|Publication number||US7558933 B2|
|Application number||US 10/744,786|
|Publication date||Jul 7, 2009|
|Filing date||Dec 24, 2003|
|Priority date||Dec 24, 2003|
|Also published as||US8225063, US20050144370, US20090254699|
|Publication number||10744786, 744786, US 7558933 B2, US 7558933B2, US-B2-7558933, US7558933 B2, US7558933B2|
|Inventors||Richard K. Sita|
|Original Assignee||Ati Technologies Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (13), Non-Patent Citations (2), Referenced by (9), Classifications (7), Legal Events (4)|
|External Links: USPTO, USPTO Assignment, Espacenet|
The present invention relates generally to computer memory and more particularly to an adapter and method for allowing interconnection of a memory access device to synchronous dynamic random access memory (SDRAM) in at least two configurations.
Modern computing applications and components have created a need for faster access memory. Recently, SDRAM has gained popularity. Unlike older asynchronous memory systems, data transfers from and SDRAM are at a clocked rate. As the timing of SDRAM is very predicable, data can be transferred at a much higher rate than was possible with asynchronous random access memory designs. SDRAM and SDRAM access are, for example, detailed in Micron, MT46V32M4, MT46V16M8, and MT46V8M16 data sheets, the contents of which are hereby incorporated by reference.
At present, however, SDRAM is still quite costly. As a result, there is frequently a need in dedicated high performance memory systems to trade-off memory bandwidth (i.e. bits transferred per second) and storage capacity, for cost.
Typically, higher memory bandwidth may be achieved by transferring data in data units having increased bit sizes or at a higher rate.
So, for example, data transfer in data units of thirty-two bits can reach twice the memory bandwidth of data transfer in data units of sixteen bits. This, however, requires SDRAM modules having a larger data bus or multiple SDRAM modules interconnected to span accessed memory. Such re-configuration of memory to provide data units of increased bit size is often complex and requires chip and software re-design. Moreover, not all applications require the data unit bit size, that provides the memory bandwidth
Similarly, memory may be accessed at higher speeds. Indeed, memory system design has witnessed a steady increase in bus speeds. In fact, modern SDRAM manufacturing and design techniques are producing SDRAM modules having a high density and manufactured to tight tolerances, that often allow memory access in excess of conventional memory bus speeds. However, memory accessing devices such as central processing units (CPUs), graphics processors, video processors, direct memory access (DMA) controllers and the like are typically designed to operate at the more conservative, conventional memory bus speeds, and therefore do not access the SDRAM at these higher rates.
Accordingly, there is a need for a simple interface that allows interconnection of a memory access device SDRAM that provides flexibility in how interconnected random access memory may be configured, and the bandwidth with which the memory may be accessed.
In accordance, with the present invention, a memory interface allows access SDRAM by receiving a column address for a data read or write of a burst of data units. Each data unit in the burst has an expected bit size. The interface generates n(n>1) column memory addresses from the received column address. The interface accesses the synchronous dynamic memory to read or write n bursts of data at the n column memory addresses. Preferably, the SDRAM is clocked at n times the rate of the interconnected memory accessing device, and the memory units. The data units in the n bursts preferably have one nth the expected bit size. In this way, SDRAM may be accessed with high memory bandwidth, without requiring an increase in the size of data units in the SDRAM, and the associated data bus.
Conveniently, the interface may be operable in two separate modes or configurations. In one mode, SDRAM may be accessed in a conventional manner. In the second mode, it is accessed in multiple bursts for each received burst access.
The interface may form part of a memory accessing device, or may be a separate component for use with such a device.
Other aspects and features of the present invention will become apparent to those of ordinary skill in the art upon review of the following description of specific embodiments of the invention in conjunction with the accompanying figures.
In the figures which illustrate by way of example only, embodiments of the present invention,
Device interface 12 has device interconnect lines: write data lines DQ_DEV; write data strobes DQS_DEV; row address strobe RAS_DEV; column address strobe CAS_DEV; write enable WE_DEV; device address lines ADR_DEV; chip select CS_DEV.
SDRAM interconnect interface 14 has SDRAM memory interconnect lines: write data lines DQ_MEM; write data strobes DQS_MEM; row address strobe RAS_MEM; column address strobe CAS_MEM; address lines ADR_MEM; chip select CS_MEM; and write enable WE_MEM.
