic assemblies including compliant interfaces|
|US6537854||May 24, 1999||Mar 25, 2003||Industrial Technology Research Institute||Method for bonding IC chips having multi-layered bumps with corrugated surfaces and devices formed|
|US6555908||Feb 10, 2000||Apr 29, 2003||Epic Technologies, Inc.||Compliant, solderable input/output bump structures|
|US6624653||Jan 7, 2002||Sep 23, 2003||Micron Technology, Inc.||Method and system for wafer level testing and burning-in semiconductor components|
|US6638870||Jan 10, 2002||Oct 28, 2003||Infineon Technologies Ag||Forming a structure on a wafer|
|US6642136||Sep 17, 2001||Nov 4, 2003||Megic Corporation||Method of making a low fabrication cost, high performance, high reliability chip scale package|
|US6710456||Aug 31, 2000||Mar 23, 2004||Micron Technology, Inc.||Composite interposer for BGA packages|
|US6746898||Jun 17, 2002||Jun 8, 2004||Megic Corporation||Integrated chip package structure using silicon substrate and method of manufacturing the same|
|US6767818||Aug 7, 2000||Jul 27, 2004||Industrial Technology Research Institute||Method for forming electrically conductive bumps and devices formed|
|1||"Methods of Testing Chips and Joining Chips to Substrates," 2244 Research Disclosure, Feb. 1991, Elmsworth, GB, 32290.|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US7544598 *||Jul 5, 2006||Jun 9, 2009||Seiko Epson Corporation||Semiconductor device and method of manufacturing the same|
|US7872344||Jun 23, 2006||Jan 18, 2011||Tessera, Inc.||Microelectronic assemblies having compliant layers|
|US7884482 *||Dec 17, 2007||Feb 8, 2011||Shinko Electric Industries Co., Ltd.||Flip-chip mounting substrate|
|US7919873||Nov 12, 2008||Apr 5, 2011||Megica Corporation||Structure of high performance combo chip and processing method|
|US7960212||Aug 22, 2007||Jun 14, 2011||Megica Corporation||Structure of high performance combo chip and processing method|
|US7960842||Nov 12, 2008||Jun 14, 2011||Megica Corporation||Structure of high performance combo chip and processing method|
|US7960845 *||Jan 3, 2008||Jun 14, 2011||Linear Technology Corporation||Flexible contactless wire bonding structure and methodology for semiconductor device|
|US7986046 *||Feb 25, 2009||Jul 26, 2011||Seiko Epson Corporation||Semiconductor module and method of producing the same|
|US8124446||Aug 22, 2007||Feb 28, 2012||Megica Corporation||Structure of high performance combo chip and processing method|
|US8148806||Nov 12, 2008||Apr 3, 2012||Megica Corporation||Multiple chips bonded to packaging structure with low noise and multiple selectable functions|
|US8168527 *||Aug 4, 2009||May 1, 2012||Megica Corporation||Semiconductor chip and method for fabricating the same|
|US8215969 *||Jun 24, 2008||Jul 10, 2012||Taiwan Tft Lcd Association||Contact structure and forming method thereof and connecting structure thereof|
|US8269355||Nov 8, 2010||Sep 18, 2012||Linear Technology Corporation||Flexible contactless wire bonding structure and methodology for semiconductor device|
|US8338925||Dec 21, 2010||Dec 25, 2012||Tessera, Inc.||Microelectronic assemblies having compliant layers|
|US8426982||Jul 30, 2009||Apr 23, 2013||Megica Corporation||Structure and manufacturing method of chip scale package|
|US8558386||Oct 13, 2009||Oct 15, 2013||Tessera, Inc.||Methods of making compliant semiconductor chip packages|
|US8748227||Sep 9, 2008||Jun 10, 2014||Megit Acquisition Corp.||Method of fabricating chip package|
|US8872356 *||Oct 17, 2013||Oct 28, 2014||Micron Technology, Inc.||Semiconductor structures comprising a dielectric material having a curvilinear profile|
|US8912666||Mar 29, 2013||Dec 16, 2014||Qualcomm Incorporated||Structure and manufacturing method of chip scale package|
|US8912668 *||Mar 1, 2012||Dec 16, 2014||Taiwan Semiconductor Manufacturing Company, Ltd.||Electrical connections for chip scale packaging|
|US9018774||Sep 9, 2008||Apr 28, 2015||Qualcomm Incorporated||Chip package|
|US9087882||Dec 27, 2013||Jul 21, 2015||Taiwan Semiconductor Manufacturing Company, Ltd.||Electrical connection for chip scale packaging|
|US9123788||Sep 8, 2014||Sep 1, 2015||Taiwan Semiconductor Manufacturing Company, Ltd.||Bonded structures for package and substrate|
|US9196573||Jan 3, 2013||Nov 24, 2015||Taiwan Semiconductor Manufacturing Company, Ltd.||Bump on pad (BOP) bonding structure|
|US9224680||Dec 15, 2014||Dec 29, 2015||Taiwan Semiconductor Manufacturing Company, Ltd.||Electrical connections for chip scale packaging|
