|Publication number||US7918799 B2|
|Application number||US 12/032,957|
|Publication date||Apr 5, 2011|
|Filing date||Feb 18, 2008|
|Priority date||Feb 18, 2008|
|Also published as||US20090209863|
|Publication number||032957, 12032957, US 7918799 B2, US 7918799B2, US-B2-7918799, US7918799 B2, US7918799B2|
|Inventors||Heikki Antti Mikael HAVERI|
|Original Assignee||General Electric Company|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (36), Referenced by (11), Classifications (21), Legal Events (2)|
|External Links: USPTO, USPTO Assignment, Espacenet|
One or more embodiments of this invention relate generally to a method and interface for cooling electronics that generate heat, especially electronics in ultrasound and biomedical systems.
As electronic devices are miniaturized, the amount of heat generated by the more densely populated electronics increases. As the amount of generated heat increases, the components within the device also operate at higher temperatures. These higher temperatures can degrade the performance of the devices. Moreover, the increased heat also emanates from the device. Accordingly, in some applications, for example, in medical ultrasound imaging probes that contact individuals during an exam, the increased heat not only can cause injury, but may exceeded acceptable regulatory levels. Accordingly, these devices have to be cooled.
In the medical imaging area, and particularly, in the ultrasound imaging area, heat is often a serious problem as a result of the intense processing that has to be performed at the scan head of the ultrasound probe. The dissipated heat from the scan head (e.g., from the miniaturized electronics in the scan head) needs to be transferred away from the scan head both to ensure the safety of the individual being scanned and to comply with certain regulatory guidelines to maximum heating conditions, which are especially critical when performing obstetrical scans. Additionally, increased heating of the scan head can affect the useful life of the ultrasound probe.
Current methods to dissipate the heat in devices with miniaturized electronics typically include heat sinks or heat exchangers that are complex, large and heavy. Thus, the reduced sized advantage gained from the miniaturized electronics is offset by the heat dissipation components that are needed. These current heat dissipation methods also add time and cost to manufacturing and maintenance, as well as result in a device that is often more cumbersome to use. For example, in ultrasound imaging systems (e.g., 3D ultrasound imaging systems), FR-4 (Flame Retardant 4) material is often used to manufacture the printed circuit boards within the probes of these systems. The processors and miniaturized components on these printed circuit boards generate heat that must be dissipated.
In order to dissipate the heat, these ultrasound imaging systems typically include several electronic circuit boards, for example, eight electronic circuit boards that are successively glued between metallic plates. The metallic plates are in connection with each other through one divergent plate on one side. The parallel metal plates function as cooling ribs for the electronic circuit boards and conduct to the divergent plate the heat dissipated by the electronics. The divergent plate is also connected to an aluminum body or housing. The assembly also may be surrounded in copper or aluminum tape. The aluminum housing includes machined channels to allow fluid flow therethrough. The channels are pneumatically connected to a connector end of a probe of the ultrasound system through tubing. The connector end of the probe includes a diaphragm pump and another aluminum body or liquid tank that is also in pneumatic connection with the tubing. Cooling liquid is circulated inside the tubing by the pump and through the two aluminum bodies (one at the transducer end of the probe and one at the connector end of the probe). This cooling system attempts to transfer heat away from the hand held transducer end to the connector end in order, for example, to meet mandated maximum temperature levels, as well as to improve the operation of the transducer. However, as a result of the different components needed in this cooling assembly, the overall device size and weight is increased, which affects the portability and potential applications for the ultrasound system. Also, the device is often time consuming to manufacture because the manufacturing steps have to be performed by hand. Additionally, the pump has a tendency to leak, which not only reduces the performance of the probe, but requires constant drying or maintenance.
In one embodiment, an interface for cooling electronics is provided that includes a housing having tubing (i) therein to transfer heat from liquid flowing in the tubing and (ii) extending therefrom and configured to engage a pump. The tubing forms a closed circulation path. The interface further includes an electrical connection member configured to provide electrical connection through the housing and to the electronics.
In another embodiment, an ultrasound system is provided that includes an ultrasound scanner having a pump and including a connection port. The ultrasound system further includes a probe having a connector including a cooling system therein. The connector is configured to engage the connection port and wherein engagement of the connector with the connection port provides (i) electrical connection between the ultrasound scanner and the probe and (ii) connection of the cooling system to the pump of the ultrasound scanner.
