|Publication number||US7550912 B2|
|Application number||US 11/183,049|
|Publication date||Jun 23, 2009|
|Filing date||Jul 15, 2005|
|Priority date||Sep 27, 2004|
|Also published as||CA2573492A1, EP1800159A1, US20060067647, WO2006036403A1|
|Publication number||11183049, 183049, US 7550912 B2, US 7550912B2, US-B2-7550912, US7550912 B2, US7550912B2|
|Original Assignee||Idc, Llc|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (49), Non-Patent Citations (9), Referenced by (3), Classifications (6), Legal Events (7)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This application claims priority to U.S. Provisional Application No. 60/613,502, filed Sep. 27, 2004. The content of the aforementioned application is hereby incorporated by reference in its entirety.
The field of the invention relates to microelectromechanical systems (MEMS) and the packaging of such systems. More specifically, the field of the invention relates to a method and system of maintaining a partial vacuum in a display device, such as a MEMS device
2. Description of the Related Technology
Microelectromechanical systems (MEMS) include micro mechanical elements, actuators, and electronics. Micromechanical elements may be created using deposition, etching, and or other micromachining processes that etch away parts of substrates and/or deposited material layers or that add layers to form electrical and electromechanical devices. One type of MEMS device is called an interferometric modulator. As used herein, the term interferometric modulator or interferometric light modulator refers to a device that selectively absorbs and/or reflects light using the principles of optical interference. In certain embodiments, an interferometric modulator may comprise a pair of conductive plates, one or both of which may be transparent and/or reflective in whole or part and capable of relative motion upon application of an appropriate electrical signal. In a particular embodiment, one plate may comprise a stationary layer deposited on a substrate and the other plate may comprise a metallic membrane separated from the stationary layer by an air gap. As described herein in more detail, the position of one plate in relation to another can change the optical interference of light incident on the interferometric modulator. Such devices have a wide range of applications, and it would be beneficial in the art to utilize and/or modify the characteristics of these types of devices so that their features can be exploited in improving existing products and creating new products that have not yet been developed.
The system, method, and devices of the invention each have several aspects, no single one of which is solely responsible for its desirable attributes. Without limiting the scope of this invention, its more prominent features will now be discussed briefly. After considering this discussion, and particularly after reading the section entitled “Detailed Description of Certain Embodiments” one will understand how the features of this invention provide advantages over other display devices. The embodiments described herein provide a package structure and a method of manufacturing a package structure in ambient conditions.
An embodiment provides a method of fabricating a display device. A transparent substrate is provided. The transparent substrate has an interferometric modulator formed thereon. The interferometric modulator is configured to modulate light transmitted through the transparent substrate. A backplate is joined to the transparent substrate to form a package, which encapsulates the interferometric modulator. Gas pressure within the package is reduced.
According to another embodiment, a microelectromechanical systems device is provided. The device comprises a transparent substrate, an interferometric modulator formed on the transparent substrate, a backplate sealed to the transparent substrate to form a package having a cavity with at least a partial vacuum. The device may also include a vacuum housing configured to hold the package. The housing may configured to be connected to a vacuum device. The interferometric modulator is configured to modulate light transmitted through the transparent substrate.
According to yet another embodiment, a method of fabricating a display device is provided. A panel is provided; the panel comprises a substrate joined to a backplate, wherein the substrate has an interferometric modulator formed thereon and encapsulated within the panel. The interferometric modulator is configured to modulate light transmitted through the substrate. Gas pressure within the panel is reduced.
In accordance with another embodiment, a display device is provided. The display device comprises a substrate configured to transmit light therethrough, a modulating means for modulating light transmitted through the substrate, a backplate sealed to the substrate to form a package. The modulating means has a cavity therein. The cavity has a gas pressure less than atmospheric pressure. The display device may also include a vacuum housing configured to hold the package. The modulating means is formed on the substrate. The housing may be configured to be connected to a vacuum device.
