|Publication number||US7791889 B2|
|Application number||US 11/059,189|
|Publication date||Sep 7, 2010|
|Priority date||Feb 16, 2005|
|Also published as||US20060181857|
|Publication number||059189, 11059189, US 7791889 B2, US 7791889B2, US-B2-7791889, US7791889 B2, US7791889B2|
|Inventors||Christian L. Belady, Eric C. Peterson, Shaun L. Harris, Steven A. Belson, Gary W. Williams|
|Original Assignee||Hewlett-Packard Development Company, L.P.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (19), Non-Patent Citations (1), Referenced by (35), Classifications (18), Legal Events (4)|
|External Links: USPTO, USPTO Assignment, Espacenet|
Some electronic systems utilize several printed circuit boards with many different electronic components interconnected to the circuit boards. As these electronic systems decrease in size and increase in performance, packing density, heat dissipation, and power distribution architecture become increasingly important.
As noted, packing density is one important criterion in many electronic systems. One way to reduce the actual size of an electronic device is to more closely position the electrical components together. Electrical components within a circuit board, however, are generally already tightly confined, and additional space may not be readily available. If, however, electrical components can be positioned to reduce the overall size of the electronic device, then significant savings and advantages can be realized.
Heat dissipation is also an important criterion in many electronic systems. Circuit boards may include a plurality of heat-generating devices that must be cooled in order to operate within a specified operating temperature. If these heat-generating devices are not sufficiently cooled, then the devices can exhibit a decrease in performance or even permanently fail.
As processor and memory technologies advance, power distribution architecture concurrently must evolve to meet demands of processors and memories. Designers consider many factors when developing power distribution architectures for electronic systems. For instance, one noted consideration is supplying reliable power to processor circuit boards. If a power converter fails, for example, then power to an entire circuit board can be lost. Another noted consideration is providing power conversion close to the load to decrease impedance associated with power delivery.
The design and layout of printed circuit board components can be quite complex and challenging. Designers must consider many important factors, such as packing density, heat dissipation, and power distribution architecture. Improvements in these areas can realize important benefits for electronic systems and devices.
Embodiments in accordance with the present invention are directed to apparatus, methods, and systems for providing redundant power from beneath a circuit board. In one exemplary embodiment, an electronic assembly has a first printed circuit board (PCB) and a second PCB. The second PCB has at least two processors and is coupled to and disposed on a first side of the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules are coupled to and disposed on a second side of the first PCB, the first and second power modules providing redundant power to the two processors on the second PCB.
In another exemplary embodiment, a method comprises connecting a power distribution board with power conversion components directly to one side of a system board; connecting plural separate processor modules directly to a second, opposite side of the system board; and transferring power from the power distribution board through the system board and to the processor modules.
Other embodiments and variations of these embodiments are shown and taught in the accompanying drawings and detailed description.
A motherboard is a printed circuit board that can be used in a personal computer, server, or other electronic device. The motherboard (also known as a main board or system board) can provide attachment points for processors, graphics cards, sound cards, controllers, memory, ICs, modules, PCBs, and many other electronic components and devices in a computing system. The daughterboard can be utilized as an extension of the motherboard or other card or board. The daughterboard can have plugs, sockets, pins, connectors, or other attachments for the motherboard or other boards. Connector 106, for example, can be used to electrically couple the PCB 102 to the PCB 104. Connector 106 provides a mechanical and electrical interface or connection between the PCBs. A single connector or multiple connectors can be used to provide connection between the PCBs. For example, if plural connectors are used, then one connector can be a connectable plug (male) and another connector a socket (female).
The PCBs 102 and 104 include a plurality of electronic components or devices. For example, the PCB 104 includes a plurality of heat-generating components or devices 110. These heat-generating devices include any electronic component that generates heat during operation. For example, heat-generating devices include, but are not limited to, electronic power circuits, application specific integrated circuits (ASICs), processors (such as a central processing unit (CPU) or digital signal processor (DSP)), discrete electronic devices (such as field effect transistors (FETs)), other types of transistors, or devices that require heat to be thermally dissipated from the device for the device to operate properly or within a specified temperature range. An ASIC can comprise an integrated circuit or chip that has functionality customized for a particular purpose or application. The PCBs 102 and 104 can also include a plurality of electronic components or device that may or may not generate heat or that may generate low or insignificant amounts of heat. Examples of such devices include, but are not limited to, resistors, capacitors, transistors, diodes, memories, etc.