In yet another embodiment, a method of cooling an ultrasound system is provided. The method includes circulating fluid within a closed tubing path that extends from a connector of an ultrasound probe of the ultrasound system to electronics within the ultrasound probe. The fluid is circulated using a pump located within an ultrasound scanner of the ultrasound system. The method further includes thermally connecting tubing within the connector with a housing of the connector and wherein the connector is thermally connected to the ultrasound scanner when the connector of the ultrasound probe engages the ultrasound scanner.
The foregoing summary, as well as the following detailed description of certain embodiments of the present invention, will be better understood when read in conjunction with the appended drawings. To the extent that the figures illustrate diagrams of the functional blocks of various embodiments, the functional blocks are not necessarily indicative of the division between hardware circuitry. Thus, for example, one or more of the functional blocks (e.g., processors or memories) may be implemented in a single piece of hardware (e.g., a general purpose signal processor or random access memory, hard disk, or the like). Similarly, the programs may be stand alone programs, may be incorporated as subroutines in an operating system, may be functions in an installed software package, and the like. It should be understood that the various embodiments are not limited to the arrangements and instrumentality shown in the drawings.
As used herein, an element or step recited in the singular and proceeded with the word “a” or “an” should be understood as not excluding plural of said elements or steps, unless such exclusion is explicitly stated. Furthermore, references to “one embodiment” of the present invention are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features. Moreover, unless explicitly stated to the contrary, embodiments “comprising” or “having” an element or a plurality of elements having a particular property may include additional such elements not having that property. Additionally, the arrangement and configuration of the various components described herein may be modified or changed, for example, replacing certain components with other components or changing the order or relative positions of the components.
Various embodiments of the invention provide an interface, such as a connector that allows cooling of electronics within systems, for example, electronics of printed circuit boards within an ultrasound imaging system. The heat dissipated within the system is transferred away from the electronics using fluid flow pumped through the interface. It should be noted that when reference is made herein to fluid, this is not limited to liquid or any type of liquid, but can include, for example, air, gas, oil, etc. In general, the fluid is any type of substance that can flow through the integrated cooling channels to provide a cooling effect. The fluid may be selected based on the particular application. For example, an electronics cooling liquid may be used to cool electronics.
The interface 20 also includes a cooling system 21 therein (shown in
The interface 20 on another side 28 includes tubing 30, for example, elastic tubing that connects the interface 20 to electronics 32 to be cooled. The tubing 30 includes therein means therein that provides both electrical connection, via electrical wires 34 to the electronics 32, and a fluid flow path through one or more fluid tubes 36 (e.g., rubber, silicone or plastic tubes), to the electronics 32 or to a region in proximity to the electronics 32. The tubing 30 may be any type of covering or enclosure surrounding the electrical wires 34 and fluid tubes 36. Separate tubing 30 may be provided for each of the electrical wires 34 and fluid tubes 36 or optionally no tubing 30 may be provided. The electrical wires 34 connect, for example, to electronic components 38 mounted on one or more electronic circuit boards 40 using any known connection means. In one embodiment, the one or more fluid tubes 36 also connect to the one or more electronic circuit boards 40 at ports 42 of the electronic circuit boards 40. The one or more electronic circuit boards 40 may include integrated fluid channels that circulate fluid therethrough. In this embodiment, the one or more electronic circuit boards 40 may be formed using a Low Temperature Co-fired Ceramics (LTCC) process. In particular, the one or more electronic circuit boards 40 may be formed as described in co-pending and commonly assigned U.S. patent application Ser. No. 12/032,940, entitled “Method and Apparatus for Cooling in Miniaturized Electronics,” which is hereby incorporated by reference in its entirety.
It should be noted that the fluid tubes 36 optionally may be positioned adjacent or proximate the electronics 32 to provide fluid flow in close proximity to the electronic components 38. Fluid connectors 44 may also connect different ports 46 of different electronic circuit boards 40 to provide fluid flow between the different electronic circuit boards 40. However, the various embodiments are not limited to this type of serial fluid flow connection, but instead may have a parallel connection wherein each electronic circuit board 40 is connected to a different fluid tube 36. It also should be noted that there is not necessarily a one to one relation between the fluid tubes 36 from the interface 20 and the fluid tubes 36 at the electronics 32. For example, a single fluid tube 36 may be provided at the side 28 of the interface 20 and the fluid tube 36 split or divided into two different fluid tubes 36 at the electronics 32 for connection to different electronic circuit boards 40. However, there may be a one to one relation, wherein, for example, two fluid tubes 36 are provided at the side 28 of the interface 20 that extend to the electronics 32. The fluid tubes 36 may be formed of any suitable material (e.g., rubber or plastic) that allows fluid flow therethrough. For example, the fluid tubes 36 may be formed from materials based on whether the fluid flowing through the fluid tubes 36 is a liquid or gas, and further, the specific type of liquid or gas.
