|Publication number||US7764853 B2|
|Application number||US 12/248,102|
|Publication date||Jul 27, 2010|
|Filing date||Oct 9, 2008|
|Priority date||Nov 22, 2004|
|Also published as||CN1779495A, CN100462759C, US7454105, US8244081, US20060110109, US20090028506, US20100247034|
|Publication number||12248102, 248102, US 7764853 B2, US 7764853B2, US-B2-7764853, US7764853 B2, US7764853B2|
|Inventors||Robert H. Yi, Brenton A. Baugh, James H. Williams, Robert E. Wilson, Richard A. Ruh|
|Original Assignee||Avago Technologies Fiber Ip (Singapore) Pte. Ltd.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (13), Non-Patent Citations (2), Referenced by (13), Classifications (9), Legal Events (5)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This is a divisional application of copending application Ser. No. 10/994,764, filed on Nov. 22, 2004, the entire disclosure of which is incorporated herein by reference.
In optoelectronic applications, there is a conversion between an electrical mode and an optical mode of signal communication. In a conversion from the electrical mode, the electrical element is a light source, such as a Vertical Cavity Surface Emitting laser (VCSEL) or a Light Emitting Diode (LED). On the other hand, a conversion to the electrical mode utilizes a detector as the active optical element.
Optoelectronic modules are often used in coupling system components and to provide the mode conversion. The modules are designed to present a relatively small area along a surface of the module that receives optical fibers and to require a relatively small amount of real estate of a printed circuit board against which another surface of the module is seated. This allows a sequence of optoelectronic modules to be seated in a closely spaced arrangement for parallel handling of a large number of optical signals. Typically, each module includes an array of light sources or detectors and a corresponding number of light beams.
Within a single optical module, each beam may follow a direct path between the associated light detector/source and a lens at the input/output surface of the module. Alternatively, the beam paths may have ninety degree turns from the input/output surface to the light detectors or sources. A mirror or array of mirrors may be used to provide the light bending. Regardless of whether the optoelectronic module includes beam bending, the alignment process used in the fabrication of the module plays a key role in achieving the desired performance, yield and cost objectives. In general, the different alignment processes fall within three categories, namely active alignment, visual alignment, and passive alignment.
In an active alignment process, the light source is energized and the coupling between the light source and its intended target is monitored. Specifically, the magnitude of the output from the light source to the target is quantified as alignment adjustments occur. An optical fiber, lens, source, or some combination of components is positioned to achieve maximum coupling efficiency between the light source and its target. This process tends to be slow and relatively costly, because of the requirement of an effective closed loop control system. The system requirements include a set of actuators with sufficient mechanical resolution and stability, an effective peak search algorithm, and instrumentation to enable the monitoring of the coupling efficiency between the light source and its target.
The visual alignment process also functions as a closed loop system, but relies on visual cues (such as fiducials) or on the position of a light beam as monitored through an infrared camera. Thus, unlike the active alignment process, the magnitude of the output is not monitored. The primary drawbacks to visual alignment are that the capital equipment costs escalate rapidly with the required placement accuracy, and the throughput is often comparable to that of the active alignment process.
Passive alignment typically relies upon kinematics. Passive kinematic alignment can be described as alignment achieved by mating elements on the basis of accurately positioned physical features. For example, an optical fiber may be placed into a silicon submount having an etched V-shaped groove. The diameter of the optical fiber and the dimensions of the V-shaped groove are closely matched, enabling the desired positional control of the optical fiber. Other types of kinematic couplings include the use of holes, pins, and the like. The primary advantages of using passive alignment techniques are the reduction in the system investment and the general reduction in process complexity. The primary obstacle is that the inherent part costs quickly escalate as the required accuracy of part features increases. That is, the cost of a module increases as the positional tolerances of the kinematic alignment features become more demanding.
In an optoelectronic assembly in accordance with the invention, a coupler includes first and second coupling surfaces, with each surface having at least one beam port. The “beam ports” are defined as the opposite ends of beam path(s) through the coupler. The beam ports may or may not involve structural differences, such as lenses. For each beam path, there is a corresponding active optical element, typically a light source or a light detector. Each active optical element resides on a substrate. The cooperation of flexible alignment features and fixed alignment features achieves an elastic averaging alignment of each active optical element with its corresponding beam port of the coupler. By averaging dimensional and positional errors over a large number of local couplings, elastic averaging provides the same accuracy as a much more costly traditional kinematic alignment employing features which are dimensioned and positioned on the basis of exacting tolerances.
