|Publication number||US7468321 B2|
|Application number||US 11/382,500|
|Publication date||Dec 23, 2008|
|Filing date||May 10, 2006|
|Priority date||Nov 2, 2002|
|Also published as||US7276454, US20040087175, US20060194407|
|Publication number||11382500, 382500, US 7468321 B2, US 7468321B2, US-B2-7468321, US7468321 B2, US7468321B2|
|Inventors||Kai-Ming Ching, Chia-Fu Lin, Ta-Min Lin, Yen-Ming Chen, Hsin-Hui Lee, Chao-Yuan Su, Wen-Hsiang Tseng|
|Original Assignee||Taiwan Semiconductor Manufacturing Co., Ltd.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (13), Referenced by (1), Classifications (56), Legal Events (3)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This application is a Continuation of pending U.S. patent application Ser. No. 10/286,626, filed Nov. 02, 2002, now U.S. Pat. No. 7,276,454 and entitled “Application of impressed-current cathodic protection to prevent metal corrosion and oxidation”.
(1) Field of the Invention
The invention relates to the fabrication of integrated circuit devices, and more particularly, to a method to prevent corrosion of copper.
(2) Description of the Prior Art
In the creation of semiconductor devices, device elements are interconnected with metal traces, as are completed devices, for the performance of complex processing functions. Conventionally, aluminum has been used for the creation of interconnect traces. With increased device density and continued demands for device performance improvements, a substitute for aluminum has been explored and is at this time being used by using copper for the creation of interconnect traces. Other materials that are useful for the creation of conductive interconnect traces are tungsten, titanium, polysilicon, polycide or alloys of these metals.
Copper is increasingly used for interconnect traces due to its relatively low cost and low resistivity. Copper however has a large diffusion coefficient into silicon dioxide and silicon. Copper from an interconnect may diffuse into surrounding dielectric such as a silicon dioxide layer, causing the dielectric to become conductive and decreasing the dielectric strength of for instance the silicon dioxide layer. Copper interconnects are therefore typically encapsulated by at least one diffusion barrier to prevent diffusion of the copper into the silicon dioxide layer. Silicon nitride is a diffusion barrier to copper, but the prior art teaches that the interconnects should not lie on a silicon nitride layer because it has a high dielectric constant compared with silicon dioxide. The high dielectric constant causes an undesired increase in capacitance between the interconnect and the substrate. Also, copper has low adhesive strength to various insulating layers, and presents difficulties inherent in masking and etching a blanket layer of copper into intricate circuit structures.
In practical applications of creating conductive interconnect traces, the metal layers of Integrated Circuit (IC) devices are prone to be corroded and oxidized by various chemicals that are used during the processing of the IC devices. For example, copper is corroded if it is exposed to a strong alkaline solution. The invention provides a structure of preventing this corrosion of copper, using the Pourbaix diagram of copper and therewith applying a method of impressed-current cathodic protection. A process will be highlighted that further explains the exposure that is suffered by copper that is used as part of the creation of an interconnect bump. The invention provides a structure of impressed-current cathodic protection to prevent corrosion of the metal that is used for the creation of for instance interconnect traces or interconnect studs or bumps.
U.S. Pat. No. 6,274,504 B2 (Sanderfer et al.) shows a process to minimize corroding during post metal solvent clean.
U.S. Pat. No. 6,209,551 B1 (Yang et al.) is a related strip process.
U.S. Pat. No. 5,336,371 (Chung et al.) shows a photo-resist stripper tool that reduces corrosion.
The Pourbaix diagrams that are discussed as part of the invention are further detailed in the publication “Atlas of Electromechanical Equilibria in Aqueous Solution”, published 1974, ISBN 0-915567-98-9.
A principle objective of the invention is to prevent corrosion of metal surfaces that are exposed to semiconductor chemicals during wet processing.
Another objective of the invention is to prevent oxidation of metal surfaces that are exposed to semiconductor chemicals during wet processing.
Another objective of the invention is to prevent the alignment mark being affected, that is damaged or discolored, by wet substance, thereby assuring that the alignment mark will remain effective as an alignment medium.