The interface 20 is configured to connect to the host machine 50, for example, within a connection port 56 (e.g., a recessed portion) of the host machine 50. The connection port 56 may be provided in any type of configuration that allows secure connection of the interface 20 to the host machine 50. The connection port 56 generally includes an electrical connection member 58 that connects with the electrical connection member 24 of the interface 20 when the interface 20 is engaged to connection port 56. This complementary connection arrangement provides electrical connection from the host machine 50 to the electronics 32 through the interface 20. For example, in an ultrasound system as described in more detail below, the electrical connection provides an electrical signal path from the ultrasound system to the ultrasound probe to operate transducer elements in the probe scan head that are controlled using electronic components, for example, the electronics 32. The connection port 56 also includes a cavity 60 that receives therein the tube loop 23 when the interface is engaged to connection port 56.
The cavity 60 includes an open portion 62 for receiving therein a pump head 72 of the pump 70. Accordingly, after the interface 20 is engaged with the connection port 56, the pump 70 is inserted within the open portion 62 to engage the pump loop 23, which in this embodiment is a peristaltic or positive displacement pump arrangement wherein the pump loop 23 surround the pump head 72. In one embodiment, the pump 70 is manually inserted within the open portion 62, for example, by a user pushing the pump 70 therein or operating a manual lever or arm to move the pump 70 into the open portion 62. In another embodiment, the pump 70 is automatically inserted within the open portion 62, for example, using an electric motor configured to move the pump head 72 into position such that the pump head 72 engages the tube loop 23.
The pump 70 may be any type of pump that circulates fluid through the loop tube 23, metal tubing 54 and the fluid tubes 36. For example, as shown in
Thus, in operation, the interface 20 provides electrical connection to the electronics 38 and also allows fluid flow to transfer heat generated by the electronics 38. In particular, using the various embodiments of the invention, when the tube loop 23 engages the pump 70, which causes fluid flow, the metal tubing 54 that is thermally connected to the housing 55 of the interface 20 transfers heat from the liquid within the metal tubing 54 to surfaces of the housing 55. This transferred heat is then dissipated into the surrounding air. Also, when the interface 20 is engaged to the connection port 56 of the host machine 50, the interface 20 essentially provides a thermal connection to the thermally conducting surfaces of the host machine 50, for example, the metal surfaces of the host machine 50 (e.g., metal surfaces of an ultrasound scanner). The heat is then dissipated into the surrounding air. Thus, heat is transferred from the electronics 32, which may be located, for example, in the transducer end of a scan head of an ultrasound probe, within the circulating fluid, through the interface 20 (that dissipates the transferred heat) into the housing of the host machine 50, where the heat also may be dissipated into the surrounding air.
It should be noted that although the various embodiments are described below in connection with an ultrasound system, the various embodiments are not limited to ultrasound systems or diagnostic imaging systems. The various embodiments may be implemented as part of or in any system where cooling of electronics is desired or needed. For example, the various embodiments may be used to cool any type of processor, electronic processing device, processing machine, etc. such as the processors or integrated circuits associated with a personal computer (PC) system.
At least one technical effect of the various embodiments is transferring heat generated from electronics using fluid flow from the electronics through an interface and into a host machine. Heat transferred from the electronics is dissipated into the surrounding air from the interface and the host machine. Accordingly, no cooling ribs or separate aluminum body for the pump are needed. Thus, and for example, a hand held ultrasonic transducer can be made smaller, lighter and containing considerably less handwork. For example, in an ultrasound system, the connector end of the probe (e.g., the interface) becomes much smaller, lighter and less expensive because the pump does not have to be included therein. Power consumption and heat balance also may be improved as the pump is moved into the host machine. Reliability also increases as the tubing forms a closed loop with less connections and connection joints and as the pump is no longer part of the probe.
In particular, the various embodiments may be used to transfer heat from the electronics associated with a probe having a transducer 206 (or transducer array) in an ultrasound system 200 as shown in
The ultrasound system 200 also includes a processor module 216 to process the acquired ultrasound information (e.g., RF signal data or IQ data pairs) and prepare frames of ultrasound information for display on display 218. The processor module 216 is adapted to perform one or more processing operations according to a plurality of selectable ultrasound modalities on the acquired ultrasound information. Acquired ultrasound information may be processed and displayed in real-time during a scanning session as the echo signals are received. Additionally or alternatively, the ultrasound information may be stored temporarily in memory 214 or memory 222 during a scanning session and then processed and displayed in an off-line operation.
A user interface 224 may be used to input data into the system 200 and to adjust settings and control operation of the processor module 216. One or both of memory 214 and memory 222 may store two-dimensional (2D) and/or three-dimensional (3D) datasets of the ultrasound data, where such datasets are accessed to present 2D and/or 3D images. Multiple consecutive 3D datasets may also be acquired and stored over time, such as to provide real-time 3D or four-dimensional (4D) display. The images may be modified and the display settings of the display 218 also manually adjusted using the user interface 224.
In particular, the various embodiments of the invention may be implemented to transfer heat from the electronics of an ultrasound probe 250 shown in
The communication interface 264 establishes data exchange with a host system 266 over communication lines 268 (e.g., digital signal lines) and through a system cable that may form part of the tubing 30. Additionally, in an exemplary embodiment, the system cable includes coaxial cables 272, that may form all or part of the electrical wires 34, that connect to the processing boards 256 to communicate transmit pulse waveforms to the transducer array 252 and communicate receive signals, after beamforming, to the host system 266. The probe 250 also may include the interface 20, through which the probe 250 connects to the host machine 50. This connection arrangement, as described in more detail above, also provides cooling of the electronics using fluid tubes 36 that convey fluid therethrough.
A clamp 276 may be provided to hold the transducer flex cables 254 against the processing boards 256. The clamp 276 thereby aids in establishing electrical connectivity between the transducer flex cables 254 and the processing boards 256. The clamp 276 may include a dowel pin 278 and a bolt 280, although other implementations are also suitable.
For every ultrasound beam, the location memory controller 262 connects via digital signal lines 273 (e.g., carried by a separate flex cable) to each location memory 258 on each processing board 256. The location memory controller 262 communicates the spatial location information into each location memory 258 for each receive aperture processed by the signal processors 260 on the processing boards 256. The digital signal lines 273 may include, for example, a clock line for each processing board 256, a serial command data line for each processing board 256, two data lines (for a total of fourteen data lines) connected to each processing board 256, an output enable for one or more of the signal processors 260, and a test signal.
The location memory controller 262 communicates with the host system 266 over the digital signal lines 273 that may form part of, for example, a synchronous serial port. To that end, the communication interface 264 and digital signal lines 273 may implement a low voltage differential signal interface, for example, including a coaxial cable with a grounded shield and center signal wire. The location memory controller 262 includes a block of cache memory 275, for example, 1-8 MBytes of static random access memory (SRAM).
However, and as noted above, the various embodiments are not limited to use in connection with an ultrasound system or any medical imaging system. The various embodiments may be implemented in connection with any system that includes electronic components, such as electronic circuit boards.
It is to be understood that the above description is intended to be illustrative, and not restrictive. For example, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. While the dimensions and types of materials described herein are intended to define the parameters of the invention, they are by no means limiting and are exemplary embodiments. Many other embodiments will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. Further, the limitations of the following claims are not written in means-plus-function format and are not intended to be interpreted based on 35 U.S.C. §112, sixth paragraph, unless and until such claim limitations expressly use the phrase “means for” followed by a statement of function void of further structure.
This written description uses examples to disclose the invention, including the best mode, and also to enable any person skilled in the art to practice the invention, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims.
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|U.S. Classification||600/459, 165/104.19|
|International Classification||A61B8/12, A61B8/00, F28D15/00|
|Cooperative Classification||A61B8/44, G06F2200/201, F28D15/00, G01S15/899, A61B8/4483, H01L2924/09701, H01L23/473, A61B8/546, G06F1/20, H01L2924/0002|
|European Classification||G01S15/89D8, A61B8/00, G06F1/20, H01L23/473, A61B8/54D, A61B8/44R|
|May 5, 2008||AS||Assignment|
Owner name: GENERAL ELECTRIC COMPANY, NEW YORK
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HAVERI, HEIKKI ANTTI MIKAEL;REEL/FRAME:020901/0789
Effective date: 20080228
|Oct 6, 2014||FPAY||Fee payment|
Year of fee payment: 4