|Publication number||US7570065 B2|
|Application number||US 11/365,358|
|Publication date||Aug 4, 2009|
|Filing date||Mar 1, 2006|
|Priority date||Mar 1, 2006|
|Also published as||US20070205776, WO2007103174A2, WO2007103174A3|
|Publication number||11365358, 365358, US 7570065 B2, US 7570065B2, US-B2-7570065, US7570065 B2, US7570065B2|
|Inventors||Divyasimha Harish, William D. Dallenbach, King Wong, John Schultz|
|Original Assignee||Loadstar Sensors Inc|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (104), Non-Patent Citations (3), Referenced by (11), Classifications (13), Legal Events (6)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This disclosure relates generally to technical fields of measuring devices and, in one embodiment, to a cylindrical capacitance force sensing apparatus and method.
A surface may be an external geometry of an object which may be present in a variety of conditions. For example, the surface may be an even surface or an uneven surface (e.g., which may make an object sitting on the surface wobbly). A force (e.g., a load, a pressure, etc.) may be applied on a measuring device (e.g., a force measuring device) which may sit on the surface.
The measuring device sitting on the uneven surface may be unstable (e.g., not constant, fluctuating, etc.). When a load is applied on the unstable measuring device, the measuring device may produce an error in measurement (e.g., as different values may be obtained for the load weighed on the measuring device because the load may exert different forces when the measuring device vacillates between a ridge and a valley of the uneven surface).
The measuring device may come in a variety of shapes. A shape of a surface of the measuring device that comes in contact with the force may affect deflection and/or bending of the surface (e.g., thereby increasing and/or decreasing a sensitivity of the measurement). The shape of the surface may also affect a wear and tear of the measuring device (e.g., thus durability of the measuring device) due to a strain and/or stress put on the surface.
A cylindrical capacitance force sensing device/method is disclosed. In one aspect, an apparatus includes a capacitor having an upper conductive surface and a lower conductive surface parallel to the upper conductive surface, a cylindrical housing (e.g., the cylindrical housing may encompass a reference capacitor to compensate an error in a measurement based on an environmental condition) with a cover plate to encompass the capacitor, and a sensor in the cylindrical housing (e.g., which may be made of a conductive material and/or a nonconductive material to isolate any electronic module in the cylindrical housing from an external electromagnetic noise) to generate a measurement based on a change in a distance between the upper conductive surface and the lower conductive surface when the cover plate is deflected by a load applied on the cover plate.
One or more (e.g. three) support bases (e.g., a shape of one end of the support bases contacting a mounting surface is designed to optimize a contact between the cylindrical housing and the mounting surface when the support bases are affixed on the mounting surface) may be adjoined (e.g., welded, molded, milled, etc) to a bottom surface of the cylindrical housing. For example, the support bases may be a convex shape or a saw-blade shape. Also, a groove (e.g., where a depth and a width of the groove is mathematically engineered to configure a sensitivity of a deflection of the cover plate) may be formed on a side or both sides of the cover plate to substantially confine the deflection of the cover plate in the groove.
Further, a modular spacer may be placed between the cover plate and the upper conductive surface to provide a gap between the upper conductive surface and the lower conductive surface and/or to buffer an effect of the load on the upper conductive surface. A top nut affixed on a center of the cover plate and a support structure associated with the load may be fastened to an upper inner chamber of the top nut using an upper fastener (e.g., while the cover plate, the modular spacer and/or the upper conductive surface may be fastened to a lower inner chamber of the top nut using a lower fastener).
The apparatus may also include a layered printed circuit board (e.g., the layered printed circuit board may include a ground plane layer, a power plane layer, and one or more signaling layers having a circuit which generates the measurement encased by the ground plane layer and the power plane layer associated with the sensor). The signaling layers may further include a circuit to wirelessly communicate the measurement with a data processing system.