Another objective of the invention is to prevent the formation of by-products by a process of corrosion of exposed metal surfaces, eliminating the creation of etch residue during the etch of for instance a layer of seed metal.
In accordance with the objectives of the invention a new method is provided for the processing of metals, most notably copper, such that corrosion and oxidation of exposed surfaces of these metals is prevented. During a step of semiconductor processing, which results in exposing a metal surface to a wet substance having a pH value, a voltage is applied to the metal that is exposed. The value of the applied voltage can, dependent on the value of the pH constant of the wet substance, be selected such that the exposed metal surface is protected against alkaline effects of the wet substance.
In order to place the invention in the proper perspective, a short overview of a metal processing sequence is first highlighted, the selected sequence is aimed at creating a solder bump or stud. The cross sections of
Referring now specifically to
Layer 10 is the surface of a semiconductor layer, a contact pad 12 has been created on surface 10. Surface 10 will typically be the surface of a semiconductor substrate, the surface of an interconnect substrate and the like. A contact pad 12 has been created on surface 10, electrical contact must be established with contact pad 12 by means of an overlying solder bump. Contact pad 12 serves as an interface between the solder bump and electrical interconnects that are provided in the surface of layer 10 and is typically created using aluminum or copper.
A layer 14 of passivation that may, for instance, contain Plasma Enhanced silicon nitride (PE Si3N4), is deposited over the surface of layer 10 and of contact pad 12.
Various materials have found application in the creation of passivation layers. A passivation layer can contain silicon oxide/silicon nitride (SiO2/Si3N4) deposited by CVD, a passivation layer can be a layer of photosensitive polyimide or can comprise titanium nitride. Another material often used for a passivation layer is phosphorous doped silicon dioxide that is typically deposited over a final layer of aluminum interconnect using a Low Temperature CVD process. In recent years, photosensitive polyimide has frequently been used for the creation of passivation layers. Conventional polyimides have a number of attractive characteristics for their application in a semiconductor device structure, which have been highlighted above. Photosensitive polyimides have these same characteristics but can, in addition, be patterned like a photoresist mask and can, after patterning and etching, remain on the surface on which it has been deposited to serve as a passivation layer. Typically, and to improve surface adhesion and tension reduction, a precursor layer is first deposited by, for example, conventional photoresist spin coating. The precursor is, after a low temperature pre-bake, exposed, using for example a step and repeat projection aligner and Ultra Violet (UV) light as a light source. The portions of the precursor that have been exposed in this manner are cross-linked, thereby leaving unexposed regions (that are not cross-linked) over the bonding pads. During subsequent development, the unexposed polyimide precursor layer (over the bonding pads) is dissolved, thereby providing openings over the bonding pads. A final step of thermal curing leaves a permanent, high quality passivation layer of polyimide over the substrate.
The preferred material for the deposition of layer 14 of passivation is Plasma Enhanced silicon nitride (PE Si3N4), deposited using PECVD technology at a temperature between about 350 and 450 degrees C. with a pressure of between about 2.0 and 2.8 Torr for the duration between about 8 and 12 seconds. Layer 14 of PE Si3N4 can be deposited to a thickness between about 12 and 15 μm.
Layer 14 of PE Si3N4 is next patterned and etched to create an opening in the layer 14 that overlays and aligns with the underlying contact pad 12.
The etching of layer 14 can use Ar/CF4 as an etchant at a temperature of between about 120 and 160 degrees C. and a pressure of between about 0.30 and 0.40 Torr for a time of between about 33 and 39 seconds using a dry etch process.
The etching of layer 14 can also use He/NF3 as an etchant at a temperature of between about 80 and 100 degrees C. and a pressure of between about 1.20 and 1.30 Torr for a time of between about 20 and 30 seconds using a dry etch process.
For the in-situ sputter clean, a sputter ion-milling tool can be used, applying Ar mixed with H2 as a cleaning agent (sputter source).
