|Publication number||US7675166 B2|
|Application number||US 11/128,052|
|Publication date||Mar 9, 2010|
|Filing date||May 11, 2005|
|Priority date||May 11, 2005|
|Also published as||US8338955, US20060255467, US20080197504|
|Publication number||11128052, 128052, US 7675166 B2, US 7675166B2, US-B2-7675166, US7675166 B2, US7675166B2|
|Inventors||Jeff Alan Gordon, Steven N. Hass, Hal Kurkowski, Scott Jones|
|Original Assignee||Maxim Integrated Products, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (17), Classifications (15), Legal Events (3)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This invention relates generally to integrated circuit packages, and in particular, to an integrated circuit package comprising an enclosure including a dielectric housing and two or more electrical contacts configured to form a substantially flat contact side of the enclosure for direct electro-mechanical contact to an end-use equipment. Accordingly, the size of the contacts can be large enough to facilitate relatively large alignment tolerances within the system that utilizes the package. The enclosure encapsulates an integrated circuit die and wirebonds connecting the integrated circuit die to the internal sides of the contacts.
Integrated circuit packages, such as small outline integrated circuits (SOICs) or small outline transistors (SOTs), typically consist of an epoxy plastic housing enclosing an integrated circuit die, and a lead frame consisting of a plurality of electrical contacts extending from the inside to the outside of the housing. Wirebonds situated within the housing electrically connect the integrated circuit die to the plurality of electrical contacts of the lead frame.
Generally, such integrated circuit package is soldered onto a printed circuit board. The printed circuit board including the integrated circuit package are then assembled onto an end-use equipment. This may require attachment of the printed circuit board to the end-use equipment using screws, adhesive, plastic staking, or other means. For certain applications where costs should be minimized, such a three-step process of forming the integrated circuit package, soldering it onto a printed circuit board, and then assembling the printed circuit board to an end-use equipment is not suitable because it is overly complicated, time consuming, and expensive.
An aspect of the invention relates to an integrated circuit package, comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts.
In the exemplary embodiment of the integrated circuit package, the contact side of the enclosure is substantially flat. Also, at least a portion of the (or the entire) integrated circuit die is disposed on the internal side of the first electrical contact. The integrated circuit package may include first and second electrical conductors (e.g., wirebonds) that electrically connect the integrated circuit die to the internal sides of the first and second electrical contacts. The substantially alignment insensitive first and second electrical contacts may each have a dimension of at least two millimeters by at least two millimeters.
Also in the exemplary embodiment of the integrated circuit package, the integrated circuit die may be configured as a memory device containing information related to a peripheral device hosting the integrated circuit package. Alternatively, or in addition to, the integrated circuit die may be configured as an authentication device for authenticating the peripheral device hosting the integrated circuit package. Such an authentication device may perform a secure hash algorithm (e.g., SHA-1, SHA-256), a cryptographic operation, and/or a password entry operation. Alternatively, or in addition to, the integrated circuit die may be configured as a calibration device used for calibrating an end-use equipment.
Other aspects of the invention relates to a method of forming the integrated circuit package described above, and an apparatus that includes the integrated circuit package as described above in electrical contact with an end-use equipment. In particular, the at least first and second electrical contacts of the integrated circuit package make electro-mechanical connection to at least first and second electrical contacts of the end-use equipment, respectively. The integrated circuit package may be secured to the end-use equipment by any number of devices, such as clamps, spring-loaded devices, adhesive, and others. The integrated circuit package may be hosted by a hosting device. As an example, the end-use equipment may be a printer, and the hosting device may be a printer cartridge.
Other aspects, features, and techniques of the invention will be apparent to one skilled in the relevant art in view of the following detailed description of the exemplary embodiments of the invention.
The housing 102 and the electrical contacts 104 and 106 are configured to form a substantially flat contact side 101 a of the enclosure 101. The side 101 a is referred to as the “contact” side because it is the side that makes electro-mechanical contact to an end-use equipment, as later discussed. The integrated circuit package 100 also includes an integrated circuit die 108 disposed entirely on the internal side of the contact 104. In addition, the integrated circuit package 100 includes a pair of wirebonds 110 and 112 electrically connecting the integrated circuit die 108 to the internal sides of the contacts 104 and 106, respectively. In this configuration, the enclosure 101, which includes the housing 102 and the contacts 104 and 106, substantially encapsulates the integrated circuit die 108 and the wirebonds 110 and 112.
A contact, as defined herein, is for facilitating the electrical connection of the integrated circuit die 108 to a device external to the integrated circuit package 100, such as an end-use equipment. For example, the contact 104 may serve as a ground contact to provide a ground potential to the integrated circuit die 108 from an end-use equipment. The other contact 106 may serve, for example, as a power and communication contact to provide a power signal (e.g., Vcc) to the integrated circuit die 108 from an end-use equipment, and communication between the integrated circuit die 108 and an end-use equipment. Although, in this example, the integrated circuit package 100 includes two contacts 104 and 106, it shall be understood that the integrated circuit package 100 may include any number of contacts. For example, the integrated circuit package 100 may be configured to have three or four contacts on the contact side 101 a of the enclosure 101. One such contact may serve as a ground contact; another may serve as a power contact; and the remaining contact(s) may serve as communication contact(s).
For electrical-mechanical connections, the size of the contacts 104 and 106 should be large enough to make them relatively alignment insensitive for electrical-mechanical connection to corresponding contacts of an end-use equipment. For example, the length of such contact should be at least two (2) millimeters, and the width of such contact should be at least two (2) millimeters.
