|Publication number||US7830588 B2|
|Application number||US 12/368,136|
|Publication date||Nov 9, 2010|
|Filing date||Feb 9, 2009|
|Priority date||Dec 19, 1996|
|Also published as||US20100039370, US20110080632|
|Publication number||12368136, 368136, US 7830588 B2, US 7830588B2, US-B2-7830588, US7830588 B2, US7830588B2|
|Inventors||Mark W. Miles|
|Original Assignee||Qualcomm Mems Technologies, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (137), Non-Patent Citations (84), Referenced by (41), Classifications (9), Legal Events (4)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This application is a divisional of U.S. patent application Ser. No. 11/754,229, filed May 25, 2007, which is a continuation of U.S. patent application Ser. No. 11/056,571, filed Feb. 11, 2005, which is a continuation of U.S. patent application Ser. No. 09/966,843, filed Sep. 28, 2001 (now U.S. Pat. No. 6,867,896), which is a divisional of U.S. patent application Ser. No. 09/056,975, filed Apr. 8, 1998 (now U.S. Pat. No. 6,674,562), which is a continuation-in-part of U.S. patent application Ser. No. 08/769,947, filed Dec. 19, 1996 (now abandoned). The disclosures of all the above-referenced prior applications, publications, and patents are considered part of the disclosure of this application, and are incorporated by reference herein.
This invention relates to visible spectrum (which we define to include portions of the ultra-violet and infrared spectra) modulator arrays and interferometric modulation.
The first patent application cited above describes two kinds of structures whose impedance, the reciprocal of admittance, can be actively modified so that they can modulate light. One scheme is a deformable cavity whose optical properties can be altered by deformation, electrostatically or otherwise, of one or both of the cavity walls. The composition and thickness of these walls, which comprise layers of dielectric, semiconductor, or metallic films, allows for a variety of modulator designs exhibiting different optical responses to applied voltages.
The second patent application cited above describes designs which rely on an induced absorber. These designs operate in reflective mode and can be fabricated simply and on a variety of substrates.
The devices disclosed in both of these patent applications are part of a broad class of devices which we will refer to as IMods (short for “interferometric modulators”). An IMod is a microfabricated device that modulates incident light by the manipulation of admittance via the modification of its interferometric characteristics. Any object or image supporter which uses modulated light to convey information through vision is a form of visual media. The information being conveyed lies on a continuum. At one end of the continuum, the information is codified as in text or drawings, and at the other end of the continuum, it is abstract and in the form of symbolic patterns as in art or representations of reality (a picture).
Information conveyed by visual media may encompass knowledge, stimulate thought, or inspire feelings. But regardless of its function, it has historically been portrayed in a static form. That is, the information content represented is unchanging over time. Static techniques encompass an extremely wide range, but in general include some kind of mechanism for producing variations in color and/or brightness comprising the image, and a way to physically support the mechanism. Examples of the former include dyes, inks, paints, pigments, chalk, and photographic emulsion, while examples of the latter include paper, canvas, plastic, wood, and metal.
In recent history, static display techniques are being displaced by active schemes. A prime example is the cathode ray tube (CRT), but flat panel displays (FPD) offer promise of becoming dominant because of the need to display information in ever smaller and more portable formats.
An advanced form of the FPD is the active matrix liquid crystal display (AMLCD). AMLCDs tend to be expensive and large, and are heavy users of power. They also have a limited ability to convey visual information with the range of color, brightness, and contrast that the human eye is capable of perceiving, using reflected light, which is how real objects usually present themselves to a viewer. (Few naturally occurring things emit their own light.)
Butterflies, on the other hand, achieve a broad range of color, brightness, and contrast, using incident light, processed interferometrically, before delivery to the viewer.
In general, in one aspect, the invention features a modulator of light having an interference cavity for causing interference modulation of the light, the cavity having a mirror, the mirror having a corrugated surface.
In general, in another aspect of the invention, the interference modulation of the light produces a quiescent color visible to an observer, the quiescent color being determined by the spatial configuration of the modulator.
In implementations of the invention, the interference cavity may include a mirror and a supporting structure holding the mirror, and the spatial configuration may include a configuration of the supporting structure, or patterning of the mirror. The supporting structure may be coupled to a rear surface of the mirror. The invention eliminates the need for separately defined spacers and improves the fill-factor.
In general, in another aspect of the invention, the structure for modulating light includes modulators of light each including an interference cavity for causing interference modulation of the light, each of the modulators having a viewing cone. The viewing cones of the modulators are aligned in different directions.
In implementations of the invention, the viewing cones of the different modulators may be aligned in random directions and may be narrower than the viewing cone of the overall structure. Viewing a randomly oriented array of interference modulators effectively reduces the color shift.
In general, in another aspect of the invention, the modulators may be suspended in a solid or liquid medium.
In general, in another aspect of the invention, an optical compensation mechanism is coupled to the modulators to enhance the optical performance of the structure. In implementations of the invention, the mechanism may be a combination of one or more of a holographically patterned material, a photonic crystal array, a multilayer array of dielectric mirrors, or an array of microlenses. The brightness and/or color may be controlled by error diffusion. An array of modulators may be viewed through a film of material which, because of its tailored optical properties, enhances the view from a limited range of angles, or takes incident light of random orientation and orders it. The film may also enhance the fill factor of the pixel. The film may also comprise a patterned light emitting material to provide supplemental lighting.
In general, in another aspect of the invention, an optical fiber is coupled to the interference cavity. The invention may be used in the analysis of chemical, organic, or biological components.
In general, in another aspect of the invention, there is an array of interference modulators of light, a lens system, a media transport mechanism and control electronics.
In general, in another aspect, the invention features an information projection system having an array of interference modulators of light, a lens system, mechanical scanners, and control electronics. In implementations of the invention, the control electronics may be configured to generate projected images for virtual environments; and the array may include liquid crystals or micromechanical modulators.
In general, in another aspect, the invention features an electronics product having an operational element, a housing enclosing the operational element and including a display having a surface viewed by a user, and an array of interference modulators of light on the surface.
Implementations of the invention may include one or more of the following features. The operational element may include a personal communications device, or a personal information tool, or a vehicular control panel, or an instrument control panel, or a time keeping device. The array may substantially alter the aesthetic or decorative features of the surface. The aesthetic component may respond to a state of use of the consumer product. The array may also provide information. The modulation array of the housing may comprise liquid crystals, field emission, plasma, or organic emitter based technologies and associated electronics.
