Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.

Patents

  1. Advanced Patent Search
Publication numberUS7527397 B2
Publication typeGrant
Application numberUS 11/526,909
Publication dateMay 5, 2009
Filing dateSep 26, 2006
Priority dateSep 26, 2006
Fee statusPaid
Also published asUS20080074883
Publication number11526909, 526909, US 7527397 B2, US 7527397B2, US-B2-7527397, US7527397 B2, US7527397B2
InventorsChia-Mao Li
Original AssigneeChia-Mao Li
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Solid state lighting package structure
US 7527397 B2
Abstract
The present invention discloses a solid state lighting package structure that breaks through the present small power packaging method to achieve the required power for lighting and overcome the heat and light issues, and uses a good heat sink and thermal conducting structure to quickly dissipate the heat produced by a chip to the outside. Special symmetric chip pattern and optical structure can evenly and efficiently guide the light out and select different color chips to meet the requirements for different color lights. The structure can be combined with a lamp easily, such that the solid state lighting can be applied for illumination easily and quickly.
Images(11)
Previous page
Next page
Claims(1)
1. A solid state lighting package structure, comprising:
a heatconducting base (2) having a round recess with a plurality of insert holes (22) therein;
a heat sink (12) embedding into the heat conducting base (2);
a plurality of light emitting components (11) electrically coupled to and packaged in an upper side of the heat sink (12) as an illuminating light source; and the light emitting components being arranged as a symmetrical radiating pattern;
a plurality of power supply pins (13) extending downwards from a lower side of the heat sink (12) and made of a material with a good thermal conductivity for conducting heat of the light emitting components (11) to the outside and provided for connecting a power supply; in assembly, the power supply pins (13) being inserted into the insert holes in the round recess and being connected to electric wires;
a lampshade cup body (3) having a truncated round tapered shape for receiving the heat conducting base (2); the lampshade cup body being installed onto the heat sink (12), and a glass lens (4) being inlaid onto a top of the lampshade cup body (3), such that in use, heat of the light emitting components (11) will be conducted quickly through the heat sink (12) to the heat conducting base (2) with a large contact area; and
wherein the light emitting components (11) in the radiating shaped symmetric pattern are electrically coupled to and packaged in the heat sink to evenly and quickly conduct the heat of the light emitting components to the heat sink (12), and the heat sink (12) together with the good thermal conductivity of the light emitting components (11) in a radiating shaped symmetric pattern eliminate the effects of thermal stress to the light emitting components (11) and the conducting wire (21), and the package in a radiating shaped symmetric pattern makes the light even and combines different color light emitting components in a symmetric pattern for providing different color tones; and
wherein each of the light emitting component (11) is a light emitting diode chip.
Description
BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to a solid state lighting package structure, and more particularly to a solid state lighting package structure capable of improving the heat conduction of a solid state light source by using a special symmetric chip pattern to conduct heat evenly to a heat sink, and the heat sink is made of a material with a good thermal conductivity, and the heat of the light source can be conducted through its contact with the heat sink, so as to enhance the thermal conductivity of the solid state package, and a special symmetric chip pattern and an optical structure can evenly and efficiently guide the light out and select different color chips to meet the requirements of different color lights, and the structure can be combined with a lamp easily, such that the solid state lighting can be applied for illumination in an easy and quick manner.

2. Description of the Related Art

In a traditional solid state light source (LED) packaging method, the thermal conduction performance is poor and cannot improve the power of a single chip. If sufficient intensity of illumination is needed, it is necessary to concentrate the brightness of several chips. After a plurality of chips are concentrated, the brightness can be improved, but the efficiency of the thermal conduction cannot be improved, and thus the heat of the chips is much greater than the heat around the chips, and the heat is unevenly distributed and concentrated on the chips and cannot be dissipated to the outside. Since the efficiency of thermal conduction is low, the chip cannot stand a larger power. Although the lamp obtains higher brightness by the plurality of chips, the chips cannot be combined with a general lamp easily. Further, the required brightness can be obtained by concentrating several chips, but the effect of “lighting with a plurality of points” is different from the general lighting, and thus it is very difficult to develop and promote the solid state lighting.

