|Publication number||US7436670 B2|
|Application number||US 11/580,053|
|Publication date||Oct 14, 2008|
|Filing date||Oct 13, 2006|
|Priority date||Oct 13, 2006|
|Also published as||US20080089030|
|Publication number||11580053, 580053, US 7436670 B2, US 7436670B2, US-B2-7436670, US7436670 B2, US7436670B2|
|Original Assignee||Inventec Corporation|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (13), Classifications (11), Legal Events (3)|
|External Links: USPTO, USPTO Assignment, Espacenet|
1. Field of the Invention
The present invention relates to a retaining device, and more particularly, to a heat sink retaining device for attaching a heat sink on a chip unit.
2. Related Art
The booming development of the software and hardware pushes computers and the peripherals thereof to continuously improve in speed and quality. However, a following problem of the high chip temperature and the heat dissipation measures has become a non-ignorable problem or even a problem urgently calling for an effective solution. Therefore, in order to effectively reduce the operating temperature of the CPU or the chip on the motherboard of a computer, most of the designers dispose a group of heat sinks with preferred heat dissipation effect on the CPU or on the chip. The most common ones are, for example, a heat sink formed by aluminum extruded heat sink fins, or a heat sink comprising heat conducting piping, or a heat sink formed by aluminum extruded heat sink fins together with a fan.
When the above heat sinks are mounted and fixed, the parts such as an elastic clip, a regulating screw rod, or a set screw are commonly used to position the heat sink on surface of the CPU or the chip on the motherboard. However, as for the conventional positioning manner for locking the heat sink, holes must be formed on the surface of the chip for snapping a fastener, or other tools are required when locking with a screw, and spin-locking the screw will easily cause a damage of the heat sink fins. Moreover, the manner of snapping a fastener or an elastic member to a substrate not only has disadvantages concerning poor stability and being easy to be damaged, but also has defects concerning failure on improving the snapping effect as the elastic force is not a directly downward pressing snapping force, the non-uniform force and being difficult in disassembling. In order to solve the above problems, an adhering manner is provided in the conventional art to mount and fix the above heat sink on the CPU or chip, however, a chemical change tends to occur in the adhesive used in the adhering manner on the junction surface, which causes many uncertainties for the fastness of the adhering, the reliability of a long time adhering is low, and the stability of the adhesive for adhering can not be ensured directly, so that all of the above problems are the troubles and defects caused by the conventional heat sink retaining devices.
Therefore, in the conventional heat sink retaining device, if an elastic component is adopted to mount and fix the heat sink on the surface of the CPU or the chip, it has the disadvantage of damaging the heat sink and the stability and being inconvenient in assembling and disassembling, or if the adhering manner is adopted, it has the problems concerning the reliability and fastness. Therefore, how to design a new heat sink retaining device capable of improving the convenience in assembling and disassembling and increasing the reliability and fastness of the combination thereof is the objective of the present invention.
In view of the problems of the above conventional art, the present invention provides a heat sink retaining device, which is used for settling the conventional problems of being easily damaged and the poor stability, reliability and fastness when an elastic member or adhering manner is adopted to fix and position the heat sink on the chip, and also for overcoming the disadvantages concerning being inconvenient in assembling and disassembling of the conventional heat sink retaining devices.
In order to achieve the above objective, the present invention provides a heat sink retaining device for attaching a heat sink on a chip unit, which comprises a retaining component and a rotating component. The retaining component is locked on the heat sink by a hook portion thereof and presses against the heat sink by a pressing portion, and the above rotating component is pivotally disposed on the retaining component and pivotally rotated between a locking position and a release position. When the rotating component is at the locking position, a clamping portion thereof is snapped onto the chip unit, so as to press the pressing portion against the heat sink and the chip unit, so that the whole is firmly combined.
A reed further extends from the rotating component, and the reed has an elastic force to push the pressing portion towards the heat sink or the chip unit or pivotally rotate the rotating component to the release position.
Furthermore, the above rotating component further comprises an elastic member. When the rotating component is at the locking position, the reed having the elastic force pushes the pressing portion towards the heat sink or the chip unit, and when leaving the locking position, the rotating component is pivotally rotated to the release position by the elastic force of the elastic member or the reed.
By implementing the heat sink retaining device of the present invention, at least the following efficacies can be achieved.
1. In the heat sink retaining device of the present invention, by the manner of pivotally rotating the rotating component to snap onto the chip unit thus making the retaining component press the heat sink against the chip unit, i.e. without an assembling/disassembling tool and forming holes for retaining, the heat sink is easily assembled/disassembled on the chip unit, so as to achieve the goal of being convenient in assembling/disassembling.