These and other aspects of the invention will be readily apparent from the following description and from the appended drawings (not to scale), which are meant to illustrate and not to limit the invention, and wherein:
The following detailed description is directed to certain specific embodiments of the invention. However, the invention can be embodied in a multitude of different ways. In this description, reference is made to the drawings wherein like parts are designated with like numerals throughout. As will be apparent from the following description, the embodiments may be implemented in any device that is configured to display an image, whether in motion (e.g., video) or stationary (e.g., still image), and whether textual or pictorial. More particularly, it is contemplated that the embodiments may be implemented in or associated with a variety of electronic devices such as, but not limited to, mobile telephones, wireless devices, personal data assistants (PDAs), hand-held or portable computers, GPS receivers/navigators, cameras, MP3 players, camcorders, game consoles, wrist watches, clocks, calculators, television monitors, flat panel displays, computer monitors, auto displays (e.g., odometer display, etc.), cockpit controls and/or displays, display of camera views (e.g., display of a rear view camera in a vehicle), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., display of images on a piece of jewelry). MEMS devices of similar structure to those described herein can also be used in non-display applications such as in electronic switching devices.
One embodiment of the invention is a system and method for increasing the performance of a MEMS device. In this embodiment, the performance of the device is increased by decreasing the time required for the device to switch from one state to another. In one embodiment, the device is an interferometric modulator having a collapsible cavity. This embodiment of the interferometric modulator is configured to switch between a collapsed cavity state and an open cavity state, and the switch time is decreased by decreasing the viscosity of the gas filling the collapsible cavity. In one embodiment, the viscosity is decreased by forming at least a partial vacuum in the cavity. By decreasing the switch time, interferometric modulators in a modulator array can be switched more quickly, thereby advantageously increasing the refresh rate for a display device using the array, as will be described in more detail below.
One interferometric modulator display embodiment comprising an interferometric MEMS display element is illustrated in
The depicted portion of the pixel array in
The optical stacks 16 a and 16 b (collectively referred to as optical stack 16), as referenced herein, typically comprise of several fused layers, which can include an electrode layer, such as indium tin oxide (ITO), a partially reflective layer, such as chromium, and a transparent dielectric. The optical stack 16 is thus electrically conductive, partially transparent and partially reflective, and may be fabricated, for example, by depositing one or more of the above layers onto a transparent substrate 20. In some embodiments, the layers are patterned into parallel strips, and may form row electrodes in a display device as described further below. The movable reflective layers 14 a, 14 b may be formed as a series of parallel strips of a deposited metal layer or layers (orthogonal to the row electrodes of 16 a, 16 b) deposited on top of posts 18 and an intervening sacrificial material deposited between the posts 18. When the sacrificial material is etched away, the movable reflective layers 14 a, 14 b are separated from the optical stacks 16 a, 16 b by a defined gap 19. A highly conductive and reflective material such as aluminum may be used for the reflective layers 14, and these strips may form column electrodes in a display device.
With no applied voltage, the cavity 19 remains between the movable reflective layer 14 a and optical stack 16 a, with the movable reflective layer 14 a in a mechanically relaxed state, as illustrated by the pixel 12 a in
In one embodiment, the processor 21 is also configured to communicate with an array driver 22. In one embodiment, the array driver 22 includes a row driver circuit 24 and a column driver circuit 26 that provide signals to a display array or panel 30. The cross section of the array illustrated in
In typical applications, a display frame may be created by asserting the set of column electrodes in accordance with the desired set of actuated pixels in the first row. A row pulse is then applied to the row 1 electrode, actuating the pixels corresponding to the asserted column lines. The asserted set of column electrodes is then changed to correspond to the desired set of actuated pixels in the second row. A pulse is then applied to the row 2 electrode, actuating the appropriate pixels in row 2 in accordance with the asserted column electrodes. The row 1 pixels are unaffected by the row 2 pulse, and remain in the state they were set to during the row 1 pulse. This may be repeated for the entire series of rows in a sequential fashion to produce the frame. Generally, the frames are refreshed and/or updated with new display data by continually repeating this process at some desired number of frames per second. A wide variety of protocols for driving row and column electrodes of pixel arrays to produce display frames are also well known and may be used in conjunction with the present invention.
The display device 40 includes a housing 41, a display 30, an antenna 43, a speaker 44, an input device 48, and a microphone 46. The housing 41 is generally formed from any of a variety of manufacturing processes as are well known to those of skill in the art, including injection molding, and vacuum forming. In addition, the housing 41 may be made from any of a variety of materials, including but not limited to plastic, metal, glass, rubber, and ceramic, or a combination thereof. In one embodiment the housing 41 includes removable portions (not shown) that may be interchanged with other removable portions of different color, or containing different logos, pictures, or symbols.