In general, in another aspect, the invention features devices in which aggregate arrays of interference modulators are assembled as a display, e.g., as a sign or a billboard.
In general, in another aspect, the invention features a vehicle having a body panel, an array of interference modulators of light on a surface of the body panel, and electronic circuitry for determining the aesthetic appearance of the body panel by controlling the array of interference modulators.
In general, in another aspect, the invention features a building comprising external surface elements, an array of interference modulators of light on a surface of the body panel, and electronic circuitry for determining the aesthetic appearance of the surface elements by controlling the array of interference modulators.
In general, in another aspect, the invention features a full color active display comprising a liquid crystal medium, and interferometric elements embedded in the medium.
In general, in another aspect, the invention features a structure including a substrate, micromechanical elements formed on the substrate, and electronics connected to control the elements, the electronics being formed also on the substrate.
Individual pixels of the array may consist of arrays of subpixels, allowing brightness and color control via the activation of some fraction of these subpixels in a process known as spatial dithering. Individual pixels or subpixel arrays may be turned on for a fraction of an arbitrary time interval to control brightness in a process known as pulse width modulation (PWM). Individual pixels or subpixel arrays may be turned on for a fraction of the time required to scan the entire array to control brightness in a process known as frame width modulation (FWM). These two schemes are facilitated by the inherent hysteresis of the IMod which allows for the use of digital driver circuits. Neighboring pixels yield a brightness value which is the average of the desired value when error diffusion is used. Brightness control may be achieved via a combination of spatial dithering, PWM/FWM, or error diffusion. Color control may be achieved by tuning individual colors to a particular color, or by combining pixels of different colors and different brightness. The terms pixels and IMods are interchangeable, but in general, pixel refers to a controllable element which may consist of one or more IMods or subpixels, and which is “seen” directly or indirectly by an individual.
The arrays may fabricated on a solid substrate of some kind which may be of any material as long as it provides a surface, portions of which are optically smooth. The material may be transparent or opaque. The material may be flat or have a contoured surface, or be the surface of a three dimensional object. The arrays may be fabricated on the surface, or on the opposite or both sides if the substrate is transparent. In a further aspect the invention can be viewed in a variety of ways.
Implementations of the invention may include one or more of the following features. The array may be directly viewed in that an individual can look at the array and see the represented information from any angle. The array may be directly viewed from a fixed angle. The array may be indirectly viewed in that the information is projected on to a secondary surface, or projected through an optical system, or both.
In yet another aspect the invention can be electrically controlled and driven in several ways.
Implementations of the invention may include one or more of the following features. The array may be fabricated on a substrate and the driver and controller electronics are fabricated on a separate substrate. The two substrates may be connected electrically or optically via cables, or optically, magnetically, or via radio frequencies via a free space connection. The array may be fabricated with driver, controller, or memory electronics, or some combination thereof, mounted on the same substrate and connected via conducting lines. The array may be fabricated on a substrate along with the driver, controller or memory electronics, or some combination thereof. The substrate may include active electronics which constitute driver, controller, or memory electronics, or some combination thereof, and the array may be fabricated on the substrate. The electronics may be implemented using microelectromechanical (MEM) devices.
In an additional aspect the invention modulates light actively, using an array of modulators or sections of arrays which are addressed in several ways.
Implementations of the invention may include one or more of the following features. Individual pixels or arrays of pixels may be connected to a single driver and may be activated independently of any other pixel or pixel array in a technique known as direct addressing. Individual pixels or arrays of pixels may be addressed using a two-dimensional matrix of conductors and addressed in a sequential fashion in a technique known as matrix addressing. Some combination of matrix or direct addressing may be used.
Among the advantages of the invention are one or more of the following.
Because interference modulators are fabricated on a single substrate, instead of a sandwich as in LCDs, many more possible roles are made available. The materials used in their construction are insensitive to degradation by UV exposure, and can withstand much greater variations in temperature. Extremely saturated colors may be produced. Extremely high resolutions make possible detail imperceptible to the human eye. Either transmitted or reflected light may be used as an illumination source, the latter more accurately representing how objects and images are perceived. The ability to fabricate these devices on virtually any substrate makes possible the surface modulation of essentially any man-made or naturally occurring object. It is possible to realize images which are much closer to what exists in nature and more realistic than what is possible using current printing methods.
Interferometric modulation uses incident light to give excellent performance in terms of color saturation, dynamic range (brightness), contrast, and efficient use of incident light, performance which may approach the perceptual range of the human visual system. The fabrication technology allows interference modulators to be manufactured in a great variety of forms. This variety will enable active visual media (and superior static visual media) to become as ubiquitous as the traditional static media which surround us.
In general, the invention provides the tools for creating an array of products and environments which are as visually rich and stimulating as anything found in nature.
Other advantages and features will become apparent from the following description and from the claims.
In general, an IMod which has either no voltage applied or some relatively steady state voltage, or bias voltage, applied is considered to be in a quiescent state and will reflect a particular color, a quiescent color. In the previously referenced patent applications, the quiescent color is determined by the thickness of the sacrificial spacer upon which the secondary mirror is fabricated.
Each IMod 114, 116 is rectangular and connected at its four corners to four posts 118 via support arms such as 120 and 122. In some cases (see discussion below), the IMod array will be operated at a stated constant bias voltage. In those cases, the secondary mirror 102 will always maintain a quiescent position which is closer to corresponding primary mirror 128 than without any bias voltage applied. The fabrication of IMods with differently sized support arms allows for the mechanical restoration force of each IMod to be determined by its geometry. Thus, with the same bias voltage applied to multiple IMods, each IMod may maintain a different biased position (distance from the primary mirror) via control of the dimensions of the support arm and its resulting spring constant. The thicker the support arm is, the greater its spring constant. Thus different colors (e.g., red, green, and blue) can be displayed by different IMods without requiring deposition of different thickness spacers. Instead, a single spacer, deposited and subsequently removed during fabrication, may be used while color is determined by modifying the support arm dimensions during the single photolithographic step used to define the arms. For example, in
As shown in
The mirror layer 308 in
Reducing Color Shift and Supplying Supplemental Illumination
As shown in
As seen in
As seen in
In another example, seen in
In another example,
In another example,
The apparent dynamic range of the display may also be enhanced using a process known as error diffusion. In some applications, the number of bits available for representing the full range of brightness values (dynamic range) may be limited by the capabilities of the drivers/for example. In such a situation, the dynamic range may be enhanced by causing neighboring pixels to have a brightness value, the average of which is closer to an absolute value that cannot be obtained given the set number of bits. This process is accomplished electronically within the controller logic, and can be accomplished without significantly affecting the display resolution.
In a digital driving scheme, as shown in
In another example,
Packaging and Driving Electronics
The electronics 1410 comprise all of the row and column drivers, memory, and controller logic required to actuate the IMods in a controlled fashion. Exactly where each of these functions reside would depend on the application and degree of integration required for an application. Specific examples will be discussed in subsequent portions of this patent application. In
In one case, substrate 1600 is an electronically inactive medium upon which the IMod array and electronics 1608 are fabricated separately or in a fabrication process with some overlap. Electronics may be fabricated using a number of techniques for building thin film transistors using materials such as amorphous silicon, polysilicon, or cadmium selenide. Electronics may also be fabricated using microelectromechanical (MEM) switches instead of, or in conjunction with thin film transistors. All of these materials are deposited on the surface of the substrate, and provide the electronically or electromechanically active medium for circuits. This implementation demonstrates a powerful approach to surface micromachining, which could be described as epi-fab. Essentially, in epi-fab all components of any microelectromechanical structure, both the mechanical and the electronic, are fabricated entirely on the surface of an inert substrate.
In the second case, the substrate is active silicon or gallium arsenide and the electronics are fabricated as a part of it. The IMod array is then fabricated on its surface. The electronics may also include more complex electronic circuits associated with the particular applications. Application specific circuits, e.g., microprocessors and memory for a laptop computer can be fabricated as well, further increasing the degree of integration.
Product and Device Applications
The remaining figures illustrate product and device applications which use the fabrication, drive, and assembly techniques described thus far.
The IMod as an easily fabricated, inexpensive, and capable modulator can be placed in an exceptional number of roles which require the manipulation of light. These areas fall into at least two categories: IMods which are used to modulate or otherwise affect light for purposes which do not result in direct visually perceived information (embedded applications); and IMods which are used to convey codified, abstract or other forms of information via light to be visually perceived by an individual (perceived applications). All of these applications, both embedded and perceived, can be roughly divided according to array size and geometry, however these boundaries are for descriptive purposes only and functional overlap can exist across these categories. They do not represent an exhaustive list of possibilities.
One category of applications utilizes single or individual modulators which are generally for embedded applications. These may be coupled to optical fibers or active electronics to provide, among other things, a mechanism for selecting specific frequencies on a wavelength division multiplexed fiber-optic communication system, as well as a low data rate passive fiber optic modulator. Single modulators may be coupled to semiconductor lasers to provide, among other things, a mechanism for selecting specific frequencies transmitted by the laser, as well as a low data rate laser modulator. Single modulators may be coupled to optical fibers, lasers, or active electronics to alter the phase of light reflected.
Linear arrays, though generally for embedded applications, also begin to have potential in perceived roles. Devices for printing imagery may utilize a linear array as the mechanism for impressing information on to reflected or transmitted light which is subsequently recorded in a light sensitive medium. Devices for scanning images may utilize a linear array to select different colors of a printed or real image for subsequent detection by a light sensitive device.
Yet another category of applications includes microscopic two-dimensional arrays of IMods which may be used to provide reconfigurable optical interconnects or switches between components. Such arrays may also be used to provide optical beam steering of incident light. Using a lens system, to be discussed later, may allow such an array to be readable.
Small arrays, on the order of 2″ square or smaller, may find a variety of uses for which this size is appropriate. Applications include direct view and projection displays. Projection displays can be used individually or in arrays to create virtual environments (VEs). A theater is an example of a single channel VE, while an omnimax theater, with many screens, represents a multi-channel virtual environment. Direct view displays can be used for alphanumeric and graphic displays for all kinds of consumer/commercial electronic products such as calculators, cellular phones, watches and sunglasses (active or static), jewelry, decorative/informative product labels or small format printing (business card logos, greeting card inserts, product labels logos, etc.); decorative clothing patches or inserts (sneakers, badges, belt buckles, etc.); decorative detailing or active/static graphic printing on products (tennis rackets, roller blades, bike helmets, etc.); and decorative detailing or active/static graphic printing on ceramic, glass, or metal items (plates, sculpture, forks and knives, etc.). Very large (billboard sized) displays may be produced by combining arrays of small arrays which are themselves directly driven. Embedded applications may include spatial light modulators for optical computing and optical storage. Modulator arrays fabricated on two dimensional light sensitive arrays, such as CCDs, may be used as frequency selective filter arrays for the selection of color separations during image acquisition.
Another size category of devices, medium arrays, may be defined by arrays of roughly 2″ to 6″ square. These include direct view displays for consumer electronic products including organizers, personal digital assistants, and other medium sized display-centric devices; control panels for electronic products, pocket TVs, clock faces (active and static); products such as credit cards, greeting cards, wine and other product labels; small product exteriors (walkmen, CD cases, other consumer electronic products, etc.); and larger active/static graphical patches or inserts (furniture, clothing, skis, etc.)
For arrays on the order of 6″ to 12″ square, large arrays, there exist other compelling applications. These include direct view displays for large format display-centric products (TVs, electronic readers for digital books, magazines and other traditionally printed media, special function tools); signs (window signs, highway signs, public information and advertising signs, etc.); large consumer product exteriors/active surfaces and body panels (microwave oven, telephone, bicycle, etc.); and furniture exteriors and lighting fixtures, high end products. Direct view 3-D displays and adaptive optics are also possible.
Arrays approximately 12″ square or larger, and aggregate arrays (which are combinations of smaller arrays to achieve a larger one), further define a unique set of devices, and provide the potential to affect our overall environment. These include direct view displays for very large formats (billboards, public spaces, highway, industrial/military situation displays, etc.); Body panels and active exteriors for very large products (cars, motorcycles, air and water craft, sails, refrigerators); and active/static exteriors/interiors for very large objects (buildings, walls, windows).
Alternatively, component 2100 could be a light source which uses lens system 2102 to couple and collimate light through IMod array 2104 onto media 2108. In this case, the media would be a photosensitive material which would undergo exposure as it passed beneath the array. This would provide a mechanism for the printing of high resolution color images. No electronic components reside on the array substrate in this example.
The skis of
It should be noted that several alternative display technologies may also be applicable to some of the less rigorous aesthetic applications, in particular, small AMLCDs, LCDs fabricated on active crystalline silicon, field emission displays (FEDs), and possibly plasma based displays. These technologies are deficient due to their price, manufacturing complexity, and non-reflective (emissive) operation. However, certain high-end fashion oriented products (luxury watches, jewelry and clothing) may command a price and provide an environment which could make these viable approaches. Organic emitters could be particularly suited for exterior applications which are not necessarily exposed to environmental extremes and which might be seen in dimly lit situations. They are the only emissive technology which offers the potential for very low-cost and ease of manufacture. The Alq/diamine structures and poly(phenylene vinylene) materials, which were described before, could be patterned and directly addressed on a variety of substrates (plastic clothing inserts for example) to provide dynamic exteriors.
An application in chemical analysis is illustrated in
Other embodiments are within the scope of the following claims.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US3037189||Apr 23, 1958||May 29, 1962||Sylvania Electric Prod||Visual display system|
|US3210757||Jan 29, 1962||Oct 5, 1965||Carlyle W Jacob||Matrix controlled light valve display apparatus|
|US3296530||Sep 28, 1962||Jan 3, 1967||Lockheed Aircraft Corp||Voltage controlled electroluminescent meter display|
|US3679313||Oct 23, 1970||Jul 25, 1972||Bell Telephone Labor Inc||Dispersive element for optical pulse compression|
|US3701586||Apr 21, 1971||Oct 31, 1972||Goetz George G||Light modulating deflectable membrane|
|US3728030||Jun 22, 1970||Apr 17, 1973||Cary Instruments||Polarization interferometer|
|US3955190||Sep 11, 1973||May 4, 1976||Kabushiki Kaisha Suwa Seikosha||Electro-optical digital display|
|US4190488||Aug 21, 1978||Feb 26, 1980||International Business Machines Corporation||Etching method using noble gas halides|
|US4392711||Mar 20, 1981||Jul 12, 1983||Hoechst Aktiengesellschaft||Process and apparatus for rendering visible charge images|
|US4403248||Mar 4, 1981||Sep 6, 1983||U.S. Philips Corporation||Display device with deformable reflective medium|
|US4425572||May 7, 1981||Jan 10, 1984||Sharp Kabushiki Kaisha||Thin film transistor|
|US4441789||Mar 26, 1981||Apr 10, 1984||Jenoptik Jena Gmbh||Resonance absorber|
|US4441791||Jun 7, 1982||Apr 10, 1984||Texas Instruments Incorporated||Deformable mirror light modulator|
|US4459182||Apr 22, 1983||Jul 10, 1984||U.S. Philips Corporation||Method of manufacturing a display device|
|US4518959||May 13, 1982||May 21, 1985||Mitsubishi Denki Kabushiki Kaisha||Electronic analog display device|
|US4560435||Oct 1, 1984||Dec 24, 1985||International Business Machines Corporation||Composite back-etch/lift-off stencil for proximity effect minimization|
|US4566935||Jul 31, 1984||Jan 28, 1986||Texas Instruments Incorporated||Spatial light modulator and method|
|US4571603||Jan 10, 1984||Feb 18, 1986||Texas Instruments Incorporated||Deformable mirror electrostatic printer|
|US4626840||Oct 11, 1983||Dec 2, 1986||The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland||Electronic display suitable for polar coordinate representations|
|US4655554||Mar 6, 1985||Apr 7, 1987||The United States Of America As Represented By The Secretary Of The Air Force||Spatial light modulator having a capacitively coupled photoconductor|
|US4672254||Oct 11, 1985||Jun 9, 1987||Massachusetts Institute Of Technology||Surface acoustic wave devices and method of manufacture thereof|
|US4786128||Dec 2, 1986||Nov 22, 1988||Quantum Diagnostics, Ltd.||Device for modulating and reflecting electromagnetic radiation employing electro-optic layer having a variable index of refraction|
|US4857978||Aug 11, 1987||Aug 15, 1989||North American Philips Corporation||Solid state light modulator incorporating metallized gel and method of metallization|
|US4859060||Nov 25, 1986||Aug 22, 1989||501 Sharp Kabushiki Kaisha||Variable interferometric device and a process for the production of the same|
|US4880493||Jun 16, 1988||Nov 14, 1989||The United States Of America As Represented By The United States Department Of Energy||Electronic-carrier-controlled photochemical etching process in semiconductor device fabrication|
|US4896033||Jan 17, 1989||Jan 23, 1990||Thomson-Csf||Array of optically-controlled elements for the diffusion of electromagnetic energy|
|US4900136||Oct 28, 1988||Feb 13, 1990||North American Philips Corporation||Method of metallizing silica-containing gel and solid state light modulator incorporating the metallized gel|
|US4900395||Apr 7, 1989||Feb 13, 1990||Fsi International, Inc.||HF gas etching of wafers in an acid processor|
|US4925259||Oct 20, 1988||May 15, 1990||The United States Of America As Represented By The United States Department Of Energy||Multilayer optical dielectric coating|
|US4952034 *||Jan 26, 1989||Aug 28, 1990||Hitachi, Ltd.||Liquid crystal projection display|
|US4954789||Sep 28, 1989||Sep 4, 1990||Texas Instruments Incorporated||Spatial light modulator|
|US4956619||Oct 28, 1988||Sep 11, 1990||Texas Instruments Incorporated||Spatial light modulator|
|US4973131||Feb 3, 1989||Nov 27, 1990||Mcdonnell Douglas Corporation||Modulator mirror|
|US4980775||Feb 23, 1990||Dec 25, 1990||Magnascreen Corporation||Modular flat-screen television displays and modules and circuit drives therefor|