The electronic assembly 100 can include at least one thermal dissipation device 120. A thermal dissipation device includes, but is not limited to, heat spreaders, cold plates, refrigeration (evaporative cooling) plates, heat pipes, mechanical gap fillers (such as a plurality of pins, rods, etc.), or other devices adapted to dissipate heat. Further, thermal dissipation devices include thermal compounds and thermal interface material that can be used to form a thermally conductive layer on a substrate, between electronic components, or within a finished component. For example, thermally conductive resins, tapes, molded thermoplastic compounds, adhesives, gap pads, and greases can be used between a heat-generating device and thermal dissipating device to improve heat dissipation and/or heat transfer. Further, such thermal dissipation devices include heatsinks. A heatsink is a component designed to reduce the temperature of a heat-generating device or component, such as heat-generating components 110. A heatsink, for example, can dissipate heat in a direct or indirect heat exchange with the electronic components, the heat being dissipated into surrounding air or surrounding environment. Numerous types of heatsinks can be utilized with embodiments in accordance with the present invention. For example, embodiments can include heatsinks without a fan (passive heatsinks) or heatsinks with a fan (active heatsink). Other examples of heatsinks include extruded heatsinks, folded fin heatsinks, cold-forged heatsinks, bonded/fabricated heatsinks, and skived fin heatsinks. Further, the thermal dissipation device, including heatsinks, can use liquids and/or phase change materials.
The electronic assembly 100 also includes multiple power supplies, power systems, or power modules 130A, 130B. Electrical connectors, connection mechanisms, or coupling devices 140 connect the respective power system 130A, 130B to the PCB 104.
The power systems 130A, 130B can be disposed at various locations on the PCB 102. For example, the power systems 130A, 130B can be located at opposite ends of the PCB 102, adjacent each other, horizontally stacked, or vertically stacked. Further, each power system (and accompanying thermal dissipation device, optionally provided) can be removably stacked or connected to the PCB 102.
The power systems 130A, 130B can include numerous embodiments for providing power to electronic components (such as heat-generating components 110) and/or PCBs (such as the PCB 104) within the electronic assembly 100. For example, the power system can be a factorized power architecture (FPA) module, a power converter, such as a direct current (DC) converter or DC-DC converter, AC-DC converter, DC linear regulator, DC switching regulator, or DC charge pump.
The two powers systems 130A, 130B can share responsibility for providing power to the electronic system 100 and/or the PCB 104. For example, the power systems 130A, 130B may be redundant power systems. Redundant power systems can serve as a duplicate for preventing failure upon failure of one of the power systems. In other words, if one power system fails, then the other power system can supply sufficient power to the system to provide continuous and uninterrupted power to the system. As an example, if power system 130A fails, then power system 130B could provide sufficient power to the PCB 104 and corresponding heat-generating components 110 for such components to operate normally. Alternatively, if power system 130B fails, then power system 130A could provide sufficient power to the PCB 104 and corresponding heat-generating components 110 for such components to operate normally.
The two power systems 130A, 130B may also be modular and replaceable. In some embodiments, each power system 130A, 130B is an independently-operable unit that can be constructed with standardized units or dimensions for flexibility and replaceability for use in the electronic assembly 100. Further, each power system 130A, 130B can be connected to or removed from the electronic assembly (example, the PCB 102) without connecting, removing, or replacing other components in the electronic assembly 100 (example, the PCB 104 or the heat-generating components 110). By way of illustration, suppose that power system 130B fails or otherwise needs replaced or upgraded. The power system 130B (and accompanying thermal dissipation device, optionally provided) can be disconnected and removed from the PCB 102 without removing or replacing the power system 130A, PCB 104, thermal dissipation device 120 and/or the heat-generating components 110. As another illustration, suppose that power system 130A fails or otherwise needs replaced or upgraded. The power system 130A (and accompanying thermal dissipation device, optionally provided) can be disconnected and removed from the PCB 102 without removing or replacing the power system 130B, PCB 104, thermal dissipation device 120, and/or the heat-generating components 110. Further yet, either power module can be removed and/or replaced without electrically and mechanically disconnecting the PCBs 102 and 104.