The display 30 of exemplary display device 40 may be any of a variety of displays, including a bi-stable display, as described herein. In other embodiments, the display 30 includes a flat-panel display, such as plasma, EL, OLED, STN LCD, or TFT LCD as described above, or a non-flat-panel display, such as a CRT or other tube device, as is well known to those of skill in the art. However, for purposes of describing the present embodiment, the display 30 includes an interferometric modulator display, as described herein.
The components of one embodiment of exemplary display device 40 are schematically illustrated in
The network interface 27 includes the antenna 43 and the transceiver 47 so that the exemplary display device 40 can communicate with one ore more devices over a network. In one embodiment the network interface 27 may also have some processing capabilities to relieve requirements of the processor 21. The antenna 43 is any antenna known to those of skill in the art for transmitting and receiving signals. In one embodiment, the antenna transmits and receives RF signals according to the IEEE 802.11 standard, including IEEE 802.11(a), (b), or (g). In another embodiment, the antenna transmits and receives RF signals according to the BLUETOOTH standard. In the case of a cellular telephone, the antenna is designed to receive CDMA, GSM, AMPS or other known signals that are used to communicate within a wireless cell phone network. The transceiver 47 pre-processes the signals received from the antenna 43 so that they may be received by and further manipulated by the processor 21. The transceiver 47 also processes signals received from the processor 21 so that they may be transmitted from the exemplary display device 40 via the antenna 43.
In an alternative embodiment, the transceiver 47 can be replaced by a receiver. In yet another alternative embodiment, network interface 27 can be replaced by an image source, which can store or generate image data to be sent to the processor 21. For example, the image source can be a digital video disc (DVD) or a hard-disc drive that contains image data, or a software module that generates image data.
Processor 21 generally controls the overall operation of the exemplary display device 40. The processor 21 receives data, such as compressed image data from the network interface 27 or an image source, and processes the data into raw image data or into a format that is readily processed into raw image data. The processor 21 then sends the processed data to the driver controller 29 or to frame buffer 28 for storage. Raw data typically refers to the information that identifies the image characteristics at each location within an image. For example, such image characteristics can include color, saturation, and gray-scale level.
In one embodiment, the processor 21 includes a microcontroller, CPU, or logic unit to control operation of the exemplary display device 40. Conditioning hardware 52 generally includes amplifiers and filters for transmitting signals to the speaker 45, and for receiving signals from the microphone 46. Conditioning hardware 52 may be discrete components within the exemplary display device 40, or may be incorporated within the processor 21 or other components.
The driver controller 29 takes the raw image data generated by the processor 21 either directly from the processor 21 or from the frame buffer 28 and reformats the raw image data appropriately for high speed transmission to the array driver 22. Specifically, the driver controller 29 reformats the raw image data into a data flow having a raster-like format, such that it has a time order suitable for scanning across the display array 30. Then the driver controller 29 sends the formatted information to the array driver 22. Although a driver controller 29, such as a LCD controller, is often associated with the system processor 21 as a stand-alone Integrated Circuit (IC), such controllers may be implemented in many ways. They may be embedded in the processor 21 as hardware, embedded in the processor 21 as software, or fully integrated in hardware with the array driver 22.
Typically, the array driver 22 receives the formatted information from the driver controller 29 and reformats the video data into a parallel set of waveforms that are applied many times per second to the hundreds and sometimes thousands of leads coming from the display's x-y matrix of pixels.
In one embodiment, the driver controller 29, array driver 22, and display array 30 are appropriate for any of the types of displays described herein. For example, in one embodiment, driver controller 29 is a conventional display controller or a bi-stable display controller (e.g., an interferometric modulator controller). In another embodiment, array driver 22 is a conventional driver or a bi-stable display driver (e.g., an interferometric modulator display). In one embodiment, a driver controller 29 is integrated with the array driver 22. Such an embodiment is common in highly integrated systems such as cellular phones, watches, and other small area displays. In yet another embodiment, display array 30 is a typical display array or a bi-stable display array (e.g., a display including an array of interferometric modulators).