The integrated circuit package 100 may be used in any type of application. For example, the integrated circuit package 100 may serve as a memory device, authentication device, calibration device, and/or an identification device. These are merely examples. Other applications are contemplated.
The integrated circuit package 100 is disposed on the end-use equipment 200 in a manner that the contacts 104 and 106 make electrical contact with the contacts 202 and 204 of the end-use equipment 200, respectively. The clamping device 210 secures the integrated circuit package 100 to the end-use equipment 200 so that the integrated circuit contacts 104 and 106 make a desired electro-mechanical connection to the equipment contacts 202 and 204, respectively. It shall be understood that other devices, such as spring-loaded devices, can be used to apply positive pressure on the integrated circuit package 100 in order to provide this desired electro-mechanical connection.
The integrated circuit package 100 facilitates the assembly of the package to an end-use equipment. First, there is no need to solder the integrated circuit package 100 to a printed circuit board. This is because the integrated circuit package 100 may be attached directly to an end-use equipment. Thus, the step of soldering an integrated circuit package to a printed circuit board may be eliminated. Second, there is no need for a complicated attachment of the integrated circuit package 100 to an end-use equipment. As discussed above, the integrated circuit package 100 may be attached to an end-used equipment by a simple clamp, spring-loaded device, staking, adhesive, or other devices.
Since the integrated circuit package 100 includes contacts 104 and 106 large enough to render them relatively alignment insensitive, the integrated circuit package 100 is able to be electrically connected to an end-use equipment 304 without the need for soldering them together.
While the invention has been described in connection with various embodiments, it will be understood that the invention is capable of further modifications. This application is intended to cover any variations, uses or adaptation of the invention following, in general, the principles of the invention, and including such departures from the present disclosure as come within the known and customary practice within the art to which the invention pertains.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US3921201 *||Jul 15, 1974||Nov 18, 1975||Siemens Ag||Improved liquid cooled semiconductor disk arrangement|
|US4961088||Apr 20, 1989||Oct 2, 1990||Xerox Corporation||Monitor/warranty system for electrostatographic reproducing machines using replaceable cartridges|
|US5049898||Jul 13, 1990||Sep 17, 1991||Hewlett-Packard Company||Printhead having memory element|
|US5272503||Sep 2, 1992||Dec 21, 1993||Xerox Corporation||Replaceable sub-assemblies for electrostatographic reproducing machines|
|US5491540||Dec 22, 1994||Feb 13, 1996||Hewlett-Packard Company||Replacement part with integral memory for usage and calibration data|
|US5699091||Jan 8, 1996||Dec 16, 1997||Hewlett-Packard Company||Replaceable part with integral memory for usage, calibration and other data|
|US6039430||Sep 3, 1998||Mar 21, 2000||Hewlett-Packard Company||Method and apparatus for storing and retrieving information on a replaceable printing component|
|US6433277||Jul 13, 2000||Aug 13, 2002||Amkor Technology, Inc.||Plastic integrated circuit package and method and leadframe for making the package|
|US6455356||Sep 14, 1999||Sep 24, 2002||Amkor Technology||Methods for moding a leadframe in plastic integrated circuit devices|
|US6547570 *||Feb 23, 2001||Apr 15, 2003||Intel Corporation||IC package with quick connect feature|
|US6630728||Jun 14, 2002||Oct 7, 2003||Amkor Technology, Inc.||Plastic integrated circuit package and leadframe for making the package|
|US6956284 *||Mar 31, 2004||Oct 18, 2005||Staktek Group L.P.||Integrated circuit stacking system and method|
|US20010020743 *||Dec 29, 2000||Sep 13, 2001||Formfactor. Inc.||Special contact points for accessing internal circuitry of an integrated circuit|
|US20030081647 *||Oct 31, 2001||May 1, 2003||Bretl Frank J.||Methods and systems for forming a die package|
|US20040140217 *||Jan 22, 2003||Jul 22, 2004||Applied Materials, Inc.||Noble metal contacts for plating applications|
|US20050012187 *||Jul 16, 2004||Jan 20, 2005||Koujiro Kameyama||Semiconductor device and its manufacturing method|
|US20050046036 *||Aug 25, 2004||Mar 3, 2005||Renesas Technology Corp||Semiconductor device, semiconductor module and method of manufacturing semiconductor device|
|U.S. Classification||257/726, 257/727, 257/693, 257/687|
|Cooperative Classification||Y02P70/611, H01L2224/48091, H01L23/32, H05K2203/168, H05K3/325, H01L2924/14, H01L24/48, H05K2201/10636|
|European Classification||H01L23/32, H05K3/32C|
|May 11, 2005||AS||Assignment|
Owner name: MAXIM INTEGRATED PRODUCTS, INC.,CALIFORNIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GORDON, JEFF ALAN;KURKOWSKI, HAL;HASS, STEVEN N.;AND OTHERS;REEL/FRAME:016565/0398
Effective date: 20050406
|Dec 5, 2005||AS||Assignment|
Owner name: LIFETIME PRODUCTS, INC.,UTAH
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:STRONG, L. CURTIS;ASILE, ROBERT A.;ASHBY, KENT;AND OTHERS;SIGNING DATES FROM 20051107 TO 20051108;REEL/FRAME:017090/0762
|Jul 1, 2013||FPAY||Fee payment|
Year of fee payment: 4