The power systems can be disconnected and connected independent of each other and support hot-swapping (i.e., the ability to add and remove devices to and from a computer or electronic device while the computer or electronic device is running with the operating system automatically recognizing the changed or newly added component). For example, if power system 130B fails, then the power system (including power system 130B, optional thermal dissipation device, and other electronic components) can be removed from the PCB 102 while the electronic assembly 100 is running and continues to run without interruption. Power supply to the electronic system (for example, to PCB 104) can be continuous since power system 130A will automatically assume power supply responsibilities for power system 130B as soon as it fails and while it is disconnected or otherwise not functional.
Once connected, the PCB 102 is generally parallel to the PCB 104. The PCBs 102 and 104 are mechanically and electrically connected to form a vertical stacked-up configuration. In particular, connector 106 couples the PCBs together. The PCB 102 is separated from the PCB 104 by a distance approximately equal to the height or thickness of the connector 106 when connected together.
Although PCBs 102 and 104 are shown to form a vertical stacked-up configuration, other configurations are also within embodiments in accordance with the present invention. For example, the PCBs 102 and 104 can be connected to form a horizontal stacked configuration or other stacked or non-stacked configurations.
As shown, the thermal dissipation device 120 is positioned directly above the heat-generating components 110 of the PCB 104 and substantially fills a volume of space that extends above a top surface of the heat-generating components 110. The PCB 104 connects to one side of the PCB 102. The power systems 130A, 130B connect to a second, opposite side of the PCB 102. For instance, the PCB 104 can connect to a top side of the PCB 102, and the power systems 130A, 130B can connect to a bottom side of the PCB 102 (i.e., underneath the PCB 102).
In one exemplary embodiment, the each power system is directly beneath one heat-generating component 110. As best shown in
For purposes of illustration only, the electronic assembly 100 is shown with an airflow direction as indicated with arrows in
One or both of the power systems 130A and 130B can be cooled with a variety of embodiments, including either or both of (1) direct heat exchange with a thermal dissipation device and (2) an airflow created by a thermal dissipation device. In one exemplary embodiment, a single thermal dissipation device, such as device 120, simultaneously cools or dissipates heat for both power systems 130A, 130B and heat-generating components 110 on the PCB 104. For instance, both power systems 130A and 130B can be in the direct pathway of airflow created by the thermal dissipation device 120. The airflow pathway directed onto the power systems 130A, 130B can provide sufficient cooling so that the power systems do not require additional cooling or additional cooling devices in order to operate properly or within a specified or normal temperature range. In another exemplary embodiment, each power system 130A, 130B is cooled from its own dedicated thermal dissipation device. In still other embodiments, the power systems 130A, 130B do not require any thermal dissipation device in order to operate. As such, the power systems 130A, 130B may or may not require assistance to dissipate heat from the power systems or power modules.