The input device 48 allows a user to control the operation of the exemplary display device 40. In one embodiment, input device 48 includes a keypad, such as a QWERTY keyboard or a telephone keypad, a button, a switch, a touch-sensitive screen, a pressure- or heat-sensitive membrane. In one embodiment, the microphone 46 is an input device for the exemplary display device 40. When the microphone 46 is used to input data to the device, voice commands may be provided by a user for controlling operations of the exemplary display device 40.
Power supply 50 can include a variety of energy storage devices as are well known in the art. For example, in one embodiment, power supply 50 is a rechargeable battery, such as a nickel-cadmium battery or a lithium ion battery. In another embodiment, power supply 50 is a renewable energy source, a capacitor, or a solar cell, including a plastic solar cell, and solar-cell paint. In another embodiment, power supply 50 is configured to receive power from a wall outlet.
In some implementations control programmability resides, as described above, in a driver controller which can be located in several places in the electronic display system. In some cases control programmability resides in the array driver 22. Those of skill in the art will recognize that the above-described optimization may be implemented in any number of hardware and/or software components and in various configurations.
The details of the structure of interferometric modulators that operate in accordance with the principles set forth above may vary widely. For example,
In embodiments such as those shown in
As discussed above, the interferometric modulators can be arranged in arrays to form a display device. The interferometric modulators can form pixels in the display device and, by modulating light reflected from an interferometric modulator, for example, by switching the interferometric modulator from a state in which the movable layer 14 a, 14 b and the cavity 19 are not collapsed to a state in which the movable layer 14 a, 14 b and the cavity 19 are collapsed, a pixel can be made to display various colors or dark or light. The time required for this switching is referred to herein as switch time.
It will be appreciated that an image on a display is typically created by updating or refreshing the state of each interferometric modulator in the display. Thus, the refresh rate is directly related to the switch time, i.e., the amount of time needed to change the state of an interferometric modulator. For this reason, display devices with high refresh rates generally provide a higher quality in comparison to display devices with a relatively lower refresh rate. Minimizing switch times of interferometric modulators is therefore desirable.
It will be appreciated that the movable layer 14 a, 14 b is configured to move against fluid or gas, e.g., air, in the cavity 19. The gas has a viscosity and exerts a pressure, which provides resistance against the movement of the movable layer 14 a, 14 b. This resistance in turn partially determines the switch time of the interferometric modulator 12 a, 12 b as it switches from one state to another. Thus, one embodiment of the invention is an interferometric modulator with a decreased switch time resulting from decreasing the viscosity of the gas in the cavity 19.
While the invention is not limited in theory, it has been found that the switch time for an interferometric modulator is highly dependent on the gas pressure within the interferometric modulator. Small decreases in gas pressure may result in large decreases in switch time. For example, the switch time decreases substantially as gas pressure within the interferometric modulator is lowered from atmospheric pressure to about ¼-⅛ atmospheric pressure. Accordingly, according to one embodiment, the switch time for an interferometric modulator is decreased by providing a partial vacuum in the cavity 19 to decrease the gas pressure.
The interferometric modulators 501 are preferably formed on a substrate 500. The substrate 500 may be a semi-transparent or transparent substance capable of having thin film, MEMS devices built upon it. Such transparent substances include, but are not limited to, glass, plastic, and transparent polymers.
As shown in
Perimeter supports 580 are positioned proximate the edges of the backplate 560 and serve to adhere the backplate 560 to the transparent substrate 500. In addition, the perimeter supports separate the transparent substrate 500 and the backplate 560. Preferably, the perimeter supports 580 comprise a bead of adhesive, e.g., epoxy. Other suitable materials for the perimeter supports 580 include, but are not limited to, Teflon®, metals, and polyamides. The skilled artisan will understand that, in this embodiment, the perimeter supports 580 do not necessarily need to hermetically seal the backplate 560 to the transparent substrate 500. The material for the perimeter supports 580 is preferably selected based on its outgassing properties.
A desiccant 502 can be applied to the backplate 560 to remove moisture from within the panel 550. Generally, any substance that can trap moisture while not interfering with the optical properties of the interferometric modulators 501 may be used as the desiccant material. Preferably, the desiccant 502 does not interfere with the optical properties of the interferometric modulators 501. Suitable desiccant materials include, but are not limited to, zeolites, calcium sulfate, calcium oxide, silica gel, molecular sieves, surface adsorbents, bulk adsorbents, and chemical reactants. Other desiccant materials include indicating silica gel, which is silica gel with some of its granules coated with cobalt chloride. The silica changes color as it becomes saturated with water. Calcium oxide is a material that relatively slowly absorbs water.