The coupling surfaces of the coupler may be parallel or may be perpendicular to each other. The substrate may be a printed circuit board or a ceramic, flex or semiconductor substrate. An advantage of the use of a semiconductor substrate is that integrated circuit fabrication techniques may be used to more precisely locate the alignment features which are used to achieve the elastic averaging alignment of the assembly parts.
The elastic averaging alignment may be realized using a number of different embodiments. The fixed alignment features may be on the substrate or on the coupler. In one embodiment, solder bumps are formed on the substrate. Because solder may be bumped and reflowed into a final shape, the inherent positional accuracy is dependent upon the selected method for defining the pads or conductive lines on which the solder is first deposited. The positional accuracy is also dependent upon the selection of the substrate, since pads may be formed more accurately on a semiconductor substrate than on a printed circuit board or a flex circuit. Pads on which the solder bumps are formed will have an excellent positional correlation to the fiducials that are required to die attach the active optical element (e.g., light source or light detector). After reflow, each solder bump will tend to center about its pad, as well as to achieve its lowest energy shape. Flexible alignment features may then be formed as part of the coupler. When the coupler is linked to the substrate, alignment is dependent primarily upon the positional accuracy and frequency of the solder bumps and secondarily upon the compliance of the flexible alignment features when contacting the fixed array of solder bumps.
In another embodiment, the compliance is built into the substrate by depositing the solder bumps onto flexible standoffs, such as polyimide members. In this embodiment, the fixed alignment features are features of the coupler. Rigid structural members of the coupler may be aligned with the standoffs to receive the solder bumps. As another alternative, the fixed array of features and the compliant array of features may take the form of holes and flexible pins. Holes may be etched or machined. A concern is that if the substrate is a printed circuit board, the typical approaches to forming holes may have inherent tolerances which are too relaxed to provide the desired coupler-to-substrate alignment.
As noted, semiconductor substrates, such as silicon, lend themselves well to elastic averaging, since it is relatively inexpensive and repeatable to achieve accurately positioned surface features. By etching the substrate or depositing layers on the substrate, the cost does not increase as the size of the optoelectronic assembly decreases. The flexible alignment features may be features of the coupler, while the fixed array may be formed by selectively etching the substrate to leave raised regions or by patterning layers atop the substrate.
It has been determined that elastic averaging provides an alignment technique which achieves a desired balance between performance objectives and cost restrictions. In fiber optic applications, alignment tolerances that were once in the tens of microns are currently five microns or less. This level is often beyond the capability of prior low-cost alignment technologies.
Elastic averaging alignment achieves the benefits of passive kinematic alignment (i.e., low cost, little or zero capital equipment required), while reducing much of the added component cost and manufacturability issues associated with high accuracy and precision. Traditional kinematic coupling requires strict control of six degrees of freedom (DOF) to position an object, and thus the alignment features must be positioned with tighter tolerances than the required alignment. While the technique is effective, it does not lend itself well to low-cost mass producible assemblies.
The kinematic alignment approach is to constrain the object with the minimum number of contact points necessary to adequately support the object. In comparison, elastic averaging “overconstrains” the supported object. With the present invention, it is possible to design assembly components such that the sum of weakly overconstraining features mimics an exact kinematic alignment.
In the elastic averaging embodiments that will be described below, several key design rules are addressed. Firstly, overconstrained couplings have no closed form solution, so that modeling or testing is required to verify the accuracy and precision. Secondly, elastic averaging couplings rely on averaging of contact points to aid in alleviating manufacturing tolerances in surface finish and feature shapes. Friction or simple contact-based designs are subject to variability in repeatability, as a result of wear and other factors. On the other hand, the compliant-based elastic averaging couplings of the present invention reduce the influence of wear on precision, but the range of motion should be limited. A third key design rule relates to the number of contact points. It is assumed that manufacturing errors are random, so that the theory of random errors dictates that the precision of elastic averaging coupling is proportional to the number of contact points. Thus, in each of the embodiments to be described, the number of alignment features in the fixed array of features should be adequate to ensure sufficient overconstraint. Preferably, the number of fixed alignment features is at least twenty. Yet another design rule addressed by the present invention is that true elastic coupling should allow for repeatability, as well as accuracy. This is important in applications in which rework, wear, and modularity are issues.