In order to further increase the packing density or increase an effective use of space in the electronic assembly 100, the unused space 160 located between PCB 104 and PCB 102 or between power systems 130A, 130B and PCB 102 (see
In order to establish electrical connection between various components (such as from power systems 130A, 130B through PCB 102 and to PCB 104 and heat-generating components 110), various connections can be utilized. These various connections can also facilitate modularity within the electronic assembly. Thus, the connectors 140 and 106 and/or connection mechanisms for connecting components (including connections between PCBs or through PCBs) are not limited to any specific embodiment. By way of example, such connections include, but are not limited to, edge-connectors, land grid arrays (LGAs), ball grid arrays (BGAs), column grid arrays (CGAs), pin grid arrays (PGAs), plugs (example, male), sockets (example, female), pins, connectors, soldering, or other removable or disconnectable attachments. Such connectors include various board-to-board connections, such as one-piece and two-piece board-to-board connectors and level 2 or L2 connectors or attaches as defined by NEDA (an educational foundation through which major connector companies agreed on a set of levels that define the categories of connectors). As a further example, the connectors include embodiments utilizing vias (see, example, dashed lines 170 in
As one example, the power systems 130A, 130B are mounted to an underside of the PCB 102 through an L2 attach system (shown as connectors 140 located between the power systems 130A, 130B and PCB 102). Output pins of each power system 130A, 130B are connected to the heat-generating components 110 above PCB 104 by means of pins through the L2 attach or another connector placed for the purpose of delivering power from the power system to the heat-generating component. The power is transferred through the PCB 102 (example, system board or motherboard) by vias 170 (see
In one exemplary embodiment, power from the power systems 130A, 130B is transferred from the power systems to an L2 attach, through vias of PCB 102, to an L2 attach of the heat-generating components 110 of the PCB 104. Output of a power converter is thus located at the input of the heat-generating component (such as the processor, ASIC, etc.). The physical length of travel for transmission of converted power is short. For example, in one embodiment, this length is approximately equal to two L2 attaches and a thickness of the PCB 102.
Various different electronic components and PCBs can be combined into embodiments in accordance with the invention.
As shown in
Thermal dissipation from the power systems is not limited to a specific embodiment. For example, the thermal dissipation device can extend around, at, above, adjacent, or below any one or numerous surfaces of the power systems. Further yet, multiple thermal dissipation devices (as shown in
The thermal dissipation devices can utilize and/or comprise a remote heat exchanger (RHE). An RHE enables the thermal dissipation device to be remote from the heat-generating device (such as PCB 104, heat-generating components 110, and/or power systems). For example, heat can be transferred from the heat-generating device to an attachment block having a heat pipe. Further, the heat pipe can be integral to the module or any portion of the electronic system (example, the thermal dissipation device) and extend outwardly from the electronic system to a remote heatsink. Alternatively, the heat pipe can attach to a surface of the module or system (example a surface of a thermal dissipation device) and then extend to a remote heatsink. The heat pipe, for instance, can be a hollow copper pipe containing a fluid and wicking material. Through a process of vaporization and re-condensation, heat travels through the heat pipe to a heat exchanger, such as a finned heat sink. Localized airflow can be used to evacuate the heat to the environment.
In embodiments in accordance with the invention, one or more thermal dissipation devices could be or could utilize a cold-plate and/or could utilize heat dissipation via heat pipes or liquids. For example, looking to
Heat can be evacuated or dissipated from both sides of the motherboard. On a first side, heat is dissipated from an outer or top surface of the thermal dissipation devices connected to the ASICs. On a second side, heat is dissipated from an outer or top surface of the thermal dissipation devices connected to the power systems.
As used herein, the term “module” means a unit, package, or functional assembly of electronic components for use with other electronic assemblies or electronic components. A module may be an independently-operable unit that is part of a total or larger electronic structure or device. Further, the module may be independently connectable and independently removable from the total or larger electronic structure.
Embodiments in accordance with the present invention can utilize a variety of modules. As an example, looking to
Still looking to
Further, embodiments in accordance with the present invention can utilize a modular connective architecture. If a particular electronic component (including PCBs) or device fails or otherwise needs to be replaced, the electronic component can be removed from the electronic assembly and replaced with a new and/or different component. As such, the electronic assemblies can be constructed with standardized electronic components and/or dimensions to enable flexibility and variety of use and exchange of components. Looking to
The power modules can have various configurations. For illustration purposes, the power module can have a generally square or rectangular configuration. A top surface is formed from one outer surface of the thermal dissipation device, and an opposite bottom surface is formed from one outer surface of the power system, such as a power circuit card or power board.
A module can include a variety of different heat exchanging or heat transferring interfaces (such as the interface between two thermal dissipation devices or the interface between a thermal dissipation and a PCB or a heat-generating component or the interface between two power modules or components within a power module). These interfaces can be adapted to enhance heat conduction or heat exchange. For example, the interfaces can include conductive resins, tapes, adhesives, gap pads, greases, or any other device or compound that facilitates or improves heat conduction.