For the seed layer 16 that is blanket deposited over the surface of the layer 14 of passivation, including the exposed surface of the contact pad 12, any of the conventional metallic seed materials can be used, preferably comprising copper or chrome. The metallic seed layer can be deposited using a sputter chamber or an Ion Metal Plasma (IMP) chamber at a temperature of between about 0 and 300 degrees C. and a pressure of between about 1 and 100 mTorr, using (for instance) copper or a copper alloy as the source (as highlighted above) at a flow rate of between about 10 and 400 sccm and using argon as an ambient gas.
Layer 20 of photoresist can be deposited or laminated to a thickness of between about 2,000 and 8,000 Angstrom or between about 50 and 120 μm. The methods used for the deposition or lamination and development of the layer 20 of photoresist apply conventional methods of photolithography. Photolithography is a common approach wherein patterned layers are usually formed by spinning or by laminating on a layer of photoresist, projecting light through a photomask with the desired pattern onto the photoresist to expose the photoresist to the pattern, developing the photoresist, washing off the unexposed photoresist, and plasma etching to clean out the areas where the photoresist has been washed away. The exposed resist may be rendered insoluble (negative working) and form the pattern, or soluble (positive working) and be washed away.
The layer 20 of photoresist will, after patterning and developing, remain in place in an area above the aluminum pad 12 that surrounds the pad 12 and that is adjacent to the pad 12. The deposited layer 20 of photoresist can, prior to patterning and etching, be cured or pre-baked further hardening the surface of the layer of photoresist.
Layer 20 of photoresist can be etched by applying O2 plasma and then wet stripping by using a H2SO4, H2O2 and NH4OH solution. Sulfuric acid (H2SO4) and mixtures of H2SO4 with other oxidizing agents such as hydrogen peroxide (H2O2) are widely used in stripping photoresist after the photoresist has been stripped by other means. Wafers to be stripped can be immersed in the mixture at a temperature between about 100 degrees C. and about 150 degrees C. for 5 to 10 minutes and then subjected to a thorough cleaning with deionized water and dried by dry nitrogen. Inorganic resist strippers, such as the sulfuric acid mixtures, are very effective in the residual free removal of highly postbaked resist. They are more effective than organic strippers and the longer the immersion time, the cleaner and more residue free wafer surface can be obtained.
The photoresist layer 20 can also be partially removed using plasma oxygen ashing and careful wet clean. The oxygen plasma ashing is heating the photoresist in a highly oxidized environment, such as an oxygen plasma, thereby converting the photoresist to an easily removed ash. The oxygen plasma ashing can be followed by a native oxide dip for 90 seconds in a 200:1 diluted solution of hydrofluoric acid.
Layer 20 of photoresist can additionally be cured after the layer of photoresist has been deposited and before the layer of photoresist is patterned and developed. This curing of the layer of photoresist can be performed in a N2 gas ambient, at a temperature of between about 300 and 400 degrees C., for a time period between about 1.5 and 2.5 hours, and a pressure of 760 Torr.
The layer 28 of bump or re-route metal is electroplated in contact with the layer 16, to a thickness of between about 30 and 100 μm but more preferably to a thickness of about 50 μm.
As previously stated relating to the cross sections of
Conventional problems that are encountered due to the interface between the photoresist striper and the thereby exposed surface of the seed layer are:
As a result of the first of these negative effects, the corrosion of the surface of the layer 16 of seed metal, a by-product consisting of metal oxide is formed over the surface of the layer 16 of seed metal. This layer of metal oxide blocks etching of the layer 16 of seed metal and further introduces a metal-oxide based etching residue.
As a result of the second of these negative effects, the discoloring and damaging of the alignment mark of the wafer, the alignment mark (in its use by for instance a stepper tool) is less effective due to its loss of visibility.
The invention addresses these problems providing a method that is referred to as an impressed-current cathodic protection structure. The basic idea of the invention is to apply, during steps of wet processing, a negative voltage to metal that has been created over the surface of a wafer, in this manner preventing the corrosion of the surface of the metal such as for instance the surface of a layer of copper.
Pourbaix diagrams show the stability of a first material, such as copper, under conditions of applying a voltage or potential to the first material, while the first material is exposed to a second, liquid material such as water or a substance of a (known and potentially high) alkaline nature. In a Pourbaix diagram, which typically has an X-axis that represents the pH factor of the second material and an Y-axis that represents the voltage that is applied to the first material, areas are identified that show the surface condition of the first material (for instance Cu), dependent on the pH factor of the second material (for instance photoresist) and the voltage that is applied to the first material.