The elastic averaging alignment is well suited for connecting components of an optoelectronic module, so that the invention will be illustrated and described primarily with reference to such modules. However, other applications are contemplated. With reference to
On the surface of the substrate 14 is an active optical element 28 that is aligned with the second beam port 20. A lens 29 resides on the active optical element. Depending upon the application, the active optical element may be a light source or a light detector. The number of active optical elements corresponds to the number of second beam ports. In practice, suitable light sources include LEDs, VCSELs, and photo diodes. Suitable detectors include PIN detection elements. The substrate 14 functions as a base for the coupler block 12 and is electrically functional to provide connections to bonding pads or other electrical circuitry on the substrate. The substrate may be a printed circuit board, a semiconductor substrate, a ceramic substrate, or a flex circuit. As is known in the art, a typical flex circuit includes one or more layers of conductive metal traces.
The solder bumps 36 provide an inexpensive, reliable surface feature for elastic averaging coupling. Because solder may be bumped and reflowed into a final shape, the inherent positional accuracy is equivalent to the selected method for depositing the conductive material on which the solder bumps are formed. For example, electrically isolated metallic pads may be patterned onto a printed circuit board, a flex circuit, or an equivalent electrically functional substrate. A key is that the pads on which the solder bumps rest will have excellent positional correlation to the fiducials required to die attach the active optical element 28. After solder reflow, each bump will tend to center about its pad and will achieve its lowest energy shape.
Elastic averaging using alignment solder bumps 36 is effective as a result of the diameter and shape variations of each bump, which are subject to influence from local fluctuations in flux, atmosphere, temperature, and composition. While a single solder bump can be subject to variations in diameter of up to 20 microns, it is possible to average this error by contact of the flexures 38 with a large number of solder bumps.
The flexures 38 of the coupler block 12 may be made of a compliant plastic. There are advantages to selecting a coupler block material that allows the main body to be unitary with the flexures. Thus, the material must be compliant and must be optically transparent if the beam paths 24 are to pass through the material. A well suited material is the amorphous thermoplastic polyetherimide sold by General Electric Company under the federally registered trademark ULTEM. However, other optically clear plastics such as acrylic and polycarbonate may also be used. Ultimately, the material selection will depend on the wavelength of light being manipulated, as well as the required process conditions.
As best seen in the top view of
The uses of semiconductor substrates lend themselves particularly well to elastic averaging coupling, because it is relatively easy and inexpensive to achieve accurately etched features, even as the size of the components of the assembly decreases. In the embodiment of
While a variety of embodiments have been illustrated and described, the description is not exhaustive. Other elastic averaging alignment arrangements are contemplated. The specific techniques must be justified based on the required performances and cost restrictions. As a general rule, elastic averaging can achieve the same accuracy as a much more costly traditional kinematic alignment approach, since dimensional and positional errors are averaged over a large number of weakly overconstrained couplings. Significantly, elastic averaging coupling allows for the relaxation of tolerances in both the manufacture and placement processes.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US6635866||Apr 19, 2001||Oct 21, 2003||Internation Business Machines Corporation||Multi-functional fiber optic coupler|
|US6910812 *||May 15, 2002||Jun 28, 2005||Peregrine Semiconductor Corporation||Small-scale optoelectronic package|
|US7027478 *||Dec 20, 2001||Apr 11, 2006||Biovalve Technologies, Inc.||Microneedle array systems|
|US20020110335 *||Feb 14, 2001||Aug 15, 2002||Wagner David K.||Packaging and alignment methods for optical components, and optical apparatus employing same|
|US20030095582 *||Dec 20, 2001||May 22, 2003||Ackley Donald E.||Microneedle array systems|
