|Publication number||US7936119 B2|
|Application number||US 12/407,562|
|Publication date||May 3, 2011|
|Filing date||Mar 19, 2009|
|Priority date||Oct 16, 2008|
|Also published as||CN201293279Y, US20100096966, WO2010043115A1|
|Publication number||12407562, 407562, US 7936119 B2, US 7936119B2, US-B2-7936119, US7936119 B2, US7936119B2|
|Inventors||Yung Pun Cheng|
|Original Assignee||Yung Pun Cheng|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (38), Non-Patent Citations (1), Referenced by (11), Classifications (13), Legal Events (1)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This patent application relates and claims priority to Chinese patent application 200820138251.6 filed Oct. 16, 2008, which is herein incorporated by reference for all purposes.
1. Technical Field
The present invention generally relates to light-emitting diode (LED) lamps. More specifically, the present invention relates to LED lamps with high heat-dissipation efficiency, wide illumination beam angles, and substantially uniform illumination intensity.
With recent developments in LED technologies, high-powered LED lamps are more frequently designed for use in household lighting applications. Compared with light sources currently used in homes, such as incandescent lights, LED lamps provide advantages such as ample brightness, energy savings, high reliability, and long life span.
Current commercially available LED lamps involve a plurality of packaged LEDs arranged in an array on a plane. Although this type of LED lamp may meet common lighting needs, the LED lighting elements are distributed on the same plane and, thus, the light being radiated from the LED lamp is highly directional and has a relatively narrow beam angle. In addition, this type of LED lamp lacks a good heat-dissipation structure which limits the life span due to the LEDs overheating. The heat dissipation issue can be solved by installing a radiator on the back of the base plane. For high-powered LED lighting elements, however, the packaging, including the adhesive base and the glass bubble, still interferes with effective heat dissipation.
The problem of a narrow beam angle has been addressed in LED lamp systems with both a plurality of LEDs and an LED carrier. These structures expand the beam angle, but the illumination intensity is not distributed in a uniform manner.
Accordingly, there is a need for an LED lamp with good heat-dissipation efficiency, wide illumination beam angles, and uniform illumination intensity.
This disclosure pertains to LED lamps, and in particular to LED lamps having a substrate with a plurality of inclined planes. The LED lamps provide adequate heat-dissipation efficiency, wide illumination beam angles, and substantially uniform illumination intensity.
According to an aspect, the LED lamp includes a substrate bearing LED lighting elements and a heat sink connected with the substrate. The LED lighting elements are distributed on at least one inclined plane of the substrate.
Known LED lamps lack good heat-dissipation efficiency in conjunction with wide illumination beam angles and uniform illumination intensity. To address common lighting needs, a plurality of LEDs may be arranged in an array on a plane, as disclosed in Chinese Pat. App. No. 01103850.0 (Pub. No. 1372096), entitled “LED Illumination Lamp” to T. Wang. In this configuration, a plurality of LEDs are installed with a sealing adhesive on planar base plates of an LED lamp housing and printed circuit boards are installed between the housing and lamp cap. This arrangement lacks adequate heat-dissipation limiting the lamp's life-span. This arrangement also suffers from inadequate breadth of illumination angles. To address the narrow beam angle design, a plurality of LEDs may be used in conjunction with an LED carrier, as disclosed in Chinese Pat. App. No. 200710044917.1 (Pub. No. 101182916), entitled “LED Lamps” to X. Zhan. Zhan discloses an LED carrier with multiple LED bearing planes—one of which is planar and another of which is inclined. LEDs are then distributed on the planes in a circle, at angularly equidistant points, which expands the beam angles but, due to the discontinuity between the inclined planes and the LEDs on the inclined planes being on a spherical surface, the illumination intensity is still non-uniform. Generally, disclosed embodiments seek to maximize heat-dissipation efficiency while providing wide illumination beam angles and uniform illumination intensity.
The LED lighting elements 106 may be placed at the junctions or edges of the inclined planes. The LED lighting elements 106 may be phosphor and bare, i.e. without the adhesive base, heat-dissipating substrate, pins, or a glass fixture. LED lighting elements 106 may be attached using heat conducting adhesive. Using bare LED lighting elements 106 improves heat dissipation. Placing LED lighting elements 106 at the junction or edges of the inclined planes increases the range of light angles emitted by the lighting elements via reflection off the inclined planes 105, 105′ at the junctions. LED lighting elements 106 may also be placed elsewhere on the inclined planes. Depending on the requirements of illumination, the number of LED lighting elements 106 on each plane 105, 105′ may be adjusted accordingly. The number of LED lighting elements 106 on each plane 105, 105′ may be zero, one, or more than one.
The heat sink 103 and the substrate 102 can be formed as one part, or can be formed separately and subsequently assembled. The outside of the heat sink 103 may comprise a considerable number of highly-efficient fin-shaped radiating structures to increase the contact area with air. The heat from the LED lighting elements 106 is transferred directly by conduction and dissipated through the fin-shaped radiation structures of the heat sink 103, resulting in higher heat dissipation efficiency. A reflector 107 may be positioned at the central axis of the substrate 102. The reflector 107 may be a round shape. The reflector 107 may also be square-shaped or any other shape.
LED lighting elements 106 are connected to two power wire interfaces 109 by two thin bonding wires 110 in order to draw power. The bonding wires 110 are preferably the commonly available wires. The LED wire interfaces 109 are small metal sheets inserted in, and electrically insulated from, the substrate 102.
While various embodiments in accordance with the principles disclosed herein have been described above, it should be understood that they have been presented by way of example only, and not limitation. Thus, the breadth and scope of the invention(s) should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with any claims and their equivalents issuing from this disclosure. Furthermore, the above advantages and features are provided in described embodiments, but shall not limit the application of such issued claims to processes and structures accomplishing any or all of the above advantages.
Additionally, the section headings herein are provided for consistency with the suggestions under 37 CFR 1.77 or otherwise to provