|Publication number||US7791881 B2|
|Application number||US 12/468,636|
|Publication date||Sep 7, 2010|
|Filing date||May 19, 2009|
|Priority date||Jun 11, 2008|
|Also published as||US7957141, US20090310295, US20100302732|
|Publication number||12468636, 468636, US 7791881 B2, US 7791881B2, US-B2-7791881, US7791881 B2, US7791881B2|
|Inventors||Chia-Hsing Chou, Chih-Wei Tsai, Chia-Hung Lu|
|Original Assignee||Asustek Computer Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (11), Referenced by (15), Classifications (14), Legal Events (2)|
|External Links: USPTO, USPTO Assignment, Espacenet|
The present invention relates to a heat-dissipating mechanism, and more particularly to a heat-dissipating mechanism for use with a memory module.
A random access memory (RAM) is a data storage medium of a computer system for temporarily storing data. The random access memory is writable or readable at any time and at a very fast write/read speed. Generally, during the operating system or other application programs are running, the random access memory (RAM) is used as a temporary data storage medium.
Recently, since the functions of the computer system become more and more powerful, the accessing speed of the random access memory (RAM) is gradually increased. As such, a great deal of heat is generated during operation of the random access memory (RAM). If no proper heat-dissipating mechanism is provided to transfer enough heat to the surrounding, the elevated operating temperature may result in a damage of the random access memory (RAM), a breakdown of the whole computer system or a reduced operating efficiency. For most RAM manufacturers, it is important to dissipate the heat generated by the random access memory (RAM) in order to enhance the operating stability.
As known, a series of random access memories are packaged into a memory module. For dissipating the heat generated by the random access memories, a common method attaches a heat-dissipating device onto the surface of the memory module of the random access memories.
Moreover, a fan may be used for further removing the heat generated by the memory module.
The present invention provides a heat-dissipating mechanism for use with a memory module in order to efficiently remove the heat generated from the memory module and increase the space utilization of the motherboard.
In an embodiment, the heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with the memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device forms in the second heat-dissipating device and has a positioning rail corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail of the second positioning device.
The above contents of the present invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed description and accompanying drawings, in which:
The present invention will now be described more specifically with reference to the following embodiments. It is to be noted that the following descriptions of first preferred embodiments of this invention are presented herein for purpose of illustration and description only. It is not intended to be exhaustive or to be limited to the precise form disclosed.
In the above embodiment, the first heat-dissipating device 20 and the second heat-dissipating device 21 are connected with each other when the protrusions 220 of the first positioning device 22 are embedded into corresponding positioning rails 230 of the second positioning device 23. Since the first heat-dissipating device 20 and the second heat-dissipating device 21 are closely contacted with each other, the heat-dissipating efficacy of the heat-dissipating mechanism is enhanced. Moreover, since the first heat-dissipating device 20 and the second heat-dissipating device 21 are closely contacted with each other, the space utilization of the motherboard is increased.
It is noted that, however, those skilled in the art will readily observe that numerous modifications and alterations may be made while retaining the teachings of the invention.
As previously described in the first preferred embodiment, the first positioning device 22 is integrally formed on the first metallic plate 2001 of the first heat-dissipating device 20 (as shown in
While the invention has been described in terms of what is presently considered to be the most practical and first preferred embodiments, it is to be understood that the invention needs not to be limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.
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|U.S. Classification||361/695, 361/716, 361/719, 361/715, 361/690, 361/704, 361/721|
|Cooperative Classification||H01L23/40, H01L2023/4087, H01L23/467, H01L2924/0002|
|European Classification||H01L23/467, H01L23/40|
|May 19, 2009||AS||Assignment|
Owner name: ASUSTEK COMPUTER INC., TAIWAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHOU, CHIA-HSING;TSAI, CHIH-WEI;LU, CHIA-HUNG;REEL/FRAME:022705/0821
Effective date: 20090512
|Feb 19, 2014||FPAY||Fee payment|
Year of fee payment: 4