As further illustrated, device and memory data lines DQ_DEV and DQ_MEM for write accesses are interconnected by reformat block 16. Write data strobes (DQS_DEV and DQS_MEM) by reformat block 18; row address strobes, column address strobes, write enables, address lines and chip selects (CAS_DEV, ADR_DEV, WE_DEV, CS_DEV and CAS_MEM, ADR_MEM, WE_MEM, CS_MEM) by address generator/converter 20. Memory data lines (DQ_DEV and DQ_MEM) for read operations are interconnected by reformat block 22. Decoder/timing block 24 further provides adapter internal RAS_DETECT and CAS_DETECT, READ_DEV and READ_MEM signals, as detailed below.
Typically, an SDRAM module provides data from memory units and receives data to memory units by way of the same data lines. Communicating interfaces of interconnected memory accessing devices therefore typically include a two or three state receiver/transmitter interconnected to these data lines. Adapter 10 likewise includes two data transmit/receive blocks 32 and 34. Block 32 determines whether data is written to or read from DQS_MEM data lines of interconnected SDRAM by way of reformat block 16 or 22. Similarly, block 34 determines whether data is written to or read from DQS_DEV data lines of interconnected device. The data transmit/receive blocks 32 and 34 each take as inputs two separate sets of data lines, one set from reformat block 22 for reading to memory, the other set from reformat block 16 for writing to memory. Which of these sets is interconnected to DQS_MEM of interconnected SDRAM is determined by the state of block 32. Which of the sets is interconnected to DQS_DEV of an interconnected device is determined by the state of block 34. The states of blocks 32 and 34 are toggled by interconnected timing block 24. In the disclosed embodiment, blocks 32 and 34 are two state transmit/receive blocks. Absent a signal (READ_MEM, READ_DEV) from timing block 24, transmit/receive blocks 32 and 34 are in their transmit mode. Transmit/receive blocks 32 and 34 could, of course, be formed as a tri-state transmit/receive blocks.
Decoder of timing/decoder block 24 decodes various SDRAM access commands sent from an interconnected device to interconnected SDRAM. The decoder is more particularly illustrated in
Gate generation block of timing/decoder block 24 generates read commands to be provided to device transmit/receive block 34 and SDRAM transmit/receive block 32 upon decoding a read operation, as detailed below.
Device and memory clocks (CLK_DEV and CLK_MEM) are interconnected by synchronization block 26. Block 26 includes a conventional phase lock loop (PLL) that may derive the memory clock as a multiple of the device clock. As will become apparent, in one mode of operation block 26 generates a memory clock CLK_MEM=2xCLK_DEV.
An exemplary structure of address generator 20 is illustrated in
Blocks 16, 18, 22, 24, 26, 32, 34 and address generator 20 may be formed using conventional combinational and sequential logic in manners understood by those of ordinary skill, to translate SDRAM access instructions and data as detailed below.
In the illustrated embodiment, adapter 10 allows interconnection of a standard thirty bit SDRAM memory interface having thirty two data lines, in one of two configurations. In its first configuration, the SDRAM adapter 10 may be interconnected to two sixteen bit SDRAM modules 36 a and 36 b as illustrated in
In a second configuration, adapter 10 allows interconnection of a thirty-two bit device interface to a single, sixteen bit SDRAM module 38 as illustrated in
The configuration/mode of operation may be selected by an external signal at mode select input 28.
In order to appreciate the operation of adapter 10,
As illustrated, for a conventional burst write operation, an SDRAM column address is presented at the address lines of the SDRAM modules in the middle of the T0 clock cycle (signal 200). The column address signal line (CAS_DEV and CAS_MEM) is concurrently strobed (signal 212). Similarly, the write enable line (WE_DEV and WE_MEM) is strobed (signal 214). At the same time, a first burst of four data units A,B,C,D may be presented at data lines DQ_DEV and DQ_MEM (signal 204). Each data unit is presented for one half clock cycle. Presentation of data is strobed at the interconnected memory using the DQS_MEM lines (signal 207) thereby writing to the memory at the specified column address (this assumes that a row has already been opened in memory access instructions/signals not specifically illustrated).
A further burst may be written within the open row by presenting a new column address CN+4, two clock cycles after the beginning of the first column address (i.e., in the middle of clock cycle T3) at address lines ADR_DEV and ADR_MEM (signal 202). Again, the CAS_MEM (signal 216) may be strobed and write enable may be provided at WE_DEV and WE_MEM (signal 218). Again, data to be written may be presented on the data lines (DQ_MEM) one clock cycle later at T4 (signal 206), accompanied by strobing of the DQS_MEM line (signal 210). As will be appreciated, presentation of column addresses every second clock cycle and strobing of CAS line allows contiguous writing of bursts of data in accordance with conventional SDRAM access techniques.