The electronic assembly 700 includes a plurality of different layers that are stacked together in a vertically arrangement. A first or top layer includes the processor modules. This first layer connects to a second layer, shown as the daughterboard, and the second layer connects to a third layer, shown as the motherboard. The third layer connects to a fourth or bottom layer, shown as the power modules.
Embodiments in accordance with the invention are not limited to any number or type of thermal dissipation devices. Further, separate thermal dissipation devices can be coupled together. For example, a liquid heat pipe (or other device known in the art) could extend from one thermal dissipation device to another thermal dissipation device and then to a remote heatsink. In
As noted, the thermal dissipation devices in accordance with the present invention can comprise multiple different, separate members or a unitary or single member and utilize a wide variety of types of thermal dissipation devices. Some examples of additional various embodiments that can be utilized in conjunction with the electronic assembly are shown in
Embodiments in accordance with the invention are not limited to two power systems/modules, two processor modules, a single PCB 104, a single PCB 102, or a single multi-processor module. For example, plural power systems can be stacked or arranged on a single PCB. For example, two, three, or more power modules can be vertically or horizontally stacked on a PCB (such as being stacked or placed below a motherboard). Such power modules can be electrically and mechanically connected to each other. Further, plural PCBs can be stacked or arranged on each other or on another PCB. For example in
Further, the power system and/or power module can provide a power source that is proximate or close to the load (example the PCB 104) in order to minimize noise and optimize step load performance. Further, embodiments in accordance with the present invention provide a more compact system since area below the PCB 102 is used for power conversion and area above the PCB 102 is used for processings. As such, layers of the system board itself (such as PCB 102) do not have to be used to deliver power to electronic components. The layers of the system board can, thus, be provided with more space and capacity for signaling. Further yet, embodiments in accordance with the present invention provide separate power delivery planes from signaling layers in the system board. This configuration can reduce impact from power noise being coupled to signaling in the board. Still further yet, embodiments in accordance with the present invention enable power modules or power systems to be readily changed to satisfy new or different voltage requirements for the electronic system. Furthermore, the power module includes all necessary electronic components to provide power to the heat-generating components. Embodiments in accordance with the present invention, thus, provide N+1 redundancy of the power conversion system.
Embodiments in accordance with the invention can be utilized in a wide variety of different methods and embodiments. For example, embodiments in accordance with the present invention can utilize embodiments taught in U.S. patent application Ser. No. 10/800,837 filed Mar. 15, 2004, entitled “Multi-Processor Module” and incorporated herein by reference. As another example, an exemplary method can comprise connecting plural heat-generating components to a first circuit board. The heat-generating components can include plural processors, ASICs, memories, and other electronic devices. The first circuit board can be connected to a second circuit board in a vertical or horizontal stacked-up configuration. Plural processor modules can be connected to a first or top side of the first circuit board. Plural power modules can be connected to a bottom side of the second circuit board. The power modules supply redundant power to the plural heat-generating components of the first circuit board. Further, the power modules can be vertically or horizontally stacked or adjacent each other or spaced apart from each other. Single or multiple thermal dissipation devices can thermally dissipate heat away from the heat-generating devices and the power systems. Further, at least one thermal dissipation device can generate a primary airflow path that is directed toward a thermal dissipation device, the heat-generating components, the processor modules, and/or the power systems.
One skilled in the art will appreciate that a discussion of various methods should not be construed as steps that must proceed in a particular order. Additional steps may be added, some steps removed, or the order of the steps altered or otherwise changed.