SUMMARY OF THE INVENTION

The objective of this invention is to provide a solid state lighting package structure that breaks through the present small power packaging method to achieve the required power for lighting and overcome the heat and light issues, and uses a good heat sink and a thermal conducting structure to quickly dissipate the heat produced by the chips to the outside. Special symmetric chip pattern and optical structure can evenly and efficiently guide the light out and select different color chips to meet the requirements for different color lights. The structure can be combined with a lamp easily, such that the solid state lighting can be applied for illuminations easily and quickly.

BRIEF DESCRIPTION OF THE DRAWINGS

Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings, in which:

FIG. 1 is a perspective view of a solid state lighting package structure of the present invention;

FIG. 2 is a top view of a solid state lighting package structure of the present invention;

FIG. 3 is an exploded view of a solid state lighting package structure of the present invention;

FIG. 4 is a cross-sectional view of a solid state lighting package structure in accordance with a preferred embodiment of the present invention;

FIG. 5 is a perspective view of a solid state lighting package structure in accordance with a preferred embodiment of the present invention;

FIG. 6 is a perspective view of another package of a solid state lighting package structure in accordance with the present invention;

FIG. 7 is a top view of another package of a solid state lighting package structure in accordance with the present invention;

FIG. 8 is a perspective view of another package of a solid state lighting package structure in accordance with a preferred embodiment of the present invention;

FIG. 9 is a schematic view of an application of a solid state lighting package structure in accordance with the present invention; and

FIG. 10 is a schematic view of another application of a solid state lighting package structure in accordance with the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

In the detailed description of the preferred embodiments, it should be noted that like elements are indicated by the same reference numerals throughout the disclosure.

Referring to FIGS. 1 and 2 for a perspective view and a top view of a solid state lighting package structure in accordance with the present invention, the solid state lighting package structure 1 comprises a plurality of power supply pins 13 disposed at the middle and around the circular periphery of the solid state lighting package structure 1, and twelve sets of LED chips 11 arranged in a radiating shape or a geometric shape among the power supply pins 13 and packages the LED chips 11 in a heat sink 12, and the heat sink 12 has a very large heat capacity with respect to the chip and can absorb a large quantity of heat of the LED chips 11, such that the heat produced by the LED chip 11 operated at a high power can be conducted quickly to the heat sink 12. The heat sink 12 at its bottom includes a plurality of power supply pins 13. The LED chips 11 are arranged in a radiating shape or a geometric shape to avoid the heat sources from being overcrowded and provide an even heat dissipation for evenly dispersing the heat, quickly conducting the heat and maintaining a lower temperature, so as to improve the thermal conductivity and prevent possible damages to the chips and conducting wires caused by the thermal stress. Further, the radiating shaped or geometric shaped symmetric pattern can emit light beams evenly, and the symmetric pattern in a radiating shape or a geometric shape can reflect the side lights of a light source to the front from an oblique surface of the internal periphery of the heat sink 12, so that the lights can be concentrated and the intensity can be higher. The chips can be arranged symmetrically in different colors such as red, green and blue, such that different chips in the same package can emit lights of different colors or can simultaneously emit a light with mixed colors, and the symmetric pattern can provide even lights.

Referring to FIGS. 3 to 5 respectively for an exploded view, a cross-sectional view and a perspective view of a solid state lighting package structure in accordance with a preferred embodiment of the present invention, the solid state lighting package structure 1 is applied to a lamp, and the structure 1 installs a heat sink 12 to a heat conducting base 2, and the heat sink 12 can be embedded into the heat conducting base 2 to increase the contact area of the heat sink 12 and the heat conducting base 2, such that the heat sink 12 can conduct heat to the heat conducting base 2 more quickly than a heat sink 12 with a larger area and volume. In other words, such heat sink 12 can provide a larger heat capacity, so that the overall structure can have a significant effect on lowering the temperature of chips. Another advantage of embedding the heat sink 12 into the heat conducting base 2 is that the mechanical strength can be enhanced to securely embed the heat sink 12 onto the heat conducting base 2 to prevent the heat sink 12 and the heat conducting base 2 from being shaken, collided or fallen apart, and the heat conducting base 2 together with the heat sink 12 can enhance the insulation of the overall structure. The heat conducting base 2 could be a circular, square, or other geometric shaped structure, and the power supply pins 13 under the heat sink 12 are inserted into a plurality of insert holes 22 of the heat conducting base 2 and connected to an electric wire 21, and the lampshade cup body 3 is installed onto the heat sink 12, and a glass lens 4 is inlaid onto the top of the lampshade cup body 3, such that when the lamp is in use, the heat of the LED chip 11 can be conducted quickly through the heat sink 12 to the heat conducting base 2 with a large contact area. Since the chips are arranged in a radiating shape, the heat can be dissipated evenly, so as to give a better thermal conduction performance.

Referring to FIGS. 6 to 8 respectively for a perspective view of another package of a solid state lighting package structure, a top view and a perspective view of a preferred embodiment of the present invention, the solid state lighting package structure 1 can be installed with a different number of LED chips 11 arranged in a radiating shape as needed, so that such structure 1 also have the advantages of providing a quick thermal conduction and a high intensity of light as well as producing a color light by mixing different colors.

Referring to FIGS. 9 and 10 respectively for schematic views of two embodiments of the solid state lighting package structure in accordance with the present invention, the structure of the present invention can be applied to a general road lamp or various different decorating or illuminating lamps. In FIG. 9, the structure 1 is applied to a lamp post 5, and the solid state lighting package structure 1 installed in a traditional lamp shell 51 is used as a light source to replace a traditional lamp bulb that consumes much electric power and has a short life expectancy. In FIG. 10, the structure of the invention is applied to indoor decorating lamps, and the lamps are hung on a decorating lamp rack 6 and installed into a decorating lamp shell 61.

In summation of the description above, the major significance of the present invention resides on that the chips are packaged with a symmetric pattern in a radiating shape or a geometric shape onto the heat sink, such that heat can be dissipated evenly onto the heat sink to maximize the heat conduction efficiency and achieve the effects of enhancing the power of the chips and the evenness of the light. Unlike the traditional “lighting with a plurality of points”, the solid state lighting package structure of the invention can be combined with a traditional lamp to give a broader range of application and improve its practicability.

To show the improvement and practicability of the present invention, a comparison with a prior art structure is given as follows:

The shortcomings of the prior art are listed below:

    • 1. The prior art has a poor thermal conduction.
    • 2. The life expectancy of the chip is shortened due to overheat.
    • 3. Chips cannot stand high power.
    • 4. The light emitting efficiency of the chip is low.
    • 5. The intensity of illumination cannot be improved in direct proportion to the increased number of chips.
    • 6. The chips are concentrated, such that the side lights of the light source are absorbed and off set with each other.
    • 7. The thermal stress pulls the conducting wire connected to the chips, and thus the conducting wire may be broken easily.

The advantages of the present invention are listed as follows:

    • 1. The invention has a high thermal conduction.
    • 2. Good thermal conduction results in a long life expectancy of the chips.
    • 3. The chips can stand a higher power.
    • 4. The intensity of illumination can be improved with the same number of chips.
    • 5. The light of the invention is symmetric and even.
    • 6. Different colored light chips can be arranged in a symmetric pattern.
    • 7. The loss of side lights of the light source can be reduced, and the side light emitted outward can be reflected to the front by the heat sink.
    • 8. The structure of the invention can be combined with a lamp easily.
    • 9. The effect of the thermal stress can be eliminated

While the present invention has been described in connection with what is considered the most practical and preferred embodiments, it is understood that this invention is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretations and equivalent arrangements.

In summation of the above description, the present invention herein enhances the performance than the conventional structure and further complies with the patent application requirements and is submitted to the Patent and Trademark Office for review and granting of the commensurate patent rights.

Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
US5036248 *Nov 8, 1990Jul 30, 1991Ledstar Inc.Light emitting diode clusters for display signs
US5567036 *Apr 5, 1995Oct 22, 1996Grote Industries, Inc.Clearance and side marker lamp
US5947588 *Oct 6, 1997Sep 7, 1999Grand General Accessories Manufacturing Inc.Light fixture with an LED light bulb having a conventional connection post
US6019493 *Mar 13, 1998Feb 1, 2000Kuo; JeffreyHigh efficiency light for use in a traffic signal light, using LED's
US6036336 *May 8, 1998Mar 14, 2000Wu; Chen H.Light emitting diode retrofitting lamps for illuminated traffic signs
US6184628 *Nov 30, 1999Feb 6, 2001Douglas RuthenbergMulticolor led lamp bulb for underwater pool lights
US6685339 *Feb 14, 2002Feb 3, 2004Polaris Pool Systems, Inc.Sparkle light bulb with controllable memory function
US6774584 *Oct 25, 2001Aug 10, 2004Color Kinetics, IncorporatedMethods and apparatus for sensor responsive illumination of liquids
US6787999 *Oct 3, 2002Sep 7, 2004Gelcore, LlcLED-based modular lamp
US6799864 *May 24, 2002Oct 5, 2004Gelcore LlcHigh power LED power pack for spot module illumination
US6929384 *Feb 9, 2001Aug 16, 2005Nichia CorporationLed indicator lamp
US7207695 *Nov 22, 2004Apr 24, 2007Osram Sylvania Inc.LED lamp with LEDs on a heat conductive post and method of making the LED lamp
US7226189 *Apr 15, 2005Jun 5, 2007Taiwan Oasis Technology Co., Ltd.Light emitting diode illumination apparatus
US7255460 *Nov 7, 2005Aug 14, 2007Nuriplan Co., Ltd.LED illumination lamp
US7396146 *Aug 9, 2006Jul 8, 2008Augux Co., Ltd.Heat dissipating LED signal lamp source structure
US20070165408 *Jan 13, 2006Jul 19, 2007Chia-Mao LiHigh-power LED package structure
US20070230186 *Jul 26, 2006Oct 4, 2007Chen-Chun ChienLED projector light module
US20070236935 *Mar 31, 2006Oct 11, 2007Augux Co., Ltd.LED lamp conducting structure with plate-type heat pipe
US20080158887 *Feb 13, 2007Jul 3, 2008Foxconn Technology Co., Ltd.Light-emitting diode lamp
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8186852Jun 17, 2010May 29, 2012Elumigen LlcOpto-thermal solution for multi-utility solid state lighting device using conic section geometries
US8192057Jun 29, 2011Jun 5, 2012Elumigen LlcSolid state spot light assembly
US8197100 *Sep 10, 2010Jun 12, 2012Easy Eco Inc.LED lighting device
US8277082Jun 29, 2011Oct 2, 2012Elumigen LlcSolid state light assembly having light redirection elements
US8282250Jun 8, 2012Oct 9, 2012Elumigen LlcSolid state lighting device using heat channels in a housing
US8419218Jun 29, 2011Apr 16, 2013Elumigen LlcSolid state light assembly having light sources in a ring
US8430533 *Feb 14, 2011Apr 30, 2013Cooper Technologies CompanyDevices and methods for replacing LED light sources for LED-based luminaires
US8449137Jun 29, 2011May 28, 2013Elumigen LlcSolid state tube light assembly
US8567999 *Mar 16, 2011Oct 29, 2013Lg Electronics, Inc.Lighting apparatus
US20110317412 *Mar 16, 2011Dec 29, 2011Dongki PaikLighting apparatus
Classifications
U.S. Classification362/294, 362/249.01, 362/240, 362/800
International ClassificationF21V29/00
Cooperative ClassificationF21V29/004, F21V29/2206, F21W2131/103, F21Y2101/02, F21S8/02, F21S8/038, Y10S362/80
European ClassificationF21S8/03T, F21V29/22B, F21V29/00C2
Legal Events
DateCodeEventDescription
Mar 22, 2013ASAssignment
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LI, CHIA-MAO;REEL/FRAME:030064/0929
Owner name: TAIWAN GIGANTIC LIGHT ELECTRIC CORPORATION, LTD, T
Effective date: 20130306
Oct 25, 2012FPAYFee payment
Year of fee payment: 4