According to an embodiment, the panel 550 is sealed within a housing 706, preferably comprising panel supports 702 and a wall 704. The supports 702 and the wall 704 form an enclosed volume 720 that provides a substantially air-tight seal around the panel 550. As shown in
Advantageously, the reduced-pressure gas decreases the viscosity of the gas inside the cavities within the interferometric modulators 501, thereby decreasing the switch times for the interferometric modulators 501 and increasing the refresh rate of the display device 700. In one embodiment, the reduced gas pressure is less than about 0.85 atmospheres. In another embodiment, the reduced gas pressure is less than about 0.25 atmospheres and, in a third embodiment, the gas pressure is about 0.125 to about 0.25 atmospheres.
It will be appreciated that the gas passages 740 can optionally be provided with covers or valves 750 that open when the vacuum device 710 is engaged and that close when the vacuum device 710 is off. The covers 750 can be passive, e.g., opening in response to a pressure differential caused by generating a partial vacuum in the volume 720, or they can be active, e.g., having mechanical actuators that cause them to open or close at designated times. The covers 750 can prevent contaminants from entering the space 760 within the panel 550. In addition, in some embodiments, the vacuum device 710 is only engaged intermittently and covers 750 can be closed to maintain the pressure within the space 760 in the panel 550 during periods when the vacuum device 710 is not engaged.
In other embodiments, the housing 706 need not be substantially air-tight and the strength of the vacuum created by the vacuum device 710 is preferably increased to compensate for any air leakage into the housing 706. In addition, rather than being coupled through the volume 720, the space 760 within the panel 550 and open to the cavities within the interferometric modulators 501 can be directly connected, e.g., via the passages 740. Moreover, while illustrated as integral to the housing 706, the vacuum device 710 can be positioned at a distance from the housing 706 and connected to the housing 706 by a gas conduit (not shown).
In one embodiment, the panel 550 is not sealed within a housing 706. In this embodiment, an opening is formed (and later sealed) in the panel, preferably in the backplate 560. To create a partial vacuum in the cavities within the interferometric modulators 501, the panel 550 may be placed in a vacuum chamber so that a partial vacuum may be created by drawing gas out of the panel 550 through the opening.
The skilled artisan will understand that, according to this embodiment, the opening is preferably hermetically sealed after the partial vacuum is generated within the interferometric modulators 501 to hermetically seal the interferometric modulators having a lower gas pressure within the panel 550. It will also be understood that the perimeter supports 580 preferably comprise a hermetic seal, such as solders and welds, which are preferably formed of a tin alloy (e.g., tin lead, tin antimony). Another suitable material for creating a hermetic seal is a glass frit, which is preferably a glassy or ceramic paste that is fired after it is applied. Generally, it is desirable to minimize the permeation of water vapor into the panel 550 and thus control the environment inside the panel 550 and hermetically seal it to ensure that the environment remains constant. An example of a hermetic sealing process is disclosed in U.S. Pat. No. 6,589,625. When the humidity within the panel 550 exceeds a level beyond which surface tension from the moisture becomes higher than the restoration force of a movable element (e.g., the movable layers 14 a, 14 b described above) in the interferometric modulators 501, the movable element may become permanently stuck to the surface.
Alternatively, instead of placing the panel 550 in a vacuum chamber, a vacuum device, such as a vacuum pump, may be attached to the panel via the opening to generate a partial vacuum in the cavities within the interferometric modulators 501. It will be understood that in the embodiments without the housing 706, the covers 750 are not necessary.
With reference to
The skilled artisan will appreciate that once gas has been drawn out of the cavities of the interferometric modulators 501 and from the panel 550, it may be preferable to replace the removed gas with an inert gas, such as nitrogen or argon.
