|Publication number||US7918378 B1|
|Application number||US 12/851,981|
|Publication date||Apr 5, 2011|
|Priority date||Aug 6, 2010|
|Also published as||US8267303, US20120031955|
|Publication number||12851981, 851981, US 7918378 B1, US 7918378B1, US-B1-7918378, US7918378 B1, US7918378B1|
|Original Assignee||National Semiconductor Corporation|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (23), Referenced by (5), Classifications (36), Legal Events (2)|
|External Links: USPTO, USPTO Assignment, Espacenet|
The present invention relates generally to semiconductor device packaging and interconnection technologies. In particular wedge bonding technologies are discussed. More particularly, apparatus, methods, software, hardware, and systems are described for achieving high-speed wedge bonding of wire bonds.
In the field of semiconductor packaging, wire bonding can be used to interconnect integrated circuits and other associated components together. In particular, two main modes of wire bonding are in common usage. Ball bonding and wedge bonding. Both methods are well known in the art and have been in use for many years. As is known, ball bonding is commonly known and is frequently used with gold materials. However gold is relatively expensive. Additionally, such gold ball bonding requires surface plating (for example using silver) and heat to maintain good adhesion to bond pad materials. Additionally, attempts have been made to use ball bonding with copper materials. However, at the high temperatures required for copper ball formation oxide formation is a common problem. The problem is quite pronounced as copper oxides are insulating materials that have proven difficult to bond. Additionally, deformation of the electrical connections made at high temperatures lead to reliability issues. Methods of avoiding oxide formation require the use of oxygen free ambient conditions. This comes with its own set of problems. Similar oxide formation issues make aluminum a difficult material for ball bonding applications as well. An advantage to ball bonding is its high rate of processing speed. In many applications, average bonding speeds of the order of 12-14 bonds per second can be attained.
However, because some materials are difficult to work with using high temperature ball bonding, an alternative wedge bonding approach can be used. A disadvantage of such prior art wedge bonding technique is that it is a comparatively slow process with average bonding speeds of the order of 2-3 bonds per second being common.
Moreover, although ball bonding and wedge bonding have been used in the industry for many years, wedge bonding has up until this point been a relatively slow process even after 30 years of use. Accordingly, ways of improving wedge bonding speeds would be advantageous. Thus, while existing systems and methods work well for many applications, there is an increasing demand for wedge bonding methodologies that enable increased speed using a variety of materials including aluminum. This disclosure addresses some of those needs.
In a first aspect, an embodiment of the invention describes method for high-speed wired bonding. The method involves positioning a distal end of a wire-bonding capillary near a first bonding site. Extruding a length of bonding wire from an aperture in the end of the capillary. Imposing a movable deflector against the extruded length of bonding wire to bend the bonding wire to form a bent portion at an end of the bonding wire. Moving the bent portion of the bonding wire into contact with first bonding site. Wedge bonding the bent portion of the bonding wire with the first bonding site. In one approach, the wedge bonding can comprise, compressing and/or ultra-sonic bonding the bent portion of the bonding wire between the bonding site and a facing surface of the capillary and ultrasonically bonding the bent portion of the bonding wire to the first bonding site. To further continue an example method, the capillary can be moved away from the first bonding site toward a second bonding site where another end of the bonding wire is wedge bonded to the second bonding site to establish a wire bond connection between the first and second bonding sites.
In another aspect, embodiments of the invention include a wire bonding apparatus comprising a support for holding wire bonding substrates, a wire bonding capillary with an aperture for carrying and extruding bond wire and enabling bond wire attachment to wire bonding substrates, a movable deflector element arranged to enable movement of the deflector element to bend an extruded length of bonding wire such that the bent extruded length of bonding wire can be articulated at different bond line angles while maintaining a constant rotational orientation for the capillary, and a controller configured to enable control the operation of the wire bonding apparatus.
In another aspect, embodiments of the invention describe a movable deflector element module for use in wire bonding operations. One such module includes a deflection member configured to enable movement in an x axis and y axis direction. The member includes an aperture oriented in a z-axis with the aperture having inner wall that defines a wire contact surface having a plurality of wire guide features. Also, a deflection actuator is configured to move the deflection member in said x and y axis directions as directed by a control element configured to specify x and y axis movement for the deflection actuator.
In another aspect, embodiments of the invention describe a capillary element for use in high speed wire bonding operations. One such capillary comprises a capillary including a facing surface at a tip end of the capillary. Also including an aperture that penetrates through the capillary to an opening in the facing surface of the shaft to enable a bond wire to pass through the aperture exiting the opening in the facing surface. The facing surface defines a substantially ring-shaped roughened surface area with a substantially flat surface angled in a range of about 0° to about 4°.
General aspects of the invention include, but are not limited to methods, systems, apparatus, and computer program products for enabling improved high speed wedge bonding of wire bonds.
The invention and the advantages thereof may best be understood by reference to the following description taken in conjunction with the accompanying drawings in which:
In the drawings, like reference numerals are sometimes used to designate like structural elements. It should also be appreciated that the depictions in the figures are diagrammatic and not to scale.
Reference is made to particular embodiments of the invention. Examples of which are illustrated in the accompanying drawings. While the invention will be described in conjunction with particular embodiments, it will be understood that it is not intended to limit the invention to the described embodiments. To contrary, the disclosure is intended to extend to cover alternatives, modifications, and equivalents as may be included within the spirit and scope of the invention as defined by the appended claims.
Aspects of the invention pertain to methods and apparatus for enabling high speed wedge bonding in semiconductor wire bonding applications.
The diagrammatic illustrations of
As shown in
In examining a first wire bond connection 122 connecting one of the pads 111 with a first external connector 112 the wire bond 122 defines a bond line between the two contact locations. Here we arbitrarily identify the bond line 122 as having angle of 0°. The diagrammatic illustration includes a first bubble 131 that shows a top down view of the associated bond head 101 and the bond wire 102. During wedge bonding, the bond head is moved in direction 141 from the bond pad 111 toward the final bonding site at connector 112. In the wedge bonding process, this process is repeated for each pair of pads and contact for the die 110. Thus, the bonding proceeds around the circumference of the die until completed.
For example, as the process has moved clockwise around the die another wire bond 123 is briefly discussed. A second external bond site 113 is wire bonded with an associated one of the pads 111 thereby defining the wire bond 123 and its associated bond line. With reference to the first bond line (122) it is shown that the bond angle has changed. Here that angle change 135 is represented as 90°. Thus the bond line 123 lies at 90° from the first bond line 122. This has consequences in how the wire bond is formed. The diagrammatic illustration includes a second bubble 132 that shows a top down view of the associated of the same bond head 101 and a bond wire 102. Because the bond line is significantly changed, the rotational orientation of the bond head 101 must also significantly rotate. This rotation enables wedge bonding between the external bond site 113 and its associated bond pad. During wedge bonding, the bond head 101 is moved in second direction 142 from the bond pad 111 toward the final bonding site at connector 113.
Likewise, as the process continues moving clockwise around the die another wire bond 124 is briefly discussed. Here, an example third external bond site 114 is shown wire bonded with an associated one of the pads 111 thereby defining the wire bond 124 and its associated bond line. With reference the to the first bond line (122), it is shown here that the bond angle 136 has further to about 120°. Thus the bond line 124 lies at 90° from the first bond line 122. Again, this has consequences in how the wire bond is formed. The diagrammatic illustration includes a third bubble 133 that shows a top down view of the associated of the same bond head 101 and a bond wire 102. Because the bond line is again significantly changed, the rotational orientation of the bond head 101 must also significantly rotate. At this point the rotation is about 120 degrees. Also, as before, this rotation enables wedge bonding between the external bond site 114 and its associated bond pad. During wedge bonding, the bond head 101 is moved in third direction 143 from the bond pad 111 toward the final bonding site at connector 114. And so it continues until the die 110 is completely bonded.
