|Publication number||US7447024 B1|
|Application number||US 11/778,700|
|Publication date||Nov 4, 2008|
|Filing date||Jul 17, 2007|
|Priority date||Jul 17, 2007|
|Publication number||11778700, 778700, US 7447024 B1, US 7447024B1, US-B1-7447024, US7447024 B1, US7447024B1|
|Original Assignee||Kuan-Yin Chou|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (6), Referenced by (5), Classifications (10), Legal Events (3)|
|External Links: USPTO, USPTO Assignment, Espacenet|
1. Field of the Invention
The present invention relates to a cooling accessory for an electronic component, and more particularly to a heat sink for a memory which can partially seal the internal convective space, so as to control the direction in which the heat is conducted out by the air.
2. Description of the Prior Art
During the recent electronic times, various electronic products have been rapidly developed on the market. In the design of the electronic product, the heat dissipation is the most important, because no matter how excellent the function of a product is, if the device is often burned due to bad heat-dissipating effect, the product will become unuseful. Thereby, various heat sinks have been continuously being developed one after another.
As known from the computer memory, the conventional heat sink is only disposed with two copper sheets at both sides thereof. Due to the fine heat conductivity of the copper, the heat of the memory can be quickly conducted into the air by the two copper sheets. However, the heat dissipating effect reached by the heat exchange between mediums is not fine. The air is the medium with poor heat conductivity, so the heat-dissipating effect of the heat conduction is quite unsatisfied.
However, the heat-dissipating effect of this heat sink is not fine. Because the fan 20 is disposed at one end of the two heat-conducting sheets 10, and the air is sent from one end of each heat-conducting sheet 10 into the entry 111 of the air passage 11 of each heat-conducting sheet 10, and then the air will be expelled out from the exit 112 of each air passage 11. Hence, the part of the memory A located correspondingly to the entry 111 contacts the lower temperature air, so its heat is easily discharged by the air convection. The part of the memory A located correspondingly to the exit 112 contacts the air which has already absorbed the heat discharged at the entry 111, so the temperature of the air is comparatively higher. Thereby, it is difficult to discharge the heat through convection, thus causing an undesirable heat-dissipating effect of the part of the memory A located correspondingly to the exit 112, different heat-dissipating effects at both ends of the heat-conducting sheets 10 and a higher damage possibility.
The present invention has arisen to mitigate and/or obviate the afore-described disadvantages.
The primary objective of the present invention is to provide a heat sink for a memory, so as to uniformly and quickly dissipate the heat of the memory.
In order to achieve the abovementioned objective, the heat sink comprises two heat-conducting sheets and at least one fan. Both sides of the memory are clamped by the two heat-conducting sheets, and between the two heat-conducting sheets is defined a convective space. The upper end of the convective space is sealed, and the fan is disposed between the two heat-conducting sheets. The fan can suck the air into the convective space, and then the air will be expelled out through both ends of the convective space. By such arrangements, when the air enters into the convective space, the heat of the memory will be dissipated by the convection, and the hot air will be expelled out though both ends of the convective space, so the heat can be quickly and uniformly dissipated.
The present invention will be clearer from the following description when viewed together with the accompanying drawings, which show, for purpose of illustrations only, the preferred embodiment in accordance with the present invention.
The two heat-conducting sheets 10A, 10B are disposed at both sides of the memory A to clamp the memory A. Each of the two heat-conducting sheets 10A, 10B includes a base 101A, 101B and a heat-dissipating portion 102A, 102B. The upper end of each base 101A, 101B is connected with the lower end of each heat-dissipating portion 102A, 102B. The two heat-conducting sheets 10A, 10B utilizes their bases 101A, 102A to clamp the memory A to restrict the memory A under the heat-dissipating portions 102A, 102B of the two heat-conducting sheets 10A, 10B, and the heat-dissipating portions 102A, 102B of the two heat-conducting sheets 10A, 10B are used to define a convective space B. The bases 101A, 101B and the heat-dissipating portions 102A, 102B are disposed with a plurality of transverse ribs 12 respectively to improve the structural strength of the two heat-conducting sheets 10A, 10B. The upper end of the heat-dissipating portion 102A of the heat-conducting sheet 10A is formed with a cover plate 13 extended toward the other heat-conducting sheet 10B, and from the upper end of the base 101A located at both sides of the heat-dissipating portion 102A is extended two cover plates 13 toward the other heat-conducting sheet 10B. The three cover plates 13 of the heat-conducting sheet 10A are connected with the heat-conducting sheet 10B to seal the upper end of the convective space B. The heat-dissipating portion 102B of the heat-conducting sheet 10B is formed with a through hole 103 at the center thereof.