While the above detailed description has shown, described, and pointed out novel features of the invention as applied to various embodiments, it will be understood that various omissions, substitutions, and changes in the form and details of the device or process illustrated may be made by those skilled in the art without departing from the spirit of the invention. As will be recognized, the present invention may be embodied within a form that does not provide all of the features and benefits set forth herein, as some features may be used or practiced separately from others.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US3586926||Nov 27, 1968||Jun 22, 1971||Nippon Electric Co||Hermetically sealed semiconductor device with absorptive agent|
|US4977009||Mar 6, 1990||Dec 11, 1990||Ford Motor Company||Composite polymer/desiccant coatings for IC encapsulation|
|US5550373||Dec 30, 1994||Aug 27, 1996||Honeywell Inc.||Fabry-Perot micro filter-detector|
|US5559358||May 23, 1994||Sep 24, 1996||Honeywell Inc.||Opto-electro-mechanical device or filter, process for making, and sensors made therefrom|
|US5610438||Mar 8, 1995||Mar 11, 1997||Texas Instruments Incorporated||Micro-mechanical device with non-evaporable getter|
|US5936758||May 11, 1998||Aug 10, 1999||Texas Instruments Incorporated||Method of passivating a micromechanical device within a hermetic package|
|US5939785||Apr 3, 1997||Aug 17, 1999||Texas Instruments Incorporated||Micromechanical device including time-release passivant|
|US5986796||Nov 5, 1996||Nov 16, 1999||Etalon Inc.||Visible spectrum modulator arrays|
|US6040937||Jul 31, 1996||Mar 21, 2000||Etalon, Inc.||Interferometric modulation|
|US6226890||Apr 7, 2000||May 8, 2001||Eastman Kodak Company||Desiccation of moisture-sensitive electronic devices|
|US6284342 *||Jun 11, 1999||Sep 4, 2001||Tdk Corporation||Organic EL display assembly|
|US6379988||May 16, 2000||Apr 30, 2002||Sandia Corporation||Pre-release plastic packaging of MEMS and IMEMS devices|
|US6392144||Mar 1, 2000||May 21, 2002||Sandia Corporation||Micromechanical die attachment surcharge|
|US6472739||Nov 15, 1999||Oct 29, 2002||Jds Uniphase Corporation||Encapsulated microelectromechanical (MEMS) devices|
|US6474138||Nov 28, 2000||Nov 5, 2002||Honeywell International Inc.||Adsorption based carbon monoxide sensor and method|
|US6551838||Mar 2, 2001||Apr 22, 2003||Microchips, Inc.||Microfabricated devices for the storage and selective exposure of chemicals and devices|
|US6590157||Sep 21, 2001||Jul 8, 2003||Eastman Kodak Company||Sealing structure for highly moisture-sensitive electronic device element and method for fabrication|
|US6661084||Feb 25, 2002||Dec 9, 2003||Sandia Corporation||Single level microelectronic device package with an integral window|
|US6674159||Feb 25, 2002||Jan 6, 2004||Sandia National Laboratories||Bi-level microelectronic device package with an integral window|
|US6674562||Apr 8, 1998||Jan 6, 2004||Iridigm Display Corporation||Interferometric modulation of radiation|
|US6696645||May 8, 2002||Feb 24, 2004||The Regents Of The University Of Michigan||On-wafer packaging for RF-MEMS|
|US6740145||Aug 8, 2001||May 25, 2004||Eastman Kodak Company||Desiccants and desiccant packages for highly moisture-sensitive electronic devices|
|US6787897||Dec 20, 2001||Sep 7, 2004||Agilent Technologies, Inc.||Wafer-level package with silicon gasket|
|US6876071||Jul 1, 2002||Apr 5, 2005||Texas Instruments Incorporated||Masking layer in substrate cavity|
|US7060895||May 4, 2004||Jun 13, 2006||Idc, Llc||Modifying the electro-mechanical behavior of devices|
|US7123216||Oct 5, 1999||Oct 17, 2006||Idc, Llc||Photonic MEMS and structures|
|US7161094||May 18, 2006||Jan 9, 2007||Idc, Llc||Modifying the electro-mechanical behavior of devices|
|US20020024711||Oct 10, 2001||Feb 28, 2002||Iridigm Display Corporation, A Delaware Corporation||Interferometric modulation of radiation|
|US20020075551||Nov 20, 2001||Jun 20, 2002||Onix Microsystems, Inc||Enclosure for MEMS apparatus and method of using the same|
