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Publication numberUS7697298 B2
Publication typeGrant
Application numberUS 12/238,444
Publication dateApr 13, 2010
Priority dateAug 26, 2008
Fee statusPaid
Also published asCN101662916A, CN101662916B, US20100053905
Publication number12238444, 238444, US 7697298 B2, US 7697298B2, US-B2-7697298, US7697298 B2, US7697298B2
InventorsRung-An Chen
Original AssigneeFoxconn Technology Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat dissipation apparatus
US 7697298 B2
Abstract
A heat dissipation apparatus (10) includes a heat spreader (30), and first and second resilient plates (40, 50) provided at two opposite sides of the heat spreader. The first resilient plate includes a mounting arm (41) and two fixing arms (42) extending from two opposite ends of the mounting arm, respectively. The mounting arm defines a first mounting hole (43) therein, and each of the fixing arms defines a first fixing hole (44) therein. The second resilient plate defines a second mounting hole (53) and two second fixing holes (54) therein. The first resilient plate is fixed on the heat spreader via the first fixing holes. The second resilient plate is fixed on the heat spreader via the second fixing holes. The heat spreader is fixed on a circuit board via the first and the second mounting holes.
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Claims(15)
1. A heat dissipation apparatus, comprising:
a heat spreader;
a first resilient plate provided at one side of the heat spreader, the first resilient plate comprising a mounting arm and two fixing arms extending from two opposite ends of the mounting arm, respectively, the mounting arm defining only one first mounting hole therein, each of the fixing arms defining a first fixing hole therein, the first resilient plate being fixed on the heat spreader via the first fixing hole of the first resilient plate; and
a second resilient plate provided at an opposite side of the heat spreader, the second resilient plate defining only one second mounting hole and at least one second fixing hole therein, the second resilient plate being fixed on the heat spreader via the at least one second fixing hole of the second resilient plate, the only one first mounting hole of the first resilient plate and the only one second mounting hole of the second resilient plate being adapted for mounting the heat spreader to a circuit board.
2. The heat dissipation apparatus of claim 1, wherein the mounting arm is linearly shaped, and the only one first mounting hole is defined at a middle of the mounting arm.
3. The heat dissipation apparatus of claim 2, wherein the fixing arms are L-shaped, with free ends thereof spacing a distance from each other, the first fixing hole of each of the fixing arms being defined in a corresponding free end of the each of the fixing arms.
4. The heat dissipation apparatus of claim 3, wherein the first resilient plate further comprises a reinforcing arm connecting with the free ends of the fixing arms, the reinforcing arm being integrally formed with the fixing arms as a single piece.
5. The heat dissipation apparatus of claim 4, wherein the reinforcing arm defines at least one third fixing hole therein, and the at least one third hole being fixed to the heat spreader.
6. The heat dissipation apparatus of claim 1, wherein the second resilient plate is linearly shaped, and the only one second mounting hole and the at least one second fixing hole are defined at two opposite ends of the second resilient plate, respectively.
7. The heat dissipation apparatus of claim 1, wherein the second resilient plate comprises a mounting arm and two fixing arms extending from two opposite ends of the mounting arm of the second resilient plate, respectively, the only one second mounting hole being defined in the mounting arm of the second resilient plate, the at least one second fixing hole being defined at each of the fixing arms of the second resilient plate.
8. The heat dissipation apparatus of claim 7, wherein the first and the second resilient plates each further comprises a reinforcing arm connecting with free ends of the fixing arms of each of the first and the second resilient plates, and the heat dissipation apparatus further comprises a connecting plate interconnecting the reinforcing arms of the first and the second resilient plates.
9. The heat dissipation apparatus of claim 8, wherein the connecting plate comprises an abutting arm and two legs downwardly extending from two opposite ends of the abutting arm, respectively, the legs connecting with the reinforcing arms of the first and the second resilient plates, respectively.
10. The heat dissipation apparatus of claim 1, further comprising a heat sink and a heat pipe thermally connecting the heat spreader with the heat sink.
11. A heat dissipation apparatus, comprising:
a heat spreader being adapted for thermally connecting with a heat-generating component disposed on a circuit board;
a first resilient plate provided at one side of the heat spreader, the first resilient plate defining only one mounting hole and at least two fixing holes therein, the first resilient plate being fixed to the heat spreader via the fixing holes of the first resilient plate; and
a second resilient plate provided at an opposite side of the heat spreader, the second resilient plate defining only one mounting hole and at least one fixing hole therein, the second resilient plate being fixed to the heat spreader via the at least one fixing hole of the second resilient plate, the only one mounting hole of the first resilient plate and the only one mounting hole of the second resilient plate being adapted for mounting the heat spreader to the circuit board.
12. The heat dissipation apparatus of claim 11, wherein the first resilient plate comprises a mounting arm and two fixing arms extending from two opposite ends of the mounting arm, respectively, the only one mounting hole of the first resilient plate is defined in the mounting arm thereof, the fixing holes are defined in the fixing arms, and the first resilient plate is fixed to two of four corners of the heat spreader.
13. The heat dissipation apparatus of claim 12, wherein the second resilient plate has a same structure as the first resilient plate, and the second resilient plate is fixed to the other two of the four corners of the heat spreader.
14. The heat dissipation apparatus of claim 12, wherein the second resilient plate is linearly shaped, the only one mounting hole of the second resilient plate and the at least one fixing hole are defined at two opposite ends of the second resilient plate, and the second resilient plate is fixed to a middle of a side of the heat spreader opposite to the first resilient plate.
15. The heat dissipation apparatus of claim 12, wherein the first resilient plate further comprises a reinforcing arm located between and connected with the fixing arms.
Description
BACKGROUND