It is very important to consider that the bond head 101 realignment process takes a considerable amount of time. In fact, it is what accounts for the majority of the disparity in bond rates between the ball bonding process (e.g., about 14 bonds/s) and the prior art wedge bonding process (e.g., about 2-3 bonds/s). Accordingly, an approach for removing this step from the process has considerable advantage in a wedge bonding process.
The wedge bonding module 210 typically includes a control arm 211 that can include an ultrasonic head (not shown in this view) with a capillary 213 used as a bonding tool mounted on a distal end thereon. The module 210 can include a linear motor (not shown) that drives the capillary 213 and bonding arm 211 (as can optionally move the deflector module 220) in the vertical direction, that is, in the Z-direction. The linear motor is but one of many examples of a suitable motive device that can be used to accomplish the desired movement in the module 210. This Z-axis movement enables the bond tool 213 to apply wire to various locations on the substrate 202. An XY table 214 is used as an XY positioning unit that holds the bonding module 210 (including control arm 211, bonding capillary 213, deflector module 220, and image pickup unit 204) and moves the module two-dimensionally a substantially horizontally arranged X-direction and Y-direction, and positions the same capillary 213 for wire bonding.
The control module 230 can include one or more microprocessors for controlling the entire wire bonding apparatus 210. For example, a drive device 231 can provide control signals to the bonding head 213 and the XY table 214 in response to a command signal from a controller 232. Commonly, software (or firmware) is executed on a microprocessor of the controller 232 and the operation of wire bonding or the like is performed by implementing the program. A support 205 holds the IC device 202 so that it can be wire bonded to another substrate. In this depicted embodiment, the other substrate comprises a lead frame 203. Additionally, in some embodiments, the support can include a heater unit. In one implementation, the semiconductor chip 202 is mounted on a lead frame 203 which can be mounted on the heater plate of a heater unit at the top of the support 205. The lead frame 203 can be heated by the heater unit.
Also, the wire bonding apparatus 200 typically includes an operation panel 233 having, for example, data input features that can include, but are not limited to track balls, alphanumeric value entering keys, and operating switches for enabling input and output of data such as process parameters and further display of the data for operation of the device 200. Such data can be input into the controller 232 to, for example using a track ball, enable manual movement of the XY table 214. The control unit 232 and the operation panel 233 are collectively referred to as an operating unit, hereinafter. The wire bonding apparatus 200 can be operated manually or automatically by the operation of the operating unit.
The wedge bonding module 210 which drives the bonding arm 211 vertically in the Z-direction includes a position detection sensor 216 for detecting the position of the bonding arm 211, and the position detection sensor 216 is adapted to output the position of the capillary 213 mounted to the distal end of the bonding arm 211 from the position of a preset original point of the bonding arm 211 to the control device 232. The linear motor of the wedge bonding module 210 drives the bonding arm vertically in response to instructions from the controller 232 which also controls the magnitude and the duration of a load to be applied to the capillary 211 at the time of bonding.
Additionally, an ultrasonic oscillator (not shown) can be located within the arm 211 which, in one embodiment, can use a piezoelectric transducer to cause the capillary 213 to generate the requisite ultrasonic oscillations that can be applied to the capillary 213, for example, upon reception of a control signal from the controller 232.
Additionally, the controller 232 provides signals to the deflector module 220 that enable it to deflect wire extruded from the capillary 213 in accord with certain aspects of the invention. This will be discussed in greater detail in the following paragraphs.
In general, the wire bonding apparatus 200 is configured to connect bond pads of the IC device 202 to external bonding sites, for example, bonding sites on a lead frame 203. These bond connections are made using bond wire such as aluminum wire. Also, gold and copper can be used in accord with this invention. Aluminum being attractive because it is a softer material than both copper and gold thus reducing stress on the underlying substrate (the die 202) during wedge bonding. The approach disclosed in this application has several advantages over prior art methods. Unlike ball bonding, the present invention can be practiced at room temperature thus removing a large array of heat related problems from the system. Additionally, the need for non-oxygen ambient is also removed from the system. Also, it provides a high-speed method for achieving wedge bonding which has been a slow process for over 30 years. Thus, this invention meets a long unmet need and is particularly advantageous when used with materials like aluminum bonding wires.