The fan 20 is inserted through the through hole 103 of the heat-conducting sheet 10B to be disposed on the heat-dissipating portion 102A of the heat-conducting sheet 10B, so as to retain the fan 20 in the convective space B. Moreover, all sides of the fan 20 are opened.
When the fan 20 is in use, the air can be sent into the convective space B, and the two heat-conducting sheets 10A, 10B can utilize their bases 101A, 10B to partially conduct the heat of the memory A to the heat-dissipating portions 102A, 102B, respectively, and then the air sent by the fan 20 performs the heat exchange with the memory A and the heat-dissipating portions 102A, 102B in the convective space B. As shown in
Moreover, the fan 20 is disposed at the center of the heat-dissipating portions 102A, 102B of the two heat-conducting sheets 10A, 10B, and the upper end of the convective space B is sealed by the cover plate 13, so after the air is guided in by the fan 20, it will be expelled through both ends of the convective space B. The air exhausted from each end only needs to discharge a half of the heat of the memory A, so the heat will be dissipated quickly. In addition, the fan 20, which is located at the center, sucks in the air and the air will be extracted through both ends, so the heat dissipation is uniform.
In addition, referring to
While we have shown and described various embodiments in accordance with the present invention, it is clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US5936836 *||Dec 19, 1997||Aug 10, 1999||Dell U.S.A., L.P.||Computer with an improved internal cooling system|
|US6671177 *||Oct 25, 2002||Dec 30, 2003||Evga.Com Corporation||Graphics card apparatus with improved heat dissipation|
|US6724617 *||Jun 11, 2003||Apr 20, 2004||Internet Research Institute, Inc.||Server unit comprising stacked multiple server unit cabinets accommodating multiple cartridge type server units|
|US20020172008 *||May 15, 2001||Nov 21, 2002||Mihalis Michael||High-performance heat sink for printed circuit boards|
|US20070285895 *||Feb 22, 2005||Dec 13, 2007||Infineon Technologies Ag||Cooling System For Device Having Power Semiconductors And Method For Cooling The Device|
|US20080123294 *||Nov 29, 2006||May 29, 2008||Richard & Ronald International Company, Ltd.||Cooling apparatus for memory modules|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US7791881 *||May 19, 2009||Sep 7, 2010||Asustek Computer Inc.||Heat-dissipating mechanism for use with memory module|
|US7957141||Aug 6, 2010||Jun 7, 2011||Asustek Computer Inc.||Heat-dissipating mechanism for use with memory module|
|US20130114208 *||Apr 19, 2011||May 9, 2013||Napatech A/S||Thermally controlled assembly|
|US20130141868 *||Apr 19, 2011||Jun 6, 2013||Napatech A/S||Thermally controlled assembly|
|US20130182389 *||Sep 28, 2011||Jul 18, 2013||Bull Sas||Heat sink for an interchangeable expansion module capable of being connected to a computer board|
|U.S. Classification||361/695, 361/719, 165/122, 165/185, 165/80.3|
|International Classification||H05K7/20, F28F7/00|
|Cooperative Classification||H01L23/467, H01L2924/0002|
|Jun 18, 2012||REMI||Maintenance fee reminder mailed|
|Nov 4, 2012||LAPS||Lapse for failure to pay maintenance fees|
|Dec 25, 2012||FP||Expired due to failure to pay maintenance fee|
Effective date: 20121104