|US4982184||Jan 3, 1989||Jan 1, 1991||General Electric Company||Electrocrystallochromic display and element|
|US5018256||Jun 29, 1990||May 28, 1991||Texas Instruments Incorporated||Architecture and process for integrating DMD with control circuit substrates|
|US5022745||Sep 7, 1989||Jun 11, 1991||Massachusetts Institute Of Technology||Electrostatically deformable single crystal dielectrically coated mirror|
|US5028939||Jun 26, 1989||Jul 2, 1991||Texas Instruments Incorporated||Spatial light modulator system|
|US5034351||Oct 1, 1990||Jul 23, 1991||Motorola, Inc.||Process for forming a feature on a substrate without recessing the surface of the substrate|
|US5061049||Sep 13, 1990||Oct 29, 1991||Texas Instruments Incorporated||Spatial light modulator and method|
|US5062689||Aug 21, 1990||Nov 5, 1991||Koehler Dale R||Electrostatically actuatable light modulating device|
|US5091983||Jun 4, 1987||Feb 25, 1992||Walter Lukosz||Optical modulation apparatus and measurement method|
|US5096279||Nov 26, 1990||Mar 17, 1992||Texas Instruments Incorporated||Spatial light modulator and method|
|US5114226||Sep 28, 1990||May 19, 1992||Digital Optronics Corporation||3-Dimensional vision system utilizing coherent optical detection|
|US5142414||Apr 22, 1991||Aug 25, 1992||Koehler Dale R||Electrically actuatable temporal tristimulus-color device|
|US5170283||Jul 24, 1991||Dec 8, 1992||Northrop Corporation||Silicon spatial light modulator|
|US5198644 *||Apr 16, 1992||Mar 30, 1993||Diablo Research Corporation||System for display of prices and related method|
|US5206632 *||Sep 11, 1990||Apr 27, 1993||Deutsche Thomson-Brandt Gmbh||Actuating circuit for a liquid crystal display|
|US5212582||Mar 4, 1992||May 18, 1993||Texas Instruments Incorporated||Electrostatically controlled beam steering device and method|
|US5216537||Jan 2, 1992||Jun 1, 1993||Texas Instruments Incorporated||Architecture and process for integrating DMD with control circuit substrates|
|US5285196||Oct 15, 1992||Feb 8, 1994||Texas Instruments Incorporated||Bistable DMD addressing method|
|US5315370||Oct 23, 1991||May 24, 1994||Bulow Jeffrey A||Interferometric modulator for optical signal processing|
|US5326430||Dec 7, 1993||Jul 5, 1994||International Business Machines Corporation||Cooling microfan arrangements and process|
|US5337191||Apr 13, 1993||Aug 9, 1994||Photran Corporation||Broad band pass filter including metal layers and dielectric layers of alternating refractive index|
|US5355181||Aug 16, 1991||Oct 11, 1994||Sony Corporation||Apparatus for direct display of an image on the retina of the eye using a scanning laser|
|US5381232||May 18, 1993||Jan 10, 1995||Akzo Nobel N.V.||Fabry-perot with device mirrors including a dielectric coating outside the resonant cavity|
|US5401983||Apr 7, 1993||Mar 28, 1995||Georgia Tech Research Corporation||Processes for lift-off of thin film materials or devices for fabricating three dimensional integrated circuits, optical detectors, and micromechanical devices|
|US5422310||Feb 8, 1994||Jun 6, 1995||Sony Corporation||Method of forming interconnection in semiconductor device|
|US5444566||Mar 7, 1994||Aug 22, 1995||Texas Instruments Incorporated||Optimized electronic operation of digital micromirror devices|
|US5452138||May 27, 1993||Sep 19, 1995||Texas Instruments Incorporated||Deformable mirror device with integral color filter|
|US5454904||Aug 5, 1994||Oct 3, 1995||General Electric Company||Micromachining methods for making micromechanical moving structures including multiple contact switching system|
|US5457900||Mar 31, 1994||Oct 17, 1995||Roy; Avery J.||Footwear display device|
|US5471341||Dec 16, 1993||Nov 28, 1995||Optron Systems, Inc.||Membrane light modulating systems|
|US5485304||Jul 29, 1994||Jan 16, 1996||Texas Instruments, Inc.||Support posts for micro-mechanical devices|
|US5500761||Jan 27, 1994||Mar 19, 1996||At&T Corp.||Micromechanical modulator|
|US5526172||Jul 27, 1993||Jun 11, 1996||Texas Instruments Incorporated||Microminiature, monolithic, variable electrical signal processor and apparatus including same|
|US5526951||Sep 30, 1994||Jun 18, 1996||Texas Instruments Incorporated||Fabrication method for digital micro-mirror devices using low temperature CVD|
|US5544268 *||Sep 9, 1994||Aug 6, 1996||Deacon Research||Display panel with electrically-controlled waveguide-routing|
|US5550373||Dec 30, 1994||Aug 27, 1996||Honeywell Inc.||Fabry-Perot micro filter-detector|
|US5559358||May 23, 1994||Sep 24, 1996||Honeywell Inc.||Opto-electro-mechanical device or filter, process for making, and sensors made therefrom|
|US5561523||Feb 10, 1995||Oct 1, 1996||Vaisala Oy||Electrically tunable fabry-perot interferometer produced by surface micromechanical techniques for use in optical material analysis|
|US5567334||Feb 27, 1995||Oct 22, 1996||Texas Instruments Incorporated||Method for creating a digital micromirror device using an aluminum hard mask|
|US5597736 *||Jun 7, 1995||Jan 28, 1997||Texas Instruments Incorporated||High-yield spatial light modulator with light blocking layer|
|US5619059||Sep 28, 1994||Apr 8, 1997||National Research Council Of Canada||Color deformable mirror device having optical thin film interference color coatings|
|US5636052||Jul 29, 1994||Jun 3, 1997||Lucent Technologies Inc.||Direct view display based on a micromechanical modulation|
|US5638084 *||Jul 29, 1996||Jun 10, 1997||Dielectric Systems International, Inc.||Lighting-independent color video display|
|US5646729||Dec 18, 1995||Jul 8, 1997||Vaisala Oy||Single-channel gas concentration measurement method and apparatus using a short-resonator Fabry-Perot interferometer|