1. Technical Field

The present invention generally relates to heat dissipation apparatuses, and particularly to a heat dissipation apparatus for dissipating heat generated by electronic components.

2. Description of Related Art

It is well known that heat is generated by electronic components such as integrated circuit chips during operation thereof. If the heat is not efficiently removed, these electronic components may suffer damage. Thus, heat dissipation apparatuses are often used to cool the electronic components.

A typical heat dissipation apparatus includes a heat spreader, a heat sink and a heat pipe thermally connecting with the heat spreader and the heat sink. The heat spreader is in contact with an electronic component, such as CPU and so on, which is disposed on a circuit board. The heat spreader includes four sleeves respectively formed at four corners thereof. Each of the sleeves receives a screw therein. During assembly, the spreader is fixed on the circuit board via the four screws, for contacting intimately with the electronic component.

However, fixing the heat spreader on the circuit board with so many screws complicates an assembly process and increases a production cost of the heat dissipation apparatus. As well, four holes respectively aligning with the four screws are required to be defined in the circuit board, which causes an inconvenience for layout of circuitry on the circuit board. On the other hand, points of application of force on the heat spreader will be reduced if fewer screws are employed. Thus, the heat spreader can not contact intimately with the electronic component.

What is needed, therefore, is a heat dissipation apparatus which overcomes the described limitations.

SUMMARY

A heat dissipation apparatus according to an embodiment of the present invention includes a heat spreader, and first and second resilient plates provided at two opposite sides of the heat spreader. The first resilient plate includes a mounting arm and two fixing arms extending from two opposite ends of the mounting arm, respectively. The mounting arm defines a first mounting hole therein, and each of the fixing arms defines a first fixing hole therein. The second resilient plate defines a second mounting hole and two second fixing holes therein. The first resilient plate is fixed on the heat spreader via the first fixing holes. The second resilient plate is fixed on the heat spreader via the second fixing holes. The heat spreader is fixed on a circuit board via the first and the second mounting holes.

Other advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present heat dissipation apparatus can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosed heat dissipation apparatus. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an assembled, isometric view of a heat dissipation apparatus in accordance with a first embodiment of the present invention, the heat dissipation apparatus being fixed on a circuit board.

FIG. 2 is an exploded, isometric view of the heat dissipation apparatus and the circuit board of FIG. 1.

FIG. 3 is an assembled, isometric view of a heat dissipation apparatus in accordance with a second embodiment of the present invention.

FIG. 4 is an isometric view of a first resilient plate of a heat dissipation apparatus in accordance with a third embodiment of the present invention.