In another aspect, a method includes applying a load on top of a housing which encompasses a capacitive sensor having two parallel conductive surfaces to produce a deflection of a cover plate of the housing, automatically generating a measurement from the capacitive sensor when a distance between the two parallel conductive surfaces is changed due to the deflection of the cover plate, and decreasing an error in the measurement through stabilizing the housing to a mounting surface. The method may further include changing a thickness of a modular spacer placed between the cover plate of the housing and an upper conductive surface of the two parallel conductive surfaces to determine (e.g., set up, configure, calibrate, etc.) the distance (e.g., initial distance) between the two parallel conductive plates.
The method may also include forming a groove on a side or both sides of the cover plate to confine (e.g., substantially) the deflection of the cover plate due to the load in the groove (e.g., a depth and a width of the groove is mathematically calibrated to configure a rate of the deflection). The method may further include masking one or more signaling layers (e.g., which may further include a circuit to communicate an alarm signal when the load exceeds a threshold value) of a layered printed circuit board associated with the capacitive sensor between a power plane layer and a ground plane layer to reduce an external electromagnetic noise. In addition, the method may further include varying a size of a cylindrical object protruding from a bottom surface of a top nut coupled to the cover plate to configure a deflection rate of the cover plate.
The method may be executed in a form of a machine-readable medium embodying a set of instructions that, when executed by a machine, cause the machine to perform any of the operations disclosed herein. Other features will be apparent from the accompanying drawings and from the detailed description that follows.
Example embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements and in which:
Other features of the present embodiments will be apparent from the accompanying drawings and from the detailed description that follows.
Cylindrical capacitance force sensing apparatus/method is disclosed. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the various embodiments. It will be evident, however, to one skilled in the art that the various embodiments may be practiced without these specific details. An example embodiment provides methods and apparatuses to automatically generate a measurement associated with a capacitor based on a change in a distance between two parallel conductive surfaces forming the capacitor. The change in the distance between the two parallel conductive surfaces may take place when a cover plate of a cylinder encompassing the capacitor is deflected by a load applied on the cover plate, thereby pressing down (e.g., causing to move down) an upper conductive surface of the two parallel conductive surface towards the lower conductive surface (e.g., hence a change in capacitance of the capacitor). A reference capacitor may be used to adjust the measurement based on at least one environmental condition.
In addition, in another embodiment, a method may include applying a load on top of a housing which encompasses a capacitive sensor having two parallel conductive surfaces to produce a deflection in a cover plate of the housing, automatically generating a measurement from the capacitive sensor when a distance between the two parallel conductive surfaces is changed due to the deflection of the cover plate, and decreasing an error in the measurement through stabilizing the housing to a mounting surface. Also, the method may be in a form of a machine-readable medium embodying a set of instructions that, when executed by a machine, cause the machine to perform any method disclosed herein. Example embodiments of a method and an apparatus, as described below, may be used to provide a high-accuracy, low-cost, and high-longevity load sensing device (e.g., load sensors, pressure sensors, etc.). It will be appreciated that the various embodiments discussed herein may/may not be the same embodiment, and may be grouped into various other embodiments not explicitly disclosed herein.
In one example embodiment, a force 112 (e.g., a load, a weight, a pressure, etc.) may be applied on top of the top nut 100 deflecting the cover plate 102. The cover plate 102 deflected by the force 112 may move down an upper sensor printed circuit board (PCB) 612 of
As illustrated in
In another example embodiment, different shapes of the support bases 508 may be utilized to optimize the contact between the force-measuring device 150 and the surface.
The consolidated PCB 720 also has an upper surface 724 (e.g., which may be designed in a different shape) painted (e.g., sputtered, coated, etc.) on a bottom surface of the consolidated PCB 720. A surface area of the upper surface 724 (e.g., as well as the lower surface 730) of the reference capacitor may be substantially larger than an area of the lower ring surface 722 (e.g., as well as the upper ring surface 614) of the sensor capacitor to reduce the amount of amplification required when generating a measurement of the force 112 applied to the cover plate 102 in one embodiment.
The lower reference sensor PCB 728 of
The cover plate 802, a modular spacer 810, and an upper sensor PCB 812 is adjoined together via fastening with a screw 818 to a bottom inner chamber of a top nut 800. A consolidated PCB 820, a reference spacer 826, and a lower reference sensor PCB 828 may be coupled (e.g., screwed onto, bonded, etched, glued, affixed, etc.) to the bottom plate 806.