A novel feature of the invention includes a deflector element 220 which is position in an operational arrangement with a bonding capillary 213. Typically, but not exclusively, the deflector element 220 is mounted with the bonding arm 211. The deflector element 220 comprises a movable deflector member and an associated actuator that enables controlled motion for the movable deflector member. The motion of the movable deflector member is intended to execute x-axis and y-axis movement and bending of an extruded portion of a bond wire extending from a capillary 213.
In general, the deflector element 220 and capillary 213 are controlled by software and hardware enabling their integrated operation with the wire bonding recipe of the bonding processes executed by the apparatus 200.
Such a movable deflector member can comprise one or more separate elements configured alone or in combination to enable such x, y movement and bending in a bond wire. The actuator can comprise a drive motor(s), magnetic actuators, and other motive elements.
It is particularly pointed out that the deflection of the wire 314 is achieved by the relative motion of the wire with respect to the deflector 311. In other words, it can be that the capillary 213 itself is moved relative to a stationary deflector 311.
In one feature of the invention, the facing surface of the capillary 317 is a substantially flat surface. The surface 317 generally having a face angle of in the range of about 0-4°. This is important because it is desirable to have the greatest amount of surface area of the facing surface applied against a bend bonding wire.
In describing the process, the capillary 213 is positioned above the desired bonding site 401, a portion of wire 314 e is extruded from the wire in a desired length. For example, the length 314 e is on the order of a radius of a flat facing surface 317 of the capillary. For example, using an 8 mil diameter capillary, the extruded portion 314 e can be on the order of about 3-4 mils in length. The bonding wire can be made of any material and any thickness. Gold, copper, aluminum, and allots of the same provide some examples of suitable materials. Such wires are on the order of 15 μm-to 2 mil as well as other thicknesses. In one example, a capillary 213 extrudes a portion of a bond wire 314 e a desired length through the aperture 313 and then fixed in length. For example, the wire can be extruded through an open wire clamp to the desired length, then the wire clamp fixes the wire in place (stabilizing the length) and then relative movement of the deflector and capillary bend the wire as appropriate.
The bond angle required to connect the bond pad 401 to a desired external bonding site is determined. This enables the correct x, y deflection to be applied to the bent portion of the wire 403. Then, as shown in
After bending, as shown in
Then, as shown in
Thus, as is shown in
Once bonded, as shown in
Additionally, when the wire portion 403 (314 e) is bent in direction 402 (See, e.g.,
It is pointed out that the wire can be positioned and held in place using standard clamp and wire tensioners as can be found in ball bonding tools. The clamp holds the wire in place while the deflector bends the wire into the desired configuration and then releases the wire once it is positioned at the desired bonding site. Moreover, in some embodiments the wire tensioner (or other associated vacuum systems) can be dispensed with altogether.
An example depiction of the operation of a guide feature 514 is shown with reference to
It is specifically pointed out that many different implementations of such guide features can be used. For example, the inner surface of the aperture can comprise a set of slots or grooves in the inner surface to engage and fix the wire during wire bonding. In one example implementation a series of notches can be arranged in a spaced apart arrangement around the inner surface of the aperture. For example, the spacing can be such that grooves are spaced every 5°, 4°, 3°, 2°, 1°, or even tighter. It is pointed out that these intervals are examples only and that the invention is not limited to these intervals with those of ordinary skill appreciating that the spacing can be set at any desired interval. It is also pointed out, that alignment features can also be arranged on the capillaries. However, the inventors note that it is advantageous to place them on the deflector element. This is because the formation of the guide features is time consuming and difficult. Additionally, the lifespan of an average capillary is considerably less than that of a deflector. Thus, although the invention contemplates the placement of alignment features on the capillaries and/or the deflector element 511, there are certain advantages to placing them on the longer lived deflector element.