FIG. 5 is an assembled, isometric view of a mounting structure of a heat dissipation apparatus in accordance with a fourth embodiment of the present invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Referring to FIGS. 1 and 2, a heat dissipation apparatus 10 in accordance with a first embodiment of the present invention is shown. The heat dissipation apparatus 10 includes a heat pipe 20, a heat spreader 30, a heat sink 60, and a mounting structure 70 for fixing the heat spreader 30 on a circuit board 80. The heat pipe 20 includes an evaporating section 21 attached to a top surface of the heat spreader 30, and a condensing section 22 attached to the heat sink 60, for thermally connecting the heat spreader 30 with the heat sink 60.

The heat spreader 30 is a squared plate, and has a high heat conductivity. Preferably, the heat spreader is made of copper. The heat spreader includes four pins 31 respectively formed at four corners thereof. The pins 31 are protruded upwardly from a top surface of the spreader 30, for fixing the mounting structure 70 thereon.

The mounting structure 70 includes a first resilient plate 40 and a second resilient plate 50. The first resilient plate 40 includes a mounting arm 41 and two fixing arms 42 integrally formed therewith as a single piece. The mounting arm 41 is linearly shaped, and defines a first mounting hole 43 at a middle thereof. The fixing arms 42 are L-shaped, and extend vertically from two opposite ends of the mounting arm 41, respectively. The fixing arms 42 are oriented face to face, with free ends thereof extending toward and spacing a distance from each other. Each of the fixing arms 42 defines a first fixing hole 44 in the free end thereof. The first fixing hole 44 aligns with one of the pins 31 on the heat spreader 30. The second resilient plate 50 has a same structure as the first resilient plate 40. The second resilient plate 50 includes a mounting arm 51, two fixing arms 52, a second mounting hole 53 in the middle of the mounting arm 51, and two second fixing holes 54 in the free ends of the fixing arms 52, respectively.

The circuit board 80 has a heat-generating electronic component 81 disposed thereon, such as a CPU and so on, and defines two locking holes 83 therein. The locking holes 83 are located at two opposite sides of the electronic component 81, and align with the first and second mounting holes 43, 53 of the first and second resilient plates 40, 50, respectively.

During assembly, the first and second resilient plates 40, 50 are disposed at two opposite sides of the heat spreader 30, respectively, with the first and the second fixing holes 44, 54 aligning with and securely receiving the pins 31 of the heat spreader 30 therein, whereby the first and the second resilient plates 40, 50 are fixed on the heat spreader 30. The fixation can be achieved by riveting the pins 31 to the first and second resilient plates 40, 50. The heat spreader 30 is disposed on the electronic component 81, with the first and second mounting holes 43, 53 of the first and second resilient plates 40, 50 aligning with the locking holes 83 of the circuit board 80, respectively. Two fasteners such as screws 85 are provided to extend through the first and the second mounting holes 43, 53 and the locking holes 83, so as to fix the heat spreader 30 on the circuit board 80.

In the heat dissipation apparatus 10, since the pins 31 of the heat spreader 30 are riveted to the first and second resilient plates 40, 50 at the first and the second fixing holes 44, 54 of the first and second resilient plates 40, 50, four points of application of force are respectively provided at the four corners of the heat spreader 30. Thus, the heat spreader 30 can be mounted with a mounting force evenly exerted thereon, whereby the heat spreader 30 can contact intimately and uniformly with the electronic component 81. As well, only two screws 85 through the first and the second mounting holes 43, 53 and the locking holes 83 are required to mount the heat spreader 30 on the circuit board 80, which simplifies the assembly and disassembly process, and reduces the production cost of the heat dissipation apparatus 10. In addition, a layout of circuitry on the circuit board 80 is relatively convenient since only two locking holes 84 are required in the circuit board 80.

Referring to FIG. 3, a heat dissipation apparatus 10 a in accordance with a second embodiment of the present invention is shown. The heat dissipation apparatus 10 a is similar to the heat dissipation apparatus 10 of the first embodiment. In the present embodiment, the second resilient plate 50 a is linearly shaped, and defines a second mounting hole 53 a and a second fixing hole 54 a at two opposite ends thereof, respectively. The heat spreader 30 a has three pins 31 a protruded upwardly from a top surface thereof. Two of the pins 31 a (i.e., first and second pins) are located at two corners of the heat spreader 30, respectively, for fixing the first resilient plate 40 to the heat spreader 30. The third pin 31 a is located at a middle of an opposite side of the heat spreader 30 to the first and the second pin 31 a, for fixing the second resilient plate 50 a to the heat spreader 30. The second resilient plate 50 a is disposed perpendicularly to the opposite side of the first resilient plate 40. The second fixing hole 54 a of the second resilient plate 50 a is fixed to the third pin 31 a. The second mounting hole 53 a of the second resilient plate 50 a is used to mount the second resilient plate 50 a on the circuit board 80.