Optionally, other rows in other banks of an interconnected SDRAM may be opened while data is being written to a particular bank, as is conventional with SDRAM addressing. This is illustrated in
At a later time (e.g., during clock cycle T6), further column addresses (signal 224) in the opened row of Rw may be presented at the address lines accompanied with a CAS strobe (signal 226). Data is read from the location specified by this column address and row Rw after the CAS latency, as presented at data lines DQ_MEM (signal 228). Interconnected SDRAM memory strobes DQS_MEM lines as illustrated during clock cycle T10 (signal 230) and onwards.
Transmit/receive blocks 32 and 34 are toggled to assume their read state by gate generator of block 24. That is, generator of block 24 generates READ_MEM and READ_DEV strobes after a delay specified by the CAS latency stored in CAS_LATENCY store of block 24, upon detection of a read command (WE=LOW+CAS=HI).
Now, adapter 10 operating in its second configuration, converts SDRAM data and command signals received at its device interface 12 to appropriate signals at its memory interface 14 to allow access to one or more SDRAM modules, in data units having a bit size that is a fraction (one nth) of the data unit size expected by the device accessing the SDRAM memory, but at a higher rate.
For purposes of illustration,
As illustrated, in response to receiving a column address CN, at ADR_DEV (signal 300) and accompanying column address strobe CAS_DEV (signal 312), two column addresses C2N and C2N+BURST(=C2N+4) are generated by address generator 20, at output ADR_MEM (signals 340 and 342).
As illustrated in
As data units within memory have half the bit size of data words at device interface 12, the addresses used at interconnected memory are twice the size of the address at the device. Generated memory column addresses C2N and C2N+4 are two memory clock cycles apart (i.e. spaced by a single memory clock cycle—in this case at the interface rate CLK_MEM) and are generated by address generator 20 one half a clock cycle after receipt of the command giving rise to their generation (signal 300). Associated CAS_MEM line is strobed (signal 364, 366) by address generator 20.
A burst of data at input data lines DQ_MEM (data units A,B,C,D—signals 304) is written to memory by reformat block 16 as two sequential and contiguous bursts of data (signal 344, 346) at DQ_MEM (data units aL, aH, bL, bH and cL, cH, dL, dH). Data at DQ_MEM is accompanied by data strobe signals 356 and 358 generated by reformat block 18 of adapter 10. Reformat block 18 converts the four device data strobes at DQS_DEV to two memory data strobes at DQS_MEM. Similarly, in response to receiving a column address CN+4 (signal 302) at ADR_DEV, two column addresses C2(n+4) and C2(n+4)+BURST=C2(n+4)+4 (signals 348, 350) are generated by address generator 20 at ADR_MEM on odd interface clock cycles. As memory access is a write access (as indicated by write enable signals 314, 318 at WE_DEV), corresponding write enable signals (signals 372, 374, 376, 378) are generate at memory write lines (WE_MEM). Again, the C2(n+4) and C2(n+4)+BURST signals are accompanied by CAS_MEM strobes (signals 368 and 370). Corresponding data at DQ_DEV (data units E,F,G,H—signals 306) is presented at DQ_MEM lines (as data units eL, eH, fL, fH and gL, gH, hL, hH) beginning with the even odd clock cycle immediately following the C2(n+4) address (signals 352 and 354).
Notably, each burst memory write access is translated into two burst accesses of the memory device by address generator 20. Conveniently, the two memory accesses are spaced by one memory clock cycle. This allows writing of the two bursts contiguously. Timing to address generator 20 (CAS_DETECT) and transmit/receive blocks 32 and 34 (READ_DEV, READ_MEM) is provided by block 24. That is, a burst access at device interface 12 at address CN, providing data units A,B,C,D is translated into two burst accesses at memory interface 14 at addresses C2N, C2N+4 providing data units aL,aH,bL,bH and cL,cH,dL, dH respectively (with A=aLaH, B=bLbH, C=cLcH, D=dldH). Similarly, a burst access of four data units at address CN+4 at device interface 12 is translated into two sequential burst accesses of four half sized data units at memory interface 14 at addresses C2(N+4), C2(N+4)+4.