While the invention has been disclosed with respect to a limited number of embodiments, those skilled in the art will appreciate, upon reading this disclosure, numerous modifications and variations. It is intended that the appended claims cover such modifications and variations and fall within the true spirit and scope of the invention.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US5930115 *||Apr 3, 1998||Jul 27, 1999||Compaq Computer Corp.||Apparatus, method and system for thermal management of a semiconductor device|
|US6014313 *||Dec 19, 1997||Jan 11, 2000||Telefonaktiebolgey Lm Ericsson||Packaging structure for integrated circuits|
|US6304450 *||Jul 15, 1999||Oct 16, 2001||Incep Technologies, Inc.||Inter-circuit encapsulated packaging|
|US6452113 *||Feb 16, 2001||Sep 17, 2002||Incep Technologies, Inc.||Apparatus for providing power to a microprocessor with integrated thermal and EMI management|
|US6452804 *||Mar 8, 2001||Sep 17, 2002||Incep Technologies, Inc.||Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate|
|US6554654||Dec 31, 2001||Apr 29, 2003||Hewlett-Packard Development Company, L.P.||Multi-pin edge connector for circuit board|
|US6771507||Jan 31, 2003||Aug 3, 2004||Hewlett-Packard Development Company, L.P.||Power module for multi-chip printed circuit boards|
|US6807061 *||Apr 28, 2003||Oct 19, 2004||Hewlett-Packard Development Company, L.P.||Stack up assembly|
|US6816378||Apr 28, 2003||Nov 9, 2004||Hewlett-Packard Development Company, L.P.||Stack up assembly|
|US6819562||Jan 31, 2003||Nov 16, 2004||Hewlett-Packard Development Company, L.P.||Cooling apparatus for stacked components|
|US6837719 *||Feb 25, 2003||Jan 4, 2005||Molex Incorporated||Connector with included filtered power delivery|
|US7064955 *||Nov 24, 2004||Jun 20, 2006||Hewlett-Packard Development Company, L.P.||Redundant power for processor circuit board|
|US7068515 *||Nov 24, 2004||Jun 27, 2006||Hewlett-Packard Development Company, L.P.||Multi-chip module with stacked redundant power|
|US7072185 *||Dec 21, 2004||Jul 4, 2006||Hewlett-Packard Development Company, L.P.||Electronic module for system board with pass-thru holes|
|US7164586 *||Mar 3, 2004||Jan 16, 2007||Au Optronics Corp.||Plasma display|
|US20020152425 *||Apr 12, 2001||Oct 17, 2002||David Chaiken||Distributed restart in a multiple processor system|
|US20030198033 *||Feb 25, 2003||Oct 23, 2003||Panella Augusto P.||Power delivery to base of processor|
|US20050022054 *||May 17, 2004||Jan 27, 2005||Rasmussen David C.||Method and apparatus for processing control using a multiple redundant processor control system|
|US20060109623 *||Nov 24, 2004||May 25, 2006||Harris Shaun L||Apparatus and method for multiprocessor circuit board|
|1||David A. Klein, U.S. Appl. No. 10/800,837, filed Mar. 15, 2004, entitled "Multi-Processor Module".|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US8183574 *||Apr 17, 2007||May 22, 2012||Nxp B.V.||Thermal isolation of electronic devices in submount used for LEDs lighting applications|
|US8395900||Mar 12, 2013||Amazon Technologies, Inc.||Power routing device for expansion slot of computer system|
|US8405998||Mar 26, 2013||International Business Machines Corporation||Heat sink integrated power delivery and distribution for integrated circuits|
|US8427833 *||Apr 23, 2013||International Business Machines Corporation||Thermal power plane for integrated circuits|
|US8476112||Jul 23, 2012||Jul 2, 2013||International Business Machines Corporation||Optimized semiconductor packaging in a three-dimensional stack|
|US8615679||Sep 14, 2012||Dec 24, 2013||Google Inc.||Memory modules with reliability and serviceability functions|
|US8619452||Sep 1, 2006||Dec 31, 2013||Google Inc.||Methods and apparatus of stacking DRAMs|
|US8631193||May 17, 2012||Jan 14, 2014||Google Inc.||Emulation of abstracted DIMMS using abstracted DRAMS|
|US8631220||Sep 13, 2012||Jan 14, 2014||Google Inc.||Adjusting the timing of signals associated with a memory system|
|US8671244||Jul 13, 2011||Mar 11, 2014||Google Inc.||Simulating a memory standard|
|US8705240||Sep 14, 2012||Apr 22, 2014||Google Inc.||Embossed heat spreader|
|US8710862||Apr 25, 2012||Apr 29, 2014||Google Inc.||Programming of DIMM termination resistance values|
|US8730670 *||Oct 21, 2011||May 20, 2014||Google Inc.||Embossed heat spreader|
|US8751732||Sep 14, 2012||Jun 10, 2014||Google Inc.||System and method for increasing capacity, performance, and flexibility of flash storage|
|US8760936||May 20, 2013||Jun 24, 2014||Google Inc.||Multi-rank partial width memory modules|
|US8762675||Sep 14, 2012||Jun 24, 2014||Google Inc.||Memory system for synchronous data transmission|
|US8773937||Dec 9, 2011||Jul 8, 2014||Google Inc.||Memory refresh apparatus and method|
|US8796830||Sep 1, 2006||Aug 5, 2014||Google Inc.||Stackable low-profile lead frame package|
|US8797779||Sep 14, 2012||Aug 5, 2014||Google Inc.||Memory module with memory stack and interface with enhanced capabilites|
|US8811065||Sep 14, 2012||Aug 19, 2014||Google Inc.||Performing error detection on DRAMs|
|US8819356||Sep 14, 2012||Aug 26, 2014||Google Inc.||Configurable multirank memory system with interface circuit|
|US8868829||Feb 6, 2012||Oct 21, 2014||Google Inc.||Memory circuit system and method|
|US8897014 *||Sep 4, 2012||Nov 25, 2014||General Electric Company||Mechanical layout for half-bridge power module that is optimized for low inductance|
|US8949519||Jul 22, 2009||Feb 3, 2015||Google Inc.||Simulating a memory circuit|
|US8972673||Sep 14, 2012||Mar 3, 2015||Google Inc.||Power management of memory circuits by virtual memory simulation|
|US8977806||Sep 15, 2012||Mar 10, 2015||Google Inc.||Hybrid memory module|
|US8982563 *||Jun 28, 2011||Mar 17, 2015||Oracle International Corporation||Chip package to support high-frequency processors|
|US9047976||Oct 26, 2006||Jun 2, 2015||Google Inc.||Combined signal delay and power saving for use with a plurality of memory circuits|
|US9171585||Nov 26, 2013||Oct 27, 2015||Google Inc.||Configurable memory circuit system and method|
|US9445507||Jun 5, 2015||Sep 13, 2016||International Business Machines Corporation||Packaging for eight-socket one-hop SMP topology|
|US20090279218 *||Apr 17, 2007||Nov 12, 2009||Nxp B.V.||Thermal isolation of electronic devices in submount used for leds lighting applications|
|US20120105145 *||May 3, 2012||International Business Machines Corporation||Thermal Power Plane for Integrated Circuits|
|US20130003310 *||Jan 3, 2013||Oracle International Corporation||Chip package to support high-frequency processors|
|US20140062210 *||Sep 4, 2012||Mar 6, 2014||General Electric Company||Mechanical layout for half-bridge power module that is optimized for low inductance|
|US20150303814 *||Mar 19, 2015||Oct 22, 2015||Delta Electronics (Shanghai) Co., Ltd.||Direct current to direct current power supply apparatus|
|U.S. Classification||361/721, 361/719, 361/694, 361/715, 361/695|
|Cooperative Classification||H05K1/0262, H05K2201/10689, H05K2201/10545, H05K2201/0979, H05K1/0203, H05K1/141, H01L2924/3011, H01L23/467, H05K1/0263, H01L2924/0002|
|European Classification||H01L23/467, H05K1/14B|
|Feb 16, 2005||AS||Assignment|
Owner name: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., TEXAS
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:BELADY, CHRISTIAN L.;PETERSON, ERIC C.;HARRIS, SHAUN L.;AND OTHERS;REEL/FRAME:016292/0933
Effective date: 20050214
|Mar 8, 2011||CC||Certificate of correction|
|Feb 28, 2014||FPAY||Fee payment|
Year of fee payment: 4
|Nov 9, 2015||AS||Assignment|
Owner name: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, TEXAS
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;REEL/FRAME:037079/0001
Effective date: 20151027