|US20030111727||May 31, 2002||Jun 19, 2003||Mitsubishi Denki Kabushiki Kaisha||Semiconductor integrated circuit device and printed wired board for mounting the same|
|US20030133668 *||Jan 3, 2003||Jul 17, 2003||Wagner David K||Packaging and alignment methods for optical components, and optical apparatus employing same|
|US20030160321||Mar 5, 2003||Aug 28, 2003||Cloud Eugene H.||Die to die connection method and assemblies and packages including dice so connected|
|US20030201462 *||May 15, 2002||Oct 30, 2003||Richard Pommer||Small-scale optoelectronic package|
|US20040017977 *||Mar 13, 2003||Jan 29, 2004||Dennis Lam||Integrated platform for passive optical alignment of semiconductor device with optical fiber|
|US20040197045||Aug 22, 2003||Oct 7, 2004||Jurgen Lappohn||Plug-in connector between a circuit board and a back plane|
|US20050100264 *||Mar 8, 2004||May 12, 2005||Dong-Su Kim||Packaging apparatus for optical interconnection on optical printed circuit board|
|JP2002076493A||Title not available|
|1||Papers from the prosecution history of U.S. Appl. No. 10/994,764, filed Nov. 22, 2004, now U.S. Patent 7,454,105, pp. 1-214.|
|2||Weber, Alexis C., "Precision Passive Alignment of Wafers", Massachusetts Institute of Technology, (Feb. 2002),26, 27, 55, Fig. 5.5-5.8.|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US8695201||Jul 21, 2011||Apr 15, 2014||GM Global Technology Operations LLC||Elastic tube alignment system for precisely locating components|
|US9061403||Aug 9, 2012||Jun 23, 2015||GM Global Technology Operations LLC||Elastic tube alignment system for precisely locating an emblem lens to an outer bezel|
|US9061715||Aug 9, 2012||Jun 23, 2015||GM Global Technology Operations LLC||Elastic cantilever beam alignment system for precisely aligning components|
|US9067379||Apr 28, 2012||Jun 30, 2015||GM Global Technologies Operations LLC||Stiffened multi-layer compartment door assembly utilizing elastic averaging|
|US9067625||Apr 9, 2013||Jun 30, 2015||GM Global Technology Operations LLC||Elastic retaining arrangement for jointed components and method of reducing a gap between jointed components|
|US9156506||Mar 27, 2013||Oct 13, 2015||GM Global Technology Operations LLC||Elastically averaged alignment system|
|US9216704||Dec 17, 2013||Dec 22, 2015||GM Global Technology Operations LLC||Elastically averaged strap systems and methods|
|US9238488||Dec 20, 2013||Jan 19, 2016||GM Global Technology Operations LLC||Elastically averaged alignment systems and methods|
|US9243655||Jun 13, 2013||Jan 26, 2016||GM Global Technology Operations LLC||Elastic attachment assembly and method of reducing positional variation and increasing stiffness|
|US9278642||Apr 4, 2013||Mar 8, 2016||GM Global Technology Operations LLC||Elastically deformable flange locator arrangement and method of reducing positional variation|
|US9297400||Apr 8, 2013||Mar 29, 2016||GM Global Technology Operations LLC||Elastic mating assembly and method of elastically assembling matable components|
|US9303667||Jul 18, 2013||Apr 5, 2016||Gm Global Technology Operations, Llc||Lobular elastic tube alignment system for providing precise four-way alignment of components|
|US20150166124 *||Dec 17, 2013||Jun 18, 2015||GM Global Technology Operations LLC||Elastically averaged alignment systems and methods thereof|
|U.S. Classification||385/52, 385/14|
|International Classification||G02B6/12, G02B6/26, G02B6/42|
|Cooperative Classification||G02B6/423, G02B6/4232|
|European Classification||G02B6/42C5P4, G02B6/42C5P2|
|May 7, 2013||AS||Assignment|
Owner name: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD
Free format text: MERGER;ASSIGNOR:AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.;REEL/FRAME:030369/0672
Effective date: 20121030
|Jan 2, 2014||FPAY||Fee payment|
Year of fee payment: 4
|May 8, 2014||AS||Assignment|
Owner name: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AG
Free format text: PATENT SECURITY AGREEMENT;ASSIGNOR:AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.;REEL/FRAME:032851/0001
Effective date: 20140506
|Feb 2, 2016||AS||Assignment|
Owner name: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD
Free format text: TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001);ASSIGNOR:DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT;REEL/FRAME:037689/0001
Effective date: 20160201
|Feb 11, 2016||AS||Assignment|
Owner name: BANK OF AMERICA, N.A., AS COLLATERAL AGENT, NORTH
Free format text: PATENT SECURITY AGREEMENT;ASSIGNOR:AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.;REEL/FRAME:037808/0001
Effective date: 20160201