2. In the heat sink retaining device of the present invention, by the manner of pivotally rotating the rotating component to snap onto the retaining component by the elastic force provided by a reed thus making the retaining component press the heat sink against the chip unit by a uniformly distributed directly downward pressing force, the stability of the combination thereof is improved.
3. In the heat sink retaining device of the present invention, the rotating component can leave the locking position to the release position by the double elastic force provided by the elastic member or the reed.
Further scope of applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.
The present invention will become more fully understood from the detailed description given herein below for illustration only, and thus are not limitative of the present invention, and wherein:
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More specifically, when the rotating component 12 is at the locking position M1, the reed 122 has an elastic force to push the pressing portion 111 towards the heat sink 20 or the chip unit 30, and when leaving the locking position M1, the rotating component 12 is pivotally rotated to the release position M2 by the elastic force. Further, an elastic member 125 is clamped between the reed 122 and the penetrating portion 123, likewise, when the rotating component 12 is at the locking position M1, the reed 122 has an elastic force to push the pressing portion 111 towards the heat sink 20 or the chip unit 30, and when leaving the locking position M1, the rotating component 12 is pivotally rotated to the release position M2 by the elastic force of the elastic member 125 or the reed 122. Due to different design shapes of the heat sink 20, the retaining component 11 further has a recessed portion 115 for accommodating the heat sink 20 and matching with the heat sink 20, likewise, the above rotating component 12 also further has a notch portion 126 for accommodating the retaining component 11 and matching with the retaining component 11.
Furthermore, the present invention provides a heat sink retaining device 10 for retaining a heat sink 20 on a chip unit 30, and in the above preferred embodiments of the heat sink retaining device 10, the clamping portion 121 thereof is flake-shaped, the reed 122 is approximately meniscus-shaped and is a plastic member, and the above elastic member 125 is made of a plastic material. Of course, besides the flake shape disclosed in the preferred embodiments, the clamping portion 121 may also be a plurality of clip hooks.
The invention being thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US5436798 *||Jan 21, 1994||Jul 25, 1995||Wakefield Engineering, Inc.||Spring clip and heat sink assembly for electronic components|
|US5542468 *||Jun 28, 1995||Aug 6, 1996||Lin; Chuen-Sheng||CPU heat dissipator hook-up apparatus|
|US6396695 *||Oct 10, 2000||May 28, 2002||Foxconn Precision Components Co., Ltd.||Clip for heat sink|
|US6449152 *||Nov 6, 2001||Sep 10, 2002||Jen-Cheng Lin||Device for pressing a heat sink tightly against a CPU and positioning a fan over the heat sink|
|US6477049 *||May 23, 2001||Nov 5, 2002||Jen-Cheng Lin||Fixture assembly for a heat sink|
|US6522545 *||Jun 19, 2002||Feb 18, 2003||Intel Corporation||Securing heat sinks|
|US6646880 *||Nov 18, 2002||Nov 11, 2003||Hon Hai Precision Ind. Co., Ltd.||Heat sink clip|
|US6731504 *||Apr 16, 2003||May 4, 2004||A-Sheng Liu||Heat sink fastener|
|US6826052 *||Feb 26, 2003||Nov 30, 2004||Hon Hai Precision Ind. Co., Ltd.||Retaining assembly for heat sink|
|US7013537 *||Jun 25, 2004||Mar 21, 2006||Glacialtech, Inc.||Detent means for a heat sink|
|US7019978 *||Jul 15, 2004||Mar 28, 2006||Hon Hai Precision Industry Co., Ltd.||Heat dissipating device incorporating clip|
|US7046516 *||Oct 28, 2004||May 16, 2006||Hon Hai Precision Industry Co., Ltd.||Clip for heat sink|
|US7292442 *||Apr 24, 2006||Nov 6, 2007||Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.||Heat sink clip and assembly|
|U.S. Classification||361/704, 257/727, 361/719, 361/709, 257/718, 165/80.3, 257/E23.086|
|Cooperative Classification||H01L23/4093, H01L2924/0002|
|Oct 13, 2006||AS||Assignment|
Owner name: INVENTEC CORPORATION, TAIWAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHEN, WIN-HAW;REEL/FRAME:018418/0603
Effective date: 20060804
|Mar 14, 2012||FPAY||Fee payment|
Year of fee payment: 4
|Mar 30, 2016||FPAY||Fee payment|
Year of fee payment: 8