Optionally, address generator 20 further translates a burst access at a column address with auto-precharge (used in SDRAM to close a currently accessed row or page) to two burst accesses, of which only the last (i.e. second) is an auto-precharge access. Typically, an auto-precharge is identified by a set bit in the provided address. For the example address generator 20, gates 56 and 64 monitor bit ten (10) of the provided address to identify an auto-precharge. In this way, the row pre-charge at the memory is not generated prematurely, and is masked for the first of two generated addresses, resulting from a column address with auto-precharge. Gate 64 ensures that bit ten is not masked by gate 56 for row addresses, and not for row addresses. This is illustrated in
Likewise, burst read access at column address CM is translated to two sequential read accesses by address generator 20. Notably, column address CM presented at address lines ADR_DEV (signal 324) and accompanying column address strobe at CAS_DEV (signal 326) in clock cycle T6 are translated to column address C2M and C2M+4 presented at ADR_MEM (signals 380, 382), accompanied by column address strobes generated at CAS_MEM (signals 384 and 386) by address generator 20. Interconnected memory responds by providing two sequential bursts qLqHrLrH and sLsHtLtH of data (signals 390, 392), beginning a number of clock cycles specified by the CAS latency of the memory.
Gate generator of block 24 (illustrated in
Data read on lines DQ_MEM is passed to reformat block 22 and to lines DQ_DEV. Reformat block 22 assembles the data from the two bursts from memory into a single burst of data units each having the word size expected by the device, with Q=qLqH, R=rLrH, S=sLsH, T=tltH. The reassembled single burst is presented at device data lines DQ_DEV (signal 328). Conveniently, the two bursts are received by transmit/receive block 30 after the CAS latency of the interconnected SDRAM memory, and immediately passed to reformat block 22. The assembled single burst is presented at data lines DQ_DEV after the CAS latency expected by the interconnected device.
Optionally, as in
Conveniently, by generating row address signal Rw and accompanying row address strobe (RAS_MEM) at ADR_MEM in odd memory clock cycles, while generating the CAS signals (CAS_MEM) in even clock cycles, adapter 10 is able to generate row addresses between column addresses, without impeding the performance of adapter 10. Gates 62 and 64 taking CLK_DEV as inputs ensure that column address signals are only generated on a low CLK_DEV (i.e. an odd cycle of CLK_MEM), while row address signals are only generated on a hi CLK_DEV (i.e. an even cycle of CLK_MEM).
Other conventional SDRAM commands involving the RAS_DEV signal are not synchronized or otherwise modified by adapter 10 and are kept in alignment with the state of the CAS_DEV and WE_DEV signals, and corresponding CAS_MEM and WE_MEM signals.
Operation of adapter 10 to translate commands and data from device to memory, and from memory to the device in its second configuration may be summarized with reference to tables 1, 2 and 3.
TRANSLATION OF ADDRESSES FOR READ
AND WRITE OPERATIONS
Column address CN
C2N and C2N+BURST
next odd memory
two memory clock
Column address with
C2N without precharge
next odd memory
C2N+BURST with auto-
precharge two memory
clock cycles later
Row address RW
next even memory
TRANSLATION OF DATA FROM DEVICE TO MEMORY
FOR WRITE OPERATIONS
Burst A, B, C, D
memory clock cycle
aL, aH, bL, bH
address (e.g. C2N)
cL, cH, dL, dH
TRANSLATION OF DATA FROM MEMORY TO DEVICE
FOR WRITE OPERATIONS
burst qL, qH, rL, rH on
one half burst
at memory interface
CAS latency after
Q, R on DQ_DEV
receipt of burst
at device interface,
receipt of low
and high data units
from SDRAM memory
*PERFORMED IN MULTIPLE BURSTS AS A RESULT OF TRANSLATION OF CN TO C2N AND C2N+BURST COLUMN ADDRESSES
A person of ordinary skill will now appreciate that adapter 10 could easily be modified to translate data and commands at interface 12 operate to read/write SDRAM at various integer multiples of the interface clock rates. Write data may be converted from one bit size to one nth the bit size for writing to SDRMA modules. Read data could similarly be converted from the read bit size to n times this bit size. Instead of issuing two column addresses for each burst access commands at memory interface 14 at device interface 12, adapter 10 could be modified to issue n burst access commands, each spaced by a clock cycle.
Translation to multiple burst access commands may be used to increase overall memory throughput, or may be accompanied by a reduction of the data unit size SDRAM to allow memory access at a uniform expected rate. That is, for each column address provided by a device, a burst of data having the same burst size as is expected by the device can be accessed, with each data burst from and to the SDRAM having one nth the size is presented at lines DQ_MEM.
Memory clock rate could be similarly adjusted relative to the device clock to provide data at the rate expected by the interconnected device.
Moreover, as will be appreciated, adapter 10 has been depicted as a separate component for interconnection between a memory accessing device and SDRAM. Adapter 10 could readily be formed as part of a memory accessing component, such as a CPU, GPU, DMA controller, a video processing unit, or the like or the like. So formed, device interface 12 and mode select input 28 may be entirely hidden, or need not be directly compatible with a conventional SDRAM interconnect.