|US20020126364||Feb 19, 2002||Sep 12, 2002||Iridigm Display Corporation, A Delaware Corporation||Interferometric modulation of radiation|
|US20030054588||Dec 3, 2001||Mar 20, 2003||Reflectivity, Inc., A California Corporation||Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates|
|US20030062186||Sep 21, 2001||Apr 3, 2003||Eastman Kodak Company||Sealing structure for highly moisture-sensitive electronic device element and method for fabrication|
|US20030075794||Oct 23, 2001||Apr 24, 2003||Felton Lawrence E.||MEMS capping method and apparatus|
|US20030108306||Dec 12, 2001||Jun 12, 2003||Axsun Technologies, Inc.||MEMS tunable optical filter system with moisture getter for frequency stability|
|US20040061492||Sep 30, 2003||Apr 1, 2004||Lopes Vincent C.||Package with environmental control material carrier|
|US20040080035||Oct 16, 2003||Apr 29, 2004||Commissariat A L'energie Atomique||Integrated electromechanical microstructure comprising pressure adjusting means in a sealed cavity and pressure adjustment process|
|US20040100677||Nov 26, 2002||May 27, 2004||Reflectivity, Inc., A California Corporation||Spatial light modulators with light blocking/absorbing areas|
|US20040140557||Jan 21, 2003||Jul 22, 2004||United Test & Assembly Center Limited||Wl-bga for MEMS/MOEMS devices|
|US20040184133||Jun 24, 2003||Sep 23, 2004||Tao Su||Microsystem package structure|
|US20050074919||Jun 11, 2002||Apr 7, 2005||Reflectivity, Inc.||Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates|
|US20050253283||Sep 2, 2004||Nov 17, 2005||Dcamp Jon B||Getter deposition for vacuum packaging|
|US20060066935||Aug 19, 2005||Mar 30, 2006||Cummings William J||Process for modifying offset voltage characteristics of an interferometric modulator|
|EP0667548A1||Jan 18, 1995||Aug 16, 1995||AT&T Corp.||Micromechanical modulator|
|EP1418154A2||Oct 30, 2003||May 12, 2004||Samsung Electronics Co., Ltd.||Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate|
|JPH0268513A||Title not available|
|JPH03199920A||Title not available|
|WO1999052006A2||Apr 1, 1999||Oct 14, 1999||Etalon, Inc.||Interferometric modulation of radiation|
|WO2003026369A1||Sep 16, 2002||Mar 27, 2003||John Stafford||Latching micro magnetic relay packages and methods of packaging|
|WO2003056367A1||Dec 21, 2001||Jul 10, 2003||Nokia Corporation||Reflective flat panel display|
|1||EP Search Report for EP patent No. 05255700.6-2217.|
|2||International Search Report and Written Opinion for PCT/US05/013463.|
|3||International Search Report for PCT/US2005/030134, Dec. 19, 2005.|
|4||IPRP for PCT/US05/030134 filed Aug. 24, 2005.|
|5||Liang, Zhi-Hao et al., "A Low Temperature Wafer-Level Hermetic MEMS Package Using UV Curable Adhesive", Electronic Components and Technology Conference, 2004 IEEE, pp. 1486-1491.|
|6||Miles, M.W., Jan. 18, 2003, Interferometric modulation: MOEMS as an enabling technology for high-performance reflective displays, Proceedings of the Spie, Bellingham, VA. US., pp. 131-139:XP002324563.|
|7||Moraja, et al., Advanced Getter Solutions at Wafter Level to Assure High Reliability to the last Generations MEMS, IEEE Reliability Physics Symposium Proceedings, 2003, pp. 458-459.|
|8||Official Communication in European App. No. 05789959.3 dated Jun. 25, 2007.|
|9||Sparks, et al. Chip-Level Vacuum Packaging of Micromachines Using NanoGetters, IEEE Transactions on Advanced Packaging, vol. 26 Issue 3, Aug. 2003. pp. 277-282.|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US8410690||Feb 13, 2009||Apr 2, 2013||Qualcomm Mems Technologies, Inc.||Display device with desiccant|
|US20100206629 *||Feb 13, 2009||Aug 19, 2010||Qualcomm Mems Technologies, Inc.||Display device with desiccant|
|US20110185369 *||Jan 25, 2010||Jul 28, 2011||Canon Kabushiki Kaisha||Refresh of auxiliary display|
|U.S. Classification||313/495, 313/497, 313/496|
|Jul 15, 2005||AS||Assignment|
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