|US5646768||Jun 7, 1995||Jul 8, 1997||Texas Instruments Incorporated||Support posts for micro-mechanical devices|
|US5647036||Sep 9, 1994||Jul 8, 1997||Deacon Research||Projection display with electrically-controlled waveguide routing|
|US5650881||Nov 2, 1994||Jul 22, 1997||Texas Instruments Incorporated||Support post architecture for micromechanical devices|
|US5661592||Jun 7, 1995||Aug 26, 1997||Silicon Light Machines||Method of making and an apparatus for a flat diffraction grating light valve|
|US5665997||Mar 31, 1994||Sep 9, 1997||Texas Instruments Incorporated||Grated landing area to eliminate sticking of micro-mechanical devices|
|US5673785||Oct 3, 1995||Oct 7, 1997||Siemens Aktiengesellschaft||Micromechanical relay|
|US5699181 *||Apr 25, 1996||Dec 16, 1997||Samsung Electronics Co., Ltd.||Deformable mirror device and manufacturing method thereof|
|US5710656||Jul 30, 1996||Jan 20, 1998||Lucent Technologies Inc.||Micromechanical optical modulator having a reduced-mass composite membrane|
|US5719068||Nov 22, 1995||Feb 17, 1998||Semiconductor Energy Laboratory Co., Ltd.||Method for anisotropic etching conductive film|
|US5734177||Sep 20, 1996||Mar 31, 1998||Sharp Kabushiki Kaisha||Semiconductor device, active-matrix substrate and method for fabricating the same|
|US5737115||Dec 15, 1995||Apr 7, 1998||Xerox Corporation||Additive color tristate light valve twisting ball display|
|US5739945||Sep 27, 1996||Apr 14, 1998||Tayebati; Parviz||Electrically tunable optical filter utilizing a deformable multi-layer mirror|
|US5757536||Aug 30, 1995||May 26, 1998||Sandia Corporation||Electrically-programmable diffraction grating|
|US5784190||Apr 27, 1995||Jul 21, 1998||John M. Baker||Electro-micro-mechanical shutters on transparent substrates|
|US5793504||Aug 7, 1996||Aug 11, 1998||Northrop Grumman Corporation||Hybrid angular/spatial holographic multiplexer|
|US5795208||Oct 6, 1995||Aug 18, 1998||Yamaha Corporation||Manufacture of electron emitter by replica technique|
|US5808781||Feb 24, 1997||Sep 15, 1998||Lucent Technologies Inc.||Method and apparatus for an improved micromechanical modulator|
|US5818095||Aug 11, 1992||Oct 6, 1998||Texas Instruments Incorporated||High-yield spatial light modulator with light blocking layer|
|US5825528||Dec 26, 1995||Oct 20, 1998||Lucent Technologies Inc.||Phase-mismatched fabry-perot cavity micromechanical modulator|
|US5835255||May 5, 1994||Nov 10, 1998||Etalon, Inc.||Visible spectrum modulator arrays|
|US5835256||Jun 18, 1996||Nov 10, 1998||Reflectivity, Inc.||Reflective spatial light modulator with encapsulated micro-mechanical elements|
|US5838484||Aug 19, 1996||Nov 17, 1998||Lucent Technologies Inc.||Micromechanical optical modulator with linear operating characteristic|
|US5914804 *||Jan 28, 1998||Jun 22, 1999||Lucent Technologies Inc||Double-cavity micromechanical optical modulator with plural multilayer mirrors|
|US5920418||Jun 20, 1995||Jul 6, 1999||Matsushita Electric Industrial Co., Ltd.||Diffractive optical modulator and method for producing the same, infrared sensor including such a diffractive optical modulator and method for producing the same, and display device including such a diffractive optical modulator|
|US5961848||Nov 10, 1995||Oct 5, 1999||Thomson-Csf||Process for producing magnetoresistive transducers|
|US5986796 *||Nov 5, 1996||Nov 16, 1999||Etalon Inc.||Visible spectrum modulator arrays|
|US6040937||Jul 31, 1996||Mar 21, 2000||Etalon, Inc.||Interferometric modulation|
|US6055090||Jan 27, 1999||Apr 25, 2000||Etalon, Inc.||Interferometric modulation|
|US6115014||Dec 21, 1995||Sep 5, 2000||Casio Computer Co., Ltd.||Liquid crystal display by means of time-division color mixing and voltage driving methods using birefringence|
|US6243149||Mar 29, 1999||Jun 5, 2001||Massachusetts Institute Of Technology||Method of imaging using a liquid crystal display device|
|US6356378||Jul 24, 2000||Mar 12, 2002||Reflectivity, Inc.||Double substrate reflective spatial light modulator|
|US6452712||Jun 29, 2001||Sep 17, 2002||Seiko Epson Corporation||Method of manufacturing spatial light modulator and electronic device employing it|
|US6597490||Nov 27, 2001||Jul 22, 2003||Coretek, Inc.||Electrically tunable fabry-perot structure utilizing a deformable multi-layer mirror and method of making the same|
|US6650455||Nov 13, 2001||Nov 18, 2003||Iridigm Display Corporation||Photonic mems and structures|
|US6674562||Apr 8, 1998||Jan 6, 2004||Iridigm Display Corporation||Interferometric modulation of radiation|
|US6680792||Oct 10, 2001||Jan 20, 2004||Iridigm Display Corporation||Interferometric modulation of radiation|
|US6710908||Feb 13, 2002||Mar 23, 2004||Iridigm Display Corporation||Controlling micro-electro-mechanical cavities|
|US6867896||Sep 28, 2001||Mar 15, 2005||Idc, Llc||Interferometric modulation of radiation|
|US6947200||Sep 24, 2004||Sep 20, 2005||Reflectivity, Inc||Double substrate reflective spatial light modulator with self-limiting micro-mechanical elements|
|US7012732||Mar 1, 2005||Mar 14, 2006||Idc, Llc||Method and device for modulating light with a time-varying signal|
|US7123216||Oct 5, 1999||Oct 17, 2006||Idc, Llc||Photonic MEMS and structures|
|US7126738||Feb 25, 2002||Oct 24, 2006||Idc, Llc||Visible spectrum modulator arrays|
|US7372619||May 23, 2006||May 13, 2008||Idc, Llc||Display device having a movable structure for modulating light and method thereof|
|US7460291||Aug 19, 2003||Dec 2, 2008||Idc, Llc||Separable modulator|
|US7532381||May 25, 2007||May 12, 2009||Idc, Llc||Method of making a light modulating display device and associated transistor circuitry and structures thereof|