In a continuing description of the invention one method of applying this technology is described. In one embodiment, a method of employing a wire bonding apparatus 200 in accordance with an aspect of the invention is described. This embodiment describes a wedge bonding method and associated method of establishing wire bonds between bond sites. An aspect of this invention will be discussed in association with the embodiment addressed in the flow diagram of
Once the die (or other target subject) is positioned on the inventive wedge bonding tool bonding can begin. It is to be noted that appropriate adjustments and software instructions can be applied to the tool 200.
Accordingly, the distal end of a wire-bonding capillary is positioned near a first bonding site (Step 601). The capillary supports a bonding wire and can have an entire strand of appropriate wire in readiness for a bonding process. The wire can be of any material, with aluminum, copper, and even gold providing attractive materials. Aluminum in particular provides some process advantages. In particular, aluminum is soft and also aluminum is compatible with many bond pad and bonding site materials (e.g., copper). Accordingly, it is not necessary to plate the target bond pads to obtain good bond adhesion between wire and pad as is the case with some other materials (e.g., gold). Generally, such positioning involved positioning the capillary right above the bond site. The capillary head must be positioned above the bond pad a distance that is thicker (e.g., 316) than the thickness (height) of the associated deflector arm (e.g., 311). Thus, for a deflector arm 30 mils thick, the capillary head will be at least 35 mil and possibly much higher above the bond pad. In one example implementation the capillary head (the tip of the capillary) is positioned about 50 mils above the target surface (the bond site) in readiness for bonding. In general, the capillary head is a distance above the bond pad that takes into consideration the height of the deflector above the bond pad, the thickness of the deflector, the thickness of the wire, and any desired tolerances.
A length of wire is extruded from the aperture in the end of the capillary (Step 603). In one implementation, a bond wire is fed down through an inner diameter of the capillary to extend a distance beyond a facing surface of the capillary. The extruded length can be on the order of about the radius of the capillary face. Thus, for a capillary having a diameter of about 6 mils, an extruded length of up to 3-4 mils can be used. It is pointed out that greater or shorter extruded lengths can be used. In particular, for greater diameter capillaries greater lengths can be used and vice versa. As mentioned above, aluminum, copper, gold and other materials can be used with aluminum being a particularly attractive candidate. Additionally, a wide range of wire thicknesses can be employed with this methodology. One example range of wire thicknesses can include wire diameters ranging from about 5 μm to about 2 mils and other thicknesses. One example can be a 50 μm aluminum wire extruded to a length of about 3 mils using a capillary having a diameter of about 6 mils. Of course this is but one example with many others apparent to those of ordinary skill.
Once the desired length of wire is extruded, a movable deflector is imposed against the extruded length of bonding wire to bend the bonding wire to form a bent portion at an end of the bonding wire (Step 605). A deflector (for example, a deflector 311 as is shown in
Additionally, the bending process requires that the deflector pass beneath the capillary. For example, in one embodiment the facing surface of the capillary can lie a distance of about 1.1 to about 1.5 wire diameters above the top surface of the deflector 311. Of course, the distance can be less or greater. The general idea being that the desired amount of bend is imparted to the bent portion of wire 403 by the motion of the deflector under the capillary.
Once bent, the deflector is repositioned such that the capillary can pass through the aperture of the deflector. Then the capillary is moved through the aperture toward the bonding site such that the bent portion of the bonding wire is moved into contact with the first bonding site (Step 607). Additionally, the facing surface of the capillary compresses the bent portion of the bonding wire between the bonding site and a facing surface of the capillary to establish a wedge bond of the bonding wire with the first bonding site (Step 609). This process is typically enhanced using ultrasonic energy. For example ultrasonic bonding or scrubbing can enhance the bond between the wire and bonding surface. Also, in some embodiments thermosonic bonding can be used enhance the bond between the wire and bonding surface. This will be discussed in some detail below with respect to certain capillary heads. This process results in a low temperature wedge bond that can be established in any direction without need for changing the rotational orientation of the capillary. This first novel aspect of this embodiment is completed in the formation of this novel type of wedge bond.
Once the bond is established, the method can move the bonding wire to a second bonding site to establish a completed wire bond electrical connection with another circuit element. For example, the capillary is moved away from the first bonding site (the location of the first bond) toward a second bonding site (where the bond that completes the connection can be made) (Step 611). Once in the desired location the capillary is positioned operative arrangement with the second bonding site and the wire is wedge bonded to the second bonding site to establish a wire bond connection between the first and second bonding sites (Step 613). A standard wedge bonding technique can be used here and the wire can be broken off in a standard fashion to complete the bond. At this point the capillary can be removed to another bonding site to repeat the process. Importantly, the rotational orientation of the capillary is not changed in this move.
In one important attribute, the face surface 701 of the capillary is flat or very near flat. The face angle 702 (not drawn to scale) that describes an angle that the facing surface 701 makes with a perfectly flat plane should be less than about 4-5°. This very flat surface enables a maximum contact area of the surface 701 with the bent wire. Additional implementations can include faces with slight inverse angles (those having surfaces that become higher as they extend inward from the face edges). In general, these more flat surfaces are very different from capillaries used to ball bond gold wires. Such ball bonding capillaries are designed to optimize ball formation. Accordingly, they have relatively steep face angles. In a typical gold ball bonding application the face angle will be 8°, 12°, 15°, or even steeper. These tools cannot provide the needed contact area required to enable the present methodology. Additionally, when using gold processes, the facing surface 701 is very smooth. However, in an aluminum bonding capillary, a great deal of “scrubbing” is required to break up the surface oxides present on aluminum wires. Hence a rough surface is required. This is amplified through the effect of ultrasonic scrubbing. Such a roughened matte surface can be used with a ruby or tungsten carbide capillary.
It is also noted that a pattern of raised features can be used to good effect in this manner. For example a criss-crossed (cross-hatched) pattern of raised features (e.g., a waffle-shaped pattern) can provide good results.
In another embodiment,
Referring to side section view of
Returning to a discussion of
Additionally, the chamfer angle in the present capillary is steeper than that of an ordinary ball bond capillary. This can be characterized by the interior chamfer angle (ICA) depicted in
The foregoing description, for purposes of explanation, used specific nomenclature to provide a thorough understanding of the invention. However, it will be apparent to one skilled in the art that the specific details are not required in order to practice the invention. Thus, the foregoing descriptions of specific embodiments of the present invention are presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the invention to the precise forms disclosed. It will be apparent to one of ordinary skill in the art that many modifications and variations are possible in view of the above teachings.
The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best utilize the invention and various embodiments with various modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the following claims and their equivalents.
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|U.S. Classification||228/4.5, 228/15.1, 228/904|
|Cooperative Classification||H01L2224/85399, H01L2224/05599, H01L2224/85207, H01L2224/85205, H01L2224/45147, H01L2224/45015, Y10S228/904, H01L2924/01033, B23K20/005, H01L2924/01013, H01L2924/01005, B23K2201/40, H01L2924/01029, H01L2924/01078, H01L2224/48472, H01L24/85, H01L2924/01006, H01L2924/01074, H01L2224/78302, H01L2924/01047, H01L2924/01082, H01L24/78, H01L2924/01079, H01L2224/49171, H01L2224/85, H01L2224/78301, H01L2924/14, H01L2224/45144, H01L2224/45124, H01L2224/85099|
|European Classification||B23K20/00D2B, H01L24/85|
|Sep 1, 2010||AS||Assignment|
Owner name: NATIONAL SEMICONDUCTOR CORPORATION, CALIFORNIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:PHAM, KEN;REEL/FRAME:024925/0630
Effective date: 20100824
|Sep 24, 2014||FPAY||Fee payment|
Year of fee payment: 4