A deflection of the cover plate 802 may cause a change in a distance between the upper sensor PCB 812 and the consolidated PCB 820. The change in the distance may bring about a change in capacitance of a sensor capacitor (e.g., the sensor capacitor may be formed by two parallel conductive surfaces—such as the upper ring surface 614 painted on a bottom surface of the upper sensor PCB 812 and the lower ring surface 722 painted on a top surface of the consolidated PCB 820 as illustrated in
In another embodiment, a reference capacitor formed by an upper conductive surface (e.g., the upper surface 724 of
If a user were to design the force-measuring device 150 of
A deflection rate of a material (e.g., the cover plate 902, the housing of the force-measuring device) may be determined by a number of factors (e.g., depending on a type of the material, a size of an object, a geometry of the object, and forces applied to the object). Here, the geometry of the cover plate (e.g., in a circular shape) may be aimed to provide a lower resistance to the deflection of the cover plate 902, thereby allowing the cover plate of the circular shape to bend more readily than a cover plate of a different shape (e.g., a square shape).
This can be determined from a calculation of a second moment of area (e.g., also known as a second moment of inertia) for a number of geometries. The second moment of area is a property of an object that is used to predict the object's resistance to bending and deflection. For instance, the second moment of area of the object measures the object's ability to resist bending. Hence, the less the second moment of area is the more bendable the object becomes.
The second moment area of a circle (e.g., R as a radius of the circle) is calculated by a formula, i.e., I=πR4/4. The second moment area of a square (e.g., 2R as a side of the square) is calculated by a different formula, i.e., I=16R4/12. Based on a comparison between the second moment of area of the circle and the second moment of area of the square, it may be determined that the second moment area of the circle is less than the second moment area of the square. This may mean the resistance of a circular object against a force being applied on it may be less than the resistance of a square object, hence more bending of the circular object giving a greater change in distance between the two parallel conductive surfaces than the square object.
In another example embodiment, a groove may be formed (e.g., by cutting, etching, molding, milling, etc) to substantially confine the force 900 within a radius of the groove. The radius of the groove is less than the radius of the cover plate 902 (e.g., in a circular shape), hence the second moment area of the cover plate 902 with the groove may be less than the second moment area of the cover plate 902 without the groove. Thus, the groove will give higher deflection of the cover plate 902, hence more distance change in the two parallel conductive surfaces of the capacitive sensor.
In yet another example embodiment, a proper size of a cylindrical object (e.g., lower cylinder 208 of
Another effect of the force 900 being applied on the cover plate 902 may be deformation (e.g., a change in shape due to the force) of the cover plate 902 and/or the housing. This may be a result of tensile (e.g., pulling), compressive (e.g., pushing), shear, bending and/or torsion (e.g., twisting) forces. In
A metal fatigue may be faults introduced at the molecular level with each deformation. In some cases, a material deformed only within the elastic (e.g., transient in nature) range may not be returned completely to its original state even after forces on the material are removed. As such, after many deformations, cracks will begin to appear, followed soon after by a fracture, with no apparent plastic (e.g., permanent in nature) deformation in between. In one example embodiment, the cover plate 902 of a circular shape may be used to evenly distribute the forces external and/or internal to the cover plate 902, as illustrated in
In another embodiment, the cover plate may be square. This may result in non-uniform forces of compression along the top of the cover plate 902 and non-uniform forces of tension along the bottom of the cover plate 902 because a distance between a center of the cover plate and the edge of the cover plate may be different depending on a location and/or direction of the forces. For example, the shortest distance between the center of the cover plate 902 and the edge of the cover plate 902 may be “D”, whereas the longest distance between the center of the cover plate 902 and the edge of the cover plate 902 may be “1.414*D.” The differences in the forces may cause more wear and tear in a location where a greater compression and/or tension is being applied. Although a failure may require thousands, millions, billions, or trillions of deformations, some objects (e.g., because of their shapes) may be more prone to wear and tear than others.