Referring to FIG. 4, a first resilient plate 40 b of a heat dissipation apparatus in accordance with a third embodiment of the present invention is shown. The first resilient plate 40 b is similar to the first resilient plate 40 of the first embodiment. In the present embodiment, the first resilient plate 40 b further includes a reinforcing arm 45 b provided between the fixing arms 42. The reinforcing arm 45 b connects with the free ends of the fixing arms 42, and is integrally formed with the fixing arms 42 as a single piece. The reinforcing arm 45 b can reinforce the first resilient plate 40 b. The reinforcing arm 45 b defines two third fixing holes 46 b which fix the reinforcing arm 45 b to the heat spreader 30, so as to further increase the points of application of force on the heat spreader 30. Alternatively, the second resilient plate 50 of the first embodiment or the second resilient plate 50 a of the second embodiment can have a same structure as the first resilient plate 40 b.

Referring to FIG. 5, a mounting structure 70 c of a heat dissipation apparatus in accordance with a fourth embodiment of the present invention is shown. The mounting structure 70 c includes a first resilient plate 40 c, a second resilient plate 50 c, and a connecting plate 47 c interconnecting the first and second resilient plates 40 c, 50 c. The first resilient plate 40 c is similar to the first resilient plate 40 b of the third embodiment. In the present embodiment, the first resilient plate 40 c includes a reinforcing arm 45 c between the fixing arms 42. The reinforcing arm 45 c connects with the free ends of the fixing arms 42, and is integrally formed with the fixing arms 42 as a single piece. The difference between the first resilient plate 40 c of the present embodiment and the first resilient plate 40 b of the third embodiment lies in that no third fixing holes 46 b of the resilient plate 40 b are provided at the reinforcing arm 45 c of the present embodiment. The second resilient plate 50 c has a same structure as the first resilient plate 40 c, and also includes a reinforcing arm 55 c. The connecting plate 47 c includes an abutting arm 471 c and two legs 472 c vertically extending downwards from two opposite ends of the abutting arm 471 c, respectively. The legs 472 c connect with the reinforcing arms 45 c, 55 c of the first and the second resilient plates 40 c, 50 c, respectively. The abutting arm 471 c abuts the evaporating section 21 of the heat pipe 20 when the heat pipe is mounted on the heat spreader 30, so as to secure the heat pipe 20 to contact intimately with the heat spreader 30.

It is believed that the present invention and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.

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Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7952878 *Oct 13, 2009May 31, 2011Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation device
US8953319 *Jul 31, 2012Feb 10, 2015Asustek Computer Inc.Heat-dissipating module
US9046306 *Aug 23, 2011Jun 2, 2015Foxconn Technology Co., Ltd.Heat dissipation device
US9237677 *Feb 11, 2013Jan 12, 2016Fujitsu LimitedCooling device, printed circuit board unit, and electronic device
US20110030923 *Feb 10, 2011Foxconn Technology Co., Ltd.Thermal module
US20110032675 *Feb 10, 2011Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation device
US20130014918 *Jan 17, 2013Foxconn Technology Co., Ltd.Heat dissipation device
US20130039011 *Jul 31, 2012Feb 14, 2013Cheng-Yu WangHeat-dissipating module
US20130070418 *Mar 21, 2013Foxconn Technology Co., Ltd.Heat dissipation module
US20130148299 *Jun 13, 2013Fujitsu LimitedCooling device, printed circuit board unit, and electronic device
Classifications
U.S. Classification361/719, 257/718, 165/80.3, 248/507, 257/727, 361/704, 257/719, 361/707
International ClassificationH05K7/20
Cooperative ClassificationH01L23/427, H01L2924/0002
European ClassificationH01L23/427
Legal Events
DateCodeEventDescription
Sep 26, 2008ASAssignment
Owner name: FOXCONN TECHNOLOGY CO., LTD.,TAIWAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHEN, RUNG-AN;REEL/FRAME:021588/0851
Effective date: 20080922
Oct 8, 2013FPAYFee payment
Year of fee payment: 4