|US9397059||Aug 31, 2015||Jul 19, 2016||Taiwan Semiconductor Manufacturing Company, Ltd.||Bonded structures for package and substrate|
|US9515038||May 5, 2015||Dec 6, 2016||Taiwan Semiconductor Manufacturing Company, Ltd.||Electrical connection for chip scale packaging|
|US9548281||Oct 7, 2011||Jan 17, 2017||Taiwan Semiconductor Manufacturing Company, Ltd.||Electrical connection for chip scale packaging|
|US9673161||Jul 18, 2016||Jun 6, 2017||Taiwan Semiconductor Manufacturing Company, Ltd.||Bonded structures for package and substrate|
|US9741659 *||Dec 28, 2015||Aug 22, 2017||Taiwan Semiconductor Manufacturing Company, Ltd.||Electrical connections for chip scale packaging|
|US9748188||Nov 6, 2015||Aug 29, 2017||Taiwan Semiconductor Manufacturing Company, Ltd.||Method of forming a bump on pad (BOP) bonding structure in a semiconductor packaged device|
|US20070018306 *||Jul 5, 2006||Jan 25, 2007||Seiko Epson Corporation||Semiconductor device and method of manufacturing the same|
|US20080142993 *||Dec 17, 2007||Jun 19, 2008||Shinko Electric Industries Co., Ltd.||Flip-chip mounting substrate|
|US20080284011 *||Aug 7, 2007||Nov 20, 2008||Taiwan Tft Lcd Association||Bump structure|
|US20090057901 *||Nov 12, 2008||Mar 5, 2009||Megica Corporation||Structure of high performance combo chip and processing method|
|US20090174043 *||Jan 3, 2008||Jul 9, 2009||Linear Technology Corporation||Flexible contactless wire bonding structure and methodology for semiconductor device|
|US20090218685 *||Feb 25, 2009||Sep 3, 2009||Seiko Epson Corporation||Semiconductor module and method of producing the same|
|US20090246988 *||Jun 24, 2008||Oct 1, 2009||Taiwan Tft Lcd Association||Contact structure and forming method thereof and connecting structure thereof|
|US20090291554 *||Aug 4, 2009||Nov 26, 2009||Megica Corporation||Semiconductor chip and method for fabricating the same|
|US20100035382 *||Oct 13, 2009||Feb 11, 2010||Tessera, Inc.||Methods of making compliant semiconductor chip packages|
|US20100052160 *||Oct 21, 2008||Mar 4, 2010||Wei-Hao Sun||Bump structure and method for fabricating the same|
|US20110042792 *||Nov 8, 2010||Feb 24, 2011||Linear Technology Corporation||Flexible contactless wire bonding structure and methodology for semiconductor device|
|US20130228897 *||Mar 1, 2012||Sep 5, 2013||Taiwan Semiconductor Manufacturing Company, Ltd.||Electrical Connections for Chip Scale Packaging|
|US20140042618 *||Oct 17, 2013||Feb 13, 2014||Micron Technology, Inc.||Methods for forming a semiconductor structure and related structures|
|US20160111363 *||Dec 28, 2015||Apr 21, 2016||Taiwan Semiconductor Manufacturing Company, Ltd.||Electrical Connections for Chip Scale Packaging|
|U.S. Classification||257/734, 257/781, 257/E21.508, 257/760, 257/642, 257/773, 257/780, 257/784, 257/787, 257/776, 257/759, 257/777|
|International Classification||H01L23/498, H01L23/48, H01L29/40|
|Cooperative Classification||H01L2924/00011, H01L2924/12042, H01L2924/351, H01L2224/04042, H01L2224/0401, H01L2224/05554, H01L2224/024, H01L2224/0236, H01L2224/48624, H01L2224/48724, H01L23/3114, H01L2924/01078, H01L2224/0231, H01L2224/1319, H01L2224/13099, H01L2924/01028, H01L2924/1517, H01L24/45, H01L2924/01004, H01L2224/24011, H01L2924/01033, H01L2924/01322, H01L24/13, H01L2924/01046, H01L2924/01013, H01L2924/01074, H01L2224/24227, H01L23/525, H01L2924/15153, H01L24/82, H01L2224/05624, H01L2224/45144, H01L24/72, H01L2224/45155, H01L2924/014, H01L2224/24226, H01L2924/01029, H01L24/11, H01L23/3121, H01L2924/01014, H01L2224/45147, H01L23/498, H01L2924/01082, H01L2924/01024, H01L2924/01022, H01L2224/85424, H01L24/94, H01L2224/16, H01L2224/116, H01L2924/01327, H01L2224/02313, H01L2924/01079, H01L2224/114, H01L24/05, H01L23/4951, H01L2224/45124, H01L2924/01039, H01L2224/02311, H01L2924/01009, H01L2224/274, H01L2924/10253, H01L2224/131, H01L2224/11334|
|European Classification||H01L24/11, H01L24/94, H01L24/12, H01L24/10, H01L24/02, H01L23/498, H01L24/72, H01L23/31H2, H01L23/495A4, H01L23/525, H01L23/31H1|
|Feb 2, 2012||FPAY||Fee payment|
Year of fee payment: 4
|Feb 5, 2016||FPAY||Fee payment|
Year of fee payment: 8
|Dec 2, 2016||AS||Assignment|
Owner name: ROYAL BANK OF CANADA, AS COLLATERAL AGENT, CANADA
Free format text: SECURITY INTEREST;ASSIGNORS:INVENSAS CORPORATION;TESSERA, INC.;TESSERA ADVANCED TECHNOLOGIES, INC.;AND OTHERS;REEL/FRAME:040797/0001
Effective date: 20161201