The force-measuring device 1050B includes a transmitter/receiver circuit 1008 and a wireless interface controller 1010 (e.g., for wireless communication), a battery 1012 (e.g., to sustain as a standalone device), and an alarm circuit 1014 (e.g., to alert a user when the force to the force-measuring device 1050B is greater than a threshold value and/or when the battery is almost out). The transmitter/receiver circuit 1008 and/or the wireless interface controller 1010 may be integrated into the processing module 1114 of
A data processing system 1006 may receive data (e.g., output data measuring a force and/or a load, etc.) from the force-measuring device 1050A and/or the force-measuring device 1050B through the network 1000. In one embodiment, the data processing system 1006 analyzes data (e.g., measurements) generated by various operation of a force-measuring device (e.g., the force-measuring device 150). In another example embodiment, a universal serial bus (USB) may be included in the signaling layer (e.g., of the layered PCB 732 of
Next, a change in capacitance 1106 may be calculated based on the change in the distance between the two plates forming the sensor capacitor. The change in capacitance 1106, a change in a voltage 1108, and/or a change in a frequency 1110 may also be calculated to generate a measurement (e.g., an estimation of the force 1100 applied to the sensor 1102). Data which encompasses the change in capacitance 1106, the change in voltage 1108, and/or the change in frequency 1110 may be provided to a digitizer module 1112 (e.g., an analog-to-digital converter). Lastly, the digitizer module 1112 may work with a processing module 1114 (e.g., a microprocessor which may be integrated in a signaling circuit of the layered PCB 732 of
An applied weight 1214 (e.g., of a person sitting on a seat an automobile) may exert a force on the weight measuring device 1250. A top nut 1200 may provide a junction point between the upper bolt 1204 to the seat 1202 and an upper surface of the weight measuring device 1250 (e.g., the upper surface of the weigh measuring device 1250 may be similar to the cover plate 102 in
A thickness of a modular spacer placed between the cover plate of the housing and an upper conductive surface (e.g., the upper ring surface 614 of
In operation 1312, one or more signaling layers (e.g., which may include a circuit to communicate an alarm signal when the force exceeds a threshold value and/or a universal serial bus) of a layered PCB associated with the capacitive sensor may be masked between a power plane layer and a ground plane layer to reduce an external electromagnetic noise. A size of a cylindrical object protruding from a bottom surface of a top nut coupled to a cover plate may be varied in operation 1314 to configure the deflection rate of the cover plate.
Although the present embodiments have been described with reference to specific example embodiments, it will be evident that various modifications and changes may be made to these embodiments without departing from the broader spirit and scope of the various embodiments. For example, the signaling layer of the layered PCB 732 of
For example, the digitizer module 1112 and/or the processing module 1114 may be enabled using software and/or using transistors, logic gates, and electrical circuits (e.g., application specific integrated ASIC circuitry) such as a digitizer circuit and/or a processing circuit. In addition, it will be appreciated that the various operations, processes, and methods disclosed herein may be embodied in a machine-readable medium and/or a machine accessible medium compatible with a data processing system (e.g., a computer system), and may be performed in any order (e.g., including using means for achieving the various operations). Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US3336525||Feb 28, 1966||Aug 15, 1967||Kaman Aircraft Corp||Variable impedance displacement transducer|
|US3646433||Apr 20, 1970||Feb 29, 1972||Eilersen Nils Aage Juul||Circuit for comparing the capacitance of capacitance elements|
|US3698249||Aug 3, 1970||Oct 17, 1972||Umc Electronics Co||Fluid pressure monitoring system|
|US3805150 *||Sep 27, 1972||Apr 16, 1974||Ade Corp||Environment immune high precision capacitive gauging system|
|US3859575||Feb 11, 1974||May 3, 1988||Title not available|
|US3880008||Apr 2, 1973||Apr 29, 1975||Eilersen Nils Aage Juul||Arrangement for occasionally determining the pressure in a hydraulic or pneumatic system|
|US4042876||Apr 29, 1976||Aug 16, 1977||The United States Of America As Represented By The United States Energy Research And Development Administration||Eddy current gauge for monitoring displacement using printed circuit coil|
|US4054833||Jun 11, 1976||Oct 18, 1977||Setra Systems, Inc.||Capacitance measuring system|
|US4084438||Mar 29, 1976||Apr 18, 1978||Setra Systems, Inc.||Capacitive pressure sensing device|
|US4093915||Jun 29, 1977||Jun 6, 1978||Setra Systems, Inc.||Capacitance measuring system|
|US4175428||Dec 27, 1977||Nov 27, 1979||Eilersen Nils A J||Capacitive dynamometer|
|US4227418||Sep 24, 1979||Oct 14, 1980||Fischer & Porter Company||Capacitive pressure transducer|
|US4229776||Nov 21, 1978||Oct 21, 1980||Vaisala Oy||Capacitive capsule for aneroid pressure gauge|
|US4288835 *||Apr 16, 1979||Sep 8, 1981||The Bendix Corporation||Pressure sensor|
|US4358814||Oct 27, 1980||Nov 9, 1982||Setra Systems, Inc.||Capacitive pressure sensor|
|US4382479||May 19, 1981||May 10, 1983||Setra Systems, Inc.||Weighing system|
|US4383586||May 19, 1981||May 17, 1983||Setra Systems, Inc.||Adjustable linkage|
|US4384496 *||Apr 21, 1981||May 24, 1983||Gladwin Michael T||Capacitive load measuring device|
|US4386312||Apr 24, 1981||May 31, 1983||Setra Systems, Inc.||Linear capacitive sensor system|
|US4433742||May 19, 1981||Feb 28, 1984||Setra Systems, Inc.||Linear motion linkage|
|US4434203||Oct 27, 1980||Feb 28, 1984||Setra Systems, Inc.||Diaphragm|
|US4434451||Aug 3, 1981||Feb 28, 1984||Delatorre Leroy C||Pressure sensors|
|US4448085||May 19, 1981||May 15, 1984||Setra Systems, Inc.||Force transducer|
|US4463614||Mar 18, 1982||Aug 7, 1984||Setra Systems, Inc.||Force transducer|
|US4464725||Oct 6, 1983||Aug 7, 1984||Setra Systems, Inc.||Temperature compensated measuring system|
|US4513831||May 9, 1983||Apr 30, 1985||Setra Systems, Inc.||Weighing system|
|US4550611 *||Jan 5, 1984||Nov 5, 1985||Motorola, Inc.||Electronic pressure transducer|
|US4558600||May 13, 1983||Dec 17, 1985||Setra Systems, Inc.||Force transducer|
|US4603308||Jun 24, 1985||Jul 29, 1986||Setra Systems, Inc.||Temperature stable oscillator|
|US4649759||Jan 25, 1985||Mar 17, 1987||Setra Systems, Inc.||Force transducer|
|US4846293||Oct 12, 1988||Jul 11, 1989||Setra Systems, Inc.||Humidity control system for a scale|