|US20010003487||Aug 20, 1999||Jun 14, 2001||Mark W. Miles||Visible spectrum modulator arrays|
|US20020054424||Nov 13, 2001||May 9, 2002||Etalon, Inc.||Photonic mems and structures|
|US20020075555||Nov 21, 2001||Jun 20, 2002||Iridigm Display Corporation||Interferometric modulation of radiation|
|US20020149828||Feb 13, 2002||Oct 17, 2002||Miles Mark W.||Controlling micro-electro-mechanical cavities|
|US20040240032||Jan 5, 2004||Dec 2, 2004||Miles Mark W.||Interferometric modulation of radiation|
|US20080037093||Aug 20, 2007||Feb 14, 2008||Idc, Llc||Method and device for multi-color interferometric modulation|
|US20080088904||Aug 20, 2007||Apr 17, 2008||Idc, Llc||Method and device for modulating light with semiconductor substrate|
|US20080088910||Aug 20, 2007||Apr 17, 2008||Idc, Llc||System and method for a mems device|
|US20080088911||Aug 20, 2007||Apr 17, 2008||Idc, Llc||System and method for a mems device|
|US20080088912||Aug 20, 2007||Apr 17, 2008||Idc, Llc||System and method for a mems device|
|US20080106782||Aug 20, 2007||May 8, 2008||Idc, Llc||System and method for a mems device|
|EP0361981B1||Oct 2, 1989||Dec 20, 1995||Sharp Kabushiki Kaisha||Liquid crystal display device for display with grey levels|
|EP0667548A1||Jan 18, 1995||Aug 16, 1995||AT&T Corp.||Micromechanical modulator|
|EP0668490B1||Feb 9, 1995||Sep 8, 1999||Vaisala Oyj||Electrically tunable fabry-perot interferometer produced by surface micromechanical techniques for use in optical material analysis|
|EP1227346A2||Sep 15, 1997||Jul 31, 2002||Qinetiq Limited||Multi layer interference coatings|
|1||Aratani et al., "Process and Design Considerations for Surface Micromachined Beams for a Tuneable Interferometer Array in Silicon," Proc. IEEE Microelectromechanical Workshop, Fort Lauderdale, FL, pp. 230-235 (Feb. 1993).|
|2||Aratani K., et al., "Surface micromachined tuneable interferometer array," Sensors and Actuators, pp. 17-23. (1994).|
|3||Conner, "Hybrid Color Display Using Optical Interference Filter Array," SID Digest, pp. 577-580 (1993).|
|4||Goosen 2: Goosen et al., "Silicon Modulator Based on Mechanically-Active Anti-Reflection Layer with 1Mbit/sec Capability for Fiber-in-the-Loop Applications," IEEE Photonics Technology Letters, pp. 1119-1121 (Sep. 1994).|
|5||IPER for PCT/US99/07271 filed Apr. 1, 1999.|
|6||ISR for PCT/US99/07271 filed Apr. 1, 1999.|
|7||Jerman et al., "A Miniature Fabry-Perot Interferometer with a Corrugated Silicon Diaphragm Support", (1988).|
|8||Jerman et al., "Miniature Fabry-Perot Interferometers Micromachined in Silicon for Use in Optical Fiber WDM Systems," Transducers, San Francisco, Jun. 24-27, 1991, Proceedings on the Int'l. Conf. on Solid State Sensors and Actuators, vol. CONF. 6, Jun. 24, 1991, pp. 372-375.|
|9||Longhurst, 1963, Chapter IX: Multiple Beam Interferometry, in Geometrical and Physical Optics, pp. 153-157.|
|10||Office Action dated Apr. 1, 2010 in U.S. Appl. No. 11/626,792.|
|11||Office Action dated Apr. 2, 2010 in U.S. Appl. No. 11/841,795.|
|12||Office Action dated Apr. 21, 2010 in U.S. Appl. No. 11/841,820.|
|13||Office Action dated Apr. 28, 2006 in Korean Pat. App. No. 10-2000-7011227.|
|14||Office Action dated Aug. 14, 2009 in U.S. Appl. No. 11/841,833.|
|15||Office Action dated Aug. 20, 2009 in U.S. Appl. No. 12/031,603.|
|16||Office Action dated Aug. 5, 2008 in U.S. Appl. No. 11/754,229.|
|17||Office Action dated Aug. 6, 2008 in U.S. Appl. No. 11/399,681.|
|18||Office Action dated Dec. 10, 2009 in U.S. Appl. No. 11/841,741.|
|19||Office Action dated Dec. 13, 2007 in U.S. Appl. No. 11/742,271.|
|20||Office Action dated Dec. 14, 2007 in U.S. Appl. No. 10/752,140.|
|21||Office Action dated Dec. 26, 2008 in U.S. Appl. No. 11/433,294.|
|22||Office Action dated Dec. 31, 2009 in U.S. Appl. No. 12/363,671.|
|23||Office Action dated Feb. 1, 2008 in U.S. Appl. No. 11/754,229.|
|24||Office Action dated Feb. 22, 2010 in U.S. Appl. No. 11/841,780.|
|25||Office Action dated Jan. 2, 2008 in U.S. Appl. No. 11/492,535.|
|26||Office Action dated Jan. 21, 2010 in U.S. Appl. No. 11/668,973.|
|27||Office Action dated Jan. 26, 2009 in U.S. Appl. No. 11/267,819.|
|28||Office Action dated Jan. 27, 2010 in U.S. Appl. No. 11/841,726.|
|29||Office Action dated Jan. 27, 2010 in U.S. Appl. No. 12/031,603.|
|30||Office Action dated Jul. 21, 2008 in U.S. Appl. No. 11/591,928.|
|31||Office Action dated Jul. 23, 2008 in U.S. Appl. No. 11/267,819.|
|32||Office Action dated Jul. 23, 2009 in U.S. Appl. No. 11/841,795.|
|33||Office Action dated Jul. 23, 2009 in U.S. Appl. No. 12/363,671.|
|34||Office Action dated Jul. 28, 2008 in U.S. Appl. No. 11/742,271.|
|35||Office Action dated Jul. 28, 2009 in U.S. Appl. No. 11/841,810.|
|36||Office Action dated Jul. 30, 2009 in U.S. Appl. No. 11/841,780.|
|37||Office Action dated Mar. 17, 2008 in U.S. Appl. No. 11/433,294.|
|38||Office Action dated Mar. 3, 2009 in U.S. Appl. No. 11/432,724.|
|39||Office Action dated May 14, 2009 in U.S. Appl. No. 11/698,721.|
|40||Office Action dated May 15, 2009 in U.S. Appl. No. 10/752,140.|
|41||Office Action dated May 28, 2009 in U.S. Appl. No. 11/267,819.|
|42||Office Action dated Nov. 12, 2009 in U.S. Appl. No. 11/698,721.|
|43||Office Action dated Nov. 17, 2009 in U.S. Appl. No. 11/267,819.|
|44||Office Action dated Nov. 19, 2007 in U.S. Appl. No. 11/192,436.|
|45||Office Action dated Oct. 21, 2008 in U.S. Appl. No. 11/742,271.|
|46||Office Action dated Sep. 18, 2008 in U.S. Appl. No. 11/841,795.|
|47||Office Action dated Sep. 24, 2009 in U.S. Appl. No. 11/626,792.|
|48||Office Action dated Sep. 29, 2009 in U.S. Appl. No. 11/841,752.|