As well, although adapter 10 has been described as interconnected with conventional SDRAM, adapter 10 could similarly function with dual data rate (DDR) SDRAM.
Of course, the above described embodiments are intended to be illustrative only and in no way limiting. The described embodiments of carrying out the invention are susceptible to many modifications of form, arrangement of parts, details and order of operation. The invention, rather, is intended to encompass all such modification within its scope, as defined by the claims.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US5560000 *||Jun 7, 1995||Sep 24, 1996||Texas Instruments Incorporated||Time skewing arrangement for operating memory in synchronism with a data processor|
|US5749086 *||Feb 29, 1996||May 5, 1998||Micron Technology, Inc.||Simplified clocked DRAM with a fast command input|
|US5805504 *||Nov 29, 1996||Sep 8, 1998||Nec Corporation||Synchronous semiconductor memory having a burst transfer mode with a plurality of subarrays accessible in parallel via an input buffer|
|US5960468 *||Apr 30, 1997||Sep 28, 1999||Sony Corporation||Asynchronous memory interface for a video processor with a 2N sized buffer and N+1 bit wide gray coded counters|
|US6205046 *||Oct 25, 1999||Mar 20, 2001||Nec Corporation||Synchronous dynamic random-access memory|
|US6209071 *||May 7, 1996||Mar 27, 2001||Rambus Inc.||Asynchronous request/synchronous data dynamic random access memory|
|US6370630||Mar 19, 1999||Apr 9, 2002||Ati International Srl||Method and apparatus for controlling data flow in a data processor|
|US20010021136 *||Feb 24, 2001||Sep 13, 2001||Bae Yong Cheol||Auto precharge control signal generating circuits for semiconductor memory devices and auto precharge control methods|
|US20010048623 *||Aug 7, 2001||Dec 6, 2001||Mitsubishi Denki Kabushiki Kaisha||Semiconductor memory device having a circuit for fast operation|
|US20030005216 *||Mar 6, 2002||Jan 2, 2003||Fujitsu Limited||Control device for semiconductor memory device and method of controlling semiconductor memory device|
|US20030151609 *||Feb 14, 2002||Aug 14, 2003||Mark Champion||Multi-sequence burst accessing for SDRAM|
|US20050066141 *||Sep 22, 2003||Mar 24, 2005||Choi Joo S.||Method and apparatus for accessing a dynamic memory device|
|JP2001282611A *||Title not available|
|1||DDR SDRAM/SGRAM Note, Samsung Electronics, n.d., MPP-JLEE-Q4-98.|
|2||Double Data Rate (DDR) SDRAM, Micron Technologies, Inc., 2003.|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US7965581 *||Feb 23, 2010||Jun 21, 2011||Elpida Memory, Inc.||System with controller and memory|
|US8213258||May 31, 2011||Jul 3, 2012||Elpida Memory, Inc.||System with controller and memory|
|US8379479||Jun 5, 2012||Feb 19, 2013||Elpida Memory, Inc.||System with controller and memory|
|US8593471||Jan 28, 2011||Nov 26, 2013||Hisilicon Technologies Co., Ltd.||Memory access method and access controller for a memory|
|US8644107||Jan 8, 2013||Feb 4, 2014||Elpida Memory, Inc.||System with controller and memory|
|US9214205||Jan 31, 2014||Dec 15, 2015||Ps4 Luxco S.A.R.L.||System with controller and memory|
|US20100149889 *||Feb 23, 2010||Jun 17, 2010||Elpida Memory, Inc.||System with controller and memory|
|US20110228618 *||May 31, 2011||Sep 22, 2011||Elpida Memory, Inc.||System with controller and memory|
|CN101794263B||Feb 3, 2010||Nov 21, 2012||深圳市海思半导体有限公司||Access method of storage unit and access controller|
|U.S. Classification||711/168, 711/105, 711/5|
|International Classification||G06F13/16, G06F12/00|
|Dec 24, 2003||AS||Assignment|
Owner name: ATI TECHNOLOGIES INC., CANADA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SITA, RICHARD K.;REEL/FRAME:014850/0594
Effective date: 20031223
|Mar 9, 2012||AS||Assignment|
Owner name: ATI TECHNOLOGIES ULC, CANADA
Free format text: CHANGE OF NAME;ASSIGNOR:ATI TECHNOLOGIES INC.;REEL/FRAME:027838/0574
Effective date: 20061025
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