|US4864463 *||Apr 19, 1988||Sep 5, 1989||Allied-Signal Inc.||Capacitive pressure sensor|
|US4899600||Mar 16, 1987||Feb 13, 1990||Setra Systems, Inc.||Compact force transducer with mechanical motion amplification|
|US4949054||Aug 24, 1988||Aug 14, 1990||Setra Systems, Inc.||Temperature stable oscillator|
|US5023966||Jul 31, 1990||Jun 18, 1991||Eilersen Jens J||Piece of furniture|
|US5024099||Nov 20, 1989||Jun 18, 1991||Setra Systems, Inc.||Pressure transducer with flow-through measurement capability|
|US5078220||Aug 10, 1990||Jan 7, 1992||Setra Systems, Inc.||Multiple sensor capacitive measurement system|
|US5115676||Jan 10, 1990||May 26, 1992||Setra Systems, Inc.||Flush-mounted pressure sensor|
|US5150275||Jul 1, 1991||Sep 22, 1992||Setra Systems, Inc.||Capacitive pressure sensor|
|US5194819||Aug 10, 1990||Mar 16, 1993||Setra Systems, Inc.||Linearized capacitance sensor system|
|US5302894||Feb 12, 1990||Apr 12, 1994||Micro-Epsilon Messtechnik Gmbh & Co. Kg||Noncontacting displacement measuring system having an electric field shield|
|US5379653 *||Oct 28, 1992||Jan 10, 1995||K-Tron Technologies, Inc.||Force measuring device|
|US5442962||Aug 20, 1993||Aug 22, 1995||Setra Systems, Inc.||Capacitive pressure sensor having a pedestal supported electrode|
|US5542300||Jan 24, 1994||Aug 6, 1996||Setra Systems, Inc.||Low cost, center-mounted capacitive pressure sensor|
|US5604315||Jan 12, 1995||Feb 18, 1997||Setra Systems, Inc.||Apparatus using a feedback network to measure fluid pressures|
|US5705751||Jun 7, 1995||Jan 6, 1998||Setra Systems, Inc.||Magnetic diaphragm pressure transducer with magnetic field shield|
|US5798462||Nov 6, 1996||Aug 25, 1998||Setra Systems, Inc.||Magnetic position sensor with magnetic field shield diaphragm|
|US5900592 *||Aug 29, 1997||May 4, 1999||Lockheed Martin Energy Research Corp.||Load sensing system|
|US5939639||Dec 4, 1997||Aug 17, 1999||Setra Systems, Inc.||Pressure transducer housing with barometric pressure isolation|
|US6014800||Jan 26, 1999||Jan 18, 2000||Setra Systems, Inc.||Method of making a pressure transducer having a tensioned diaphragm|
|US6019002||Dec 2, 1997||Feb 1, 2000||Setra Systems, Inc.||Pressure transducer having a tensioned diaphragm|
|US6026694 *||Mar 30, 1998||Feb 22, 2000||Serena Industries Incorporated||Linear force sensing device|
|US6180892||Jun 22, 1999||Jan 30, 2001||Setra Systems, Inc.||Mixing scale|
|US6191722||Jan 14, 1999||Feb 20, 2001||Setra Systems, Inc.||Pulse width modulation digital to analog converter|
|US6205861||Jan 22, 1999||Mar 27, 2001||Setra Systems, Inc.||Transducer having temperature compensation|
|US6257068||Nov 15, 1999||Jul 10, 2001||Setra Systems, Inc.||Capacitive pressure sensor having petal electrodes|
|US6316948||Jul 1, 1998||Nov 13, 2001||Setra Systems, Inc.||Charge balance network with floating ground capacitive sensing|
|US6345543 *||Oct 6, 1999||Feb 12, 2002||Takata Corporation||Seat weight measuring apparatus|
|US6487911 *||Nov 21, 2000||Dec 3, 2002||Texas Instruments Incorporated||Pressure sensor apparatus|
|US6496019||Aug 18, 2000||Dec 17, 2002||Setra Systems, Inc.||Temperature compensated pressure sensor network|
|US6532834||Aug 6, 1999||Mar 18, 2003||Setra Systems, Inc.||Capacitive pressure sensor having encapsulated resonating components|
|US6718827||Nov 15, 2002||Apr 13, 2004||Setray Systems, Inc.||Center-mount capacitive sensor with overload protection|