|49||Office Action dated Sep. 4, 2009 in U.S. Appl. No. 11/841,820.|
|50||Office Action mailed Apr. 13, 2007 in U.S. Appl. No. 11/432,724.|
|51||Office Action mailed Aug. 1, 2007 in U.S. Appl. No. 11/056,571.|
|52||Office Action mailed Aug. 9, 2006 in U.S. Appl. No. 11/056,571.|
|53||Office Action mailed Dec. 21, 2007 in U.S. Appl. No. 11/432,724.|
|54||Office Action mailed Feb. 27, 2007 in U.S. Appl. No. 11/192,436.|
|55||Office Action mailed Feb. 8, 2007 in U.S. Appl. No. 11/056,571.|
|56||Office Action mailed Jan. 17, 2007 in U.S. Appl. No. 11/492,535.|
|57||Office Action mailed Jan. 17, 2008 in U.S. Appl. No. 11/591,928.|
|58||Office Action mailed Jan. 30, 2007 in U.S. Appl. No. 10/752,140.|
|59||Office Action mailed Jan. 30, 2007 in U.S. Appl. No. 11/517,721.|
|60||Office Action mailed Jul. 28, 2008 in U.S. Appl. No. 11/432,724.|
|61||Office Action mailed Jun. 19, 2002 in U.S. Appl. No. 09/966,843.|
|62||Office Action mailed Jun. 21, 2007 in U.S. Appl. No. 10/752,140.|
|63||Office Action mailed Jun. 24, 2002 in U.S. Appl. No. 09/056,975.|
|64||Office Action mailed Jun. 25, 1999 in U.S. Appl. No. 09/056,975.|
|65||Office Action mailed Jun. 25, 2007 in U.S. Appl. No. 11/492,535.|
|66||Office Action mailed Jun. 27, 2006 in U.S. Appl. No. 11/192,436.|
|67||Office Action mailed Jun. 28, 2006 in U.S. Appl. No. 10/752,140.|
|68||Office Action mailed Jun. 6, 2003 in U.S. Appl. No. 10/076,224.|
|69||Office Action mailed Mar. 15, 2007 in U.S. Appl. No. 11/150,683.|
|70||Office Action mailed Mar. 26, 2008 in U.S. Appl. No. 11/150,683.|
|71||Office Action mailed May 4, 2007 in U.S. Appl. No. 11/591,928.|
|72||Office Action mailed Oct. 22, 2007 in U.S. Appl. No. 11/591,928.|
|73||Office Action mailed Oct. 24, 2000 in U.S. Appl. No. 09/056,975.|
|74||Office Action mailed Sep. 11, 2007 in U.S. Appl. No. 11/432,724.|
|75||Office Action mailed Sep. 14, 2009 in U.S. Appl. No. 11/432,724.|
|76||Office Action mailed Sep. 21, 2006 in U.S. Appl. No. 11/150,683.|
|77||Office Action mailed Sep. 21, 2007 in U.S. Appl. No. 11/150,683.|
|78||Office Action received May 25, 2001 in R.O.C. Appl. No. 089113021.|
|79||Official Letter received Mar. 21, 2000 in R.O.C. App. No. 088105551.|
|80||Pape et al., Characteristics of the deformable mirror device for optical information processing, Optical Engineering, 22(6):676-681, Nov.-Dec. 1983.|
|81||Tolansky, 1948, Chapter II: Multiple-Beam Interference, in Multiple-bean Interferometry of Surfaces and Films, Oxford at the Clarendon Press, pp. 8-11.|
|82||Williams, et al. Etch Rates for Micromachining Processing. Journal of Microelectromechanical Systems, 5(4):256-259, (Dec. 1996).|
|83||Winters, et al. The etching of silicon with XeF2 vapor. Applied Physics Letters, vol. 34, No. 1, pp. 70-73, (Jan. 1979).|
|84||WO for PCT/US99/07271 filed Apr. 1, 1999.|
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|US8098417||Jan 17, 2012||Qualcomm Mems Technologies, Inc.||Electromechanical system having a dielectric movable membrane|
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|US8390547||Jun 7, 2011||Mar 5, 2013||Qualcomm Mems Technologies, Inc.||Conductive bus structure for interferometric modulator array|
|US8399988||Jun 30, 2011||Mar 19, 2013||Megica Corporation||High performance sub-system design and assembly|
|US8421222||Apr 16, 2013||Megica Corporation||Chip package having a chip combined with a substrate via a copper pillar|
|US8426958||Apr 23, 2013||Megica Corporation||Stacked chip package with redistribution lines|
|US8471361||Feb 18, 2011||Jun 25, 2013||Megica Corporation||Integrated chip package structure using organic substrate and method of manufacturing the same|
|US8492870||Jun 13, 2011||Jul 23, 2013||Megica Corporation||Semiconductor package with interconnect layers|
|US8535976||Jun 4, 2003||Sep 17, 2013||Megica Corporation||Method for fabricating chip package with die and substrate|
|US8638491||Aug 9, 2012||Jan 28, 2014||Qualcomm Mems Technologies, Inc.||Device having a conductive light absorbing mask and method for fabricating same|
|US8659816||Apr 25, 2011||Feb 25, 2014||Qualcomm Mems Technologies, Inc.||Mechanical layer and methods of making the same|
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|US8805130||Mar 16, 2011||Aug 12, 2014||Cornell University||Semiconductor high-speed integrated electro-optic devices and methods|
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|US20110069371 *||Nov 22, 2010||Mar 24, 2011||Qualcomm Mems Technologies, Inc.||Semi-transparent/transflective lighted interferometric devices|
|U.S. Classification||359/291, 359/290|
|International Classification||G02B26/00, G02B27/01|
|Cooperative Classification||G02B27/017, G02B26/001, Y10T29/4913|
|European Classification||G02B27/01C, G02B26/00C|
|Mar 5, 2009||AS||Assignment|
Owner name: IDC, LLC,CALIFORNIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:IRIDIGM DISPLAY CORPORATION;REEL/FRAME:022359/0512
Effective date: 20041001
Owner name: IRIDIGM DISPLAY CORPORATION,CALIFORNIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MILES, MARK W.;REEL/FRAME:022359/0518
Effective date: 20050303
|Oct 28, 2009||AS||Assignment|
Owner name: QUALCOMM MEMS TECHNOLOGIES, INC.,CALIFORNIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:IDC, LLC;REEL/FRAME:023435/0918
Effective date: 20090925
Owner name: QUALCOMM MEMS TECHNOLOGIES, INC., CALIFORNIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:IDC, LLC;REEL/FRAME:023435/0918
Effective date: 20090925
|Dec 6, 2011||CC||Certificate of correction|
|Apr 24, 2014||FPAY||Fee payment|
Year of fee payment: 4