|Publication number||US7883339 B2|
|Application number||US 12/625,568|
|Publication date||Feb 8, 2011|
|Filing date||Nov 25, 2009|
|Priority date||Nov 25, 2008|
|Also published as||US20100130067|
|Publication number||12625568, 625568, US 7883339 B2, US 7883339B2, US-B2-7883339, US7883339 B2, US7883339B2|
|Inventors||Hsiu-Yuan Hsu, Ke-Hao Chen|
|Original Assignee||Hon Hai Precision Ind. Co., Ltd.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (7), Classifications (11), Legal Events (4)|
|External Links: USPTO, USPTO Assignment, Espacenet|
1. Field of the Invention
The present invention relates to a socket connector, and more particularly, to a socket connector having a frame with a plurality of wafers assembled therein. Each wafer includes a plurality of passageways each assembled with a contact terminal therein.
2. Description of Related Art
A typical socket connector is provided to interconnect two electronic devices, such as a printed circuit board and an IC (Integrated Circuit) package. Taiwanese Patent No. M340609 issued to Hon Hai on Sep. 11, 2008 discloses such a socket connector, which is generally mounted to a printed circuit and used for connecting and testing an IC package. The socket connector includes an upper retaining board and a lower retaining board stacked with each other. The upper and the lower retaining boards are respectively formed with a plurality of upper holes and a plurality of lower holes communicating with each other. A corresponding number of contacts are inserted into and retained in the upper holes and the lower holes, whereby top ends of the contact extend out of the upper board for contacting with the IC package, and the bottom ends of the contacts extend out of the lower board for contacting with the printed circuit board.
The socket connector described above employs two stacked board to retain the contacts. Consequently, the upper and the lower boards have to be respectively manufactured to have a plurality of holes, which thus make the process complicated and difficult. Moreover, if one hole in any board is broken or damaged to an extent of malfunctioned, the whole board has to be changed and replaced with another one, and the repairing and reworking cost is thus increased. In addition, the application flexibility of the retaining boards is relative low. For example, if the dimension of the socket connector is needed to be changed, both of upper and the low boards have to be changed.
In view of the above, an improved socket connector of low cost and fine manufacturability is needed.
Accordingly, an object of the present invention is to provide a socket connector having a plurality of wafers for retaining contacts.
According to one aspect of the present invention, there is provided a socket connector including a frame having a receiving cavity therein, a plurality of wafers aligned along a direction and received in the receiving cavity of the frame, and a plurality of contacts. The wafer is formed with a plurality of parallel slots located along at least one surface thereof and matched with corresponding slots of a neighboring wafer to constitute a plurality of receiving holes. The contacts are received in the receiving holes respectively. Each contact includes a top contacting section extending upwardly beyond an upper surface of the wafers and a bottom contacting section extending downwardly beyond a lower surface of the wafers.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
Reference will now be made to the drawings to describe the present invention in detail.
The wafer 1 has a pair of ear portion 14 respectively having a alignment hole 15, which engages the alignment post 35 in the receiving cavity 33 of the frame 3 so that the wafers 1 are positioned and retained within the frame 3.
The contact 2 has a top contacting section 21 extending upwardly beyond an upper surface of the wafers 1 for contacting with the IC package, a bottom contacting section 22 extending downwardly beyond a lower surface of the wafers 1 for contacting with the printed circuit board, and a tube 23 enclosing the top contacting section 21 and the bottom contacting section 22 so that the top contacting section 21 and the bottom contacting section 22 are movable relative to each other via a spring member (not shown) in the tube 23.
A cover 4 of rectangular shape which defines sidewalls 41 and an opening 42 therein is mounted upon the frame 3. The wafer 1 has one portion protruding out of the receiving cavity 33 of the frame 3 and extending into the opening 42 of the cover 4.
In the case that the number of the contacts 2 is needed to be increased, only new wafers 12 of same structure are needed to be mounted to the receiving cavity 33 of the frame 3. Correspondingly, the dimensions of the frame 3 and the cover 4 are changed, respectively. Moreover, if one wafer is broken or malfunctioned, it can be readily pulled out and replaced with a new and functional one. Thus, the repairing cost of the present invention is relative low. Further, the manufacturability of forming slots 33 along surfaces of the wafer 1 is comparably better than that of forming through holes in a thick board.
While preferred embodiments in accordance with the present invention has been shown and described, equivalent modifications and changes known to persons skilled in the art according to the spirit of the present invention are considered within the scope of the present invention as defined in the appended claims.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US5727954 *||Feb 8, 1996||Mar 17, 1998||Yamaichi Electronics Co., Ltd.||Connector having relatively movable upper and lower terminals|
|US6036503 *||Nov 4, 1997||Mar 14, 2000||Advantest Corporation||IC socket for a BGA package|
|US6046597||Oct 4, 1995||Apr 4, 2000||Oz Technologies, Inc.||Test socket for an IC device|
|US6709279 *||Dec 27, 2001||Mar 23, 2004||Yamaichi Electronics Co., Ltd.||Contact pin module and testing device provided with the same|
|US7102373 *||Sep 29, 2005||Sep 5, 2006||Yokowo Co., Ltd.||Inspection unit|
|US7471096 *||Jan 26, 2006||Dec 30, 2008||Fujitsu Limited||Contactor for electronic parts and a contact method|
|TW340609B||Title not available|
|U.S. Classification||439/66, 439/330|
|Cooperative Classification||H01R12/7076, H01R13/514, H01R12/714, H01R13/516|
|European Classification||H01R23/72B, H01R13/516, H01R23/68A, H01R13/514|
|Nov 25, 2009||AS||Assignment|
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HSU, HSIU-YUAN;CHEN, KE-HAO;REEL/FRAME:023567/0730
Effective date: 20091120
|Sep 19, 2014||REMI||Maintenance fee reminder mailed|
|Feb 8, 2015||LAPS||Lapse for failure to pay maintenance fees|
|Mar 31, 2015||FP||Expired due to failure to pay maintenance fee|
Effective date: 20150208