|US6789429||Apr 8, 2003||Sep 14, 2004||Setra System, Inc.||Capacitive pressure sensor having encapsulated resonating components|
|US20050066742||Mar 27, 2002||Mar 31, 2005||Eilersen Nils Aage Juul||Capacitive dynamometer|
|US20050132820||Jun 7, 2004||Jun 23, 2005||Eilersen Nils A.J.||Sealed load cell|
|US20050229710 *||Aug 10, 2004||Oct 20, 2005||O'dowd John||Capacitive sensor|
|US20060065973 *||Sep 28, 2005||Mar 30, 2006||Loadstar Sensors, Inc.||Gap-change sensing through capacitive techniques|
|US20070193361 *||Feb 20, 2006||Aug 23, 2007||Davie/Coffee Technologies, LLC||Compressive load sensor by capacitive measurement|
|CH409439A||Title not available|
|DE2514511A1||Apr 3, 1975||Oct 30, 1975||Rosemount Inc||Kapazitiver messfuehler|
|DE3718292A1||May 30, 1987||Oct 22, 1987||Harald Helpert||Colpitts-type crystal oscillator with wide pulling range|
|DE4330808A1||Sep 10, 1993||Mar 16, 1995||Klaus Dr Ing Nordmann||Device for measuring the machining forces of tools|
|DE4420691C1||Jun 14, 1994||Jan 18, 1996||Bizerba Gmbh & Co Kg||Force measurement cell esp. for use in weighing balances|
|EP0074574A1||Sep 2, 1982||Mar 23, 1983||The Perkin-Elmer Corporation||Flow-through fluid pressure transducer|
|EP0131024B1||Jan 6, 1984||Oct 1, 1986||EILERSEN, Nils Age Juul||Capacitance measuring circuit|
|EP0335385A2||Mar 30, 1989||Oct 4, 1989||Nikkiso Co., Ltd.||Method of and apparatus for detecting an occlusion of liquid transfusion tube|
|EP0340190A1||Apr 24, 1989||Nov 2, 1989||Jens Juul Eilersen||Back-support arrangement and furniture in connection herewith|
|EP0340190B1||Apr 24, 1989||Jul 29, 1992||Jens Juul Eilersen||Back-support arrangement and furniture in connection herewith|
|EP0412926A1||Jul 25, 1990||Feb 13, 1991||Jens Juul Eilersen||A piece of furniture|
|EP0412926B1||Jul 25, 1990||Apr 13, 1994||Jens Juul Eilersen||A piece of furniture|
|EP0431067A4||Aug 17, 1989||Jan 15, 1992||Setra Systems, Inc.||Temperature stable oscillator|
|EP0438413A4||Jun 12, 1989||Oct 30, 1991||Setra Systems, Inc.||Humidity control system for a scale|
|EP0438413B1||Jun 12, 1989||Mar 3, 1993||Setra Systems, Inc.||Humidity control system for a scale|
|EP0500783A4||Nov 5, 1990||Feb 24, 1993||Setra Systems, Inc.||Pressure transducer with flow-through measurement capability|
|EP0500783B1||Nov 5, 1990||Oct 16, 1996||Setra Systems, Inc.||Pressure transducer with flow-through measurement capability|
|EP0714505A4||Aug 12, 1994||Feb 26, 1997||Setra Systems Inc||Capacitive pressure sensor|
|EP0714505B1||Aug 12, 1994||Feb 28, 2001||Setra Systems, Inc.||Capacitive pressure sensor with adjustable feed through|
|EP0741906A4||Jan 20, 1995||Apr 15, 1998||Setra Systems Inc||Low cost, center-mounted capacitive pressure sensor|
|EP0741906B1||Jan 20, 1995||Jun 21, 2000||Setra Systems, Inc.||Low cost, center-mounted capacitive pressure sensor|
|EP0830577A4||Jun 3, 1996||May 20, 1998||Setra Systems Inc||Magnetic relative position transducer|
|EP0969287A2||Apr 28, 1999||Jan 5, 2000||Setra Systems, Inc.||Charge balance network with floating ground capacitive sensing|
|EP1038161A4||Nov 16, 1998||Apr 25, 2001||Setra Systems Inc||Pressure transducer having a tensioned diaphragm|
|EP1038161B1||Nov 16, 1998||May 14, 2003||Setra Systems, Inc.||Pressure transducer having a tensioned diaphragm|
|EP1117052A1||Jan 17, 2000||Jul 18, 2001||Anders Juul Eilersen||Method for providing a transfer of retail goods or retail units|