Conditions of the surface of the first material (such as copper) that are shown in the Pourbaix diagram can be differentiated as:
It is from this classification clear that the last condition, that is the condition of “no effect”, is the desirable condition since under this condition the surface of the first material, such as copper, is not effected by the pH constant of the second material. The establishment of this desirable (condition number 5) can be accomplished by applying, for a metal such as copper that comes into contact with a liquid having a pH value, a voltage of a selected value.
For instance, using the Porbaix diagram of
These effects and interrelationships have been graphically highlighted in the diagrams that are shown in
For all of these diagrams there is a definite area, bounded by X coordinates (the pH value of the second material) and Y coordinates (the value of the voltage that is applied to the identified material such as copper, nickel.
Keeping the diagrams that have been shown in
For product rework processing, the following applies:
Residue that resides on the surface of the substrate, having a pH value, will thereby enter into the DIW and will consequently increase the pH value of the DIW. For a value of pH of the DIW of between about 9 and 13, a voltage of about −0.4 volts or less must be applied to the copper in order for the copper surface to remain immune to effects of the alkaline nature of the DIW.
For photoresist stripping, the following applies:
From the above it is clear that, by applying a voltage, typically of negative value, to a metal surface that is exposed to a wet substance having a pH value and dependent on the metal and the value of the pH value, the results can be achieved of:
This arrangement, as shown in simplified form in the cross section of
From the above highlighted experiments, it can be concluded that the voltage (33) that is applied to a surface over which a layer of copper has been created has an effect on the amount of corrosion that occurs in this surface during exposure to liquids having pH values.
The design that is shown in three dimensional view in
To summarize, the invention provides for considering and effectively using:
Although the invention has been described and illustrated with reference to specific illustrative embodiments thereof, it is not intended that the invention be limited to those illustrative embodiments. Those skilled in the art will recognize that variations and modifications can be made without departing from the spirit of the invention. It is therefore intended to include within the invention all such variations and modifications which fall within the scope of the appended claims and equivalents thereof.
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|Citing Patent||Filing date||Publication date||Applicant||Title|
|US8496511||Jul 15, 2010||Jul 30, 2013||3M Innovative Properties Company||Cathodically-protected pad conditioner and method of use|
|U.S. Classification||438/687, 257/E21.007, 257/E21.227, 257/E21.246, 438/680, 257/E21.229, 438/688, 257/E21.582, 257/E21.218, 257/E21.23, 257/E21.508, 257/E21.17, 257/E23.179, 257/E21.006|
|International Classification||H01L23/544, H01L21/302, H01L21/461, H01L21/60, H01L21/44, H01L21/768|
|Cooperative Classification||H01L2224/05572, H01L2224/05001, H01L2224/05022, H01L2223/54453, H01L21/76838, H01L23/544, H01L2224/1147, H01L2924/30105, H01L2924/04941, H01L2924/01051, H01L2924/01022, H01L2224/16, H01L2224/13099, H01L24/12, H01L24/11, H01L2924/01084, H01L2924/014, H01L2924/01024, H01L2924/01018, H01L2924/01082, H01L2924/01078, H01L2924/01074, H01L2924/01039, H01L2924/01032, H01L2924/01015, H01L2924/01013, H01L2924/14, H01L2924/01075, H01L2924/01033, H01L2924/01029, H01L2924/01006, H01L2924/01005|
|European Classification||H01L24/12, H01L24/11, H01L21/768C, H01L23/544|
|May 10, 2006||AS||Assignment|
Owner name: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., TAIW
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHING, KAI-MING;LIN, CHIA-FU;TSENG, WEN-HSIANG;AND OTHERS;REEL/FRAME:017597/0088
Effective date: 20020516
|May 23, 2012||FPAY||Fee payment|
Year of fee payment: 4
|Jun 9, 2016||FPAY||Fee payment|
Year of fee payment: 8