|EP1386173B1||Mar 14, 2002||Oct 27, 2004||EILERSEN, Nils Age Juul||Capacitance measuring circuit|
|EP1451538B1||Dec 7, 2002||Aug 3, 2005||EILERSEN, Nils Age Juul||Sealed load cell|
|FR2102161A1||Title not available|
|JPS5922404A||Title not available|
|JPS6177733A||Title not available|
|JPS56114404A||Title not available|
|WO1984002780A1||Jan 6, 1984||Jul 19, 1984||Nils Aoge Juul Eilersen||Capacitance measuring circuit|
|WO2002075331A1||Mar 14, 2002||Sep 26, 2002||Nils Aage Juul Eilersen||Capacitance measuring circuit|
|WO2002077593A1||Mar 27, 2002||Oct 3, 2002||Nils Aage Juul Eilersen||Capacitive dynamometer|
|WO2003048700A2||Dec 7, 2002||Jun 12, 2003||Nils Aage Juul Eilersen||Sealed load cell|
|1||"Eilersen Electric Digital Weighing Systems", http://www.eilersen.com/, 1 pg., 2006.|
|2||"Model MCL Internally Amplified Miniature Tension/Compression Load Cell", http://www.rdpelectrosense.com/load/mcl.htm, 3 pages, May 19, 2004.|
|3||"Weighing Systems: Scales, Balances and Load Cells:Setra", Setra Weighing Systems Division; http://www.setra.com/wei/index.htm, 2 Pages, 1998.|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US8733182 *||Jun 25, 2012||May 27, 2014||Sensata Technologies, Inc.||Force sensor assembly and method for assembling a force sensor assembly|
|US8794079||Nov 4, 2011||Aug 5, 2014||International Business Machines Corporation||Determining magnitude of compressive loading|
|US9156172||Apr 1, 2013||Oct 13, 2015||Quality Manufacturing Inc.||Robot skeletal components|
|US9205567||Mar 8, 2013||Dec 8, 2015||Quality Manufacturing Inc.||Touch sensitive robotic gripper|
|US9366591||Jul 24, 2014||Jun 14, 2016||International Business Machines Corporation||Determining magnitude of compressive loading|
|US9375852||Apr 1, 2013||Jun 28, 2016||Quality Manufacturing Inc.||Rotational hydraulic joints|
|US9400579||May 20, 2014||Jul 26, 2016||Apple Inc.||Disappearing button or slider|
|US9605952||Sep 12, 2014||Mar 28, 2017||Quality Manufacturing Inc.||Touch sensitive robotic gripper|
|US20090158856 *||Dec 23, 2008||Jun 25, 2009||Divyasimha Harish||Capacitive strain gauge system and method|
|US20100067645 *||Sep 18, 2009||Mar 18, 2010||Kabushiki Kaisha Toshiba||Reflector system of fast reactor|
|US20130014595 *||Jun 25, 2012||Jan 17, 2013||Alex Huizinga||Force sensor assembly and method for assembling a force sensor assembly|
|U.S. Classification||324/662, 324/661, 73/862.626, 73/780, 324/686|
|International Classification||G01R27/26, G01L1/00|
|Cooperative Classification||G01L1/142, G01G7/06, G01G23/3735|
|European Classification||G01G23/37W2, G01G7/06, G01L1/14A|
|Mar 1, 2006||AS||Assignment|
Owner name: LOADSTAR SENSORS, INC., CALIFORNIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HARISH, DIVYASIMHO;DALLENBACH, WILLIAM D.;WONG, KING;AND OTHERS;REEL/FRAME:017643/0344
Effective date: 20060301
|Aug 28, 2006||AS||Assignment|
Owner name: SILICON VALLEY BANK, CALIFORNIA
Free format text: SECURITY AGREEMENT;ASSIGNOR:LOADSTAR SENSORS INC.;REEL/FRAME:018415/0023
Effective date: 20060621
|Jan 12, 2011||AS||Assignment|
Owner name: YPOINT CAPITAL, INC,, CALIFORNIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LOADSTAR SENSORS, INC.;REEL/FRAME:025622/0904
Effective date: 20101229
|Mar 18, 2013||SULP||Surcharge for late payment|
|Mar 18, 2013||FPAY||Fee payment|
Year of fee payment: 4
|Jan 13, 2017||FPAY||Fee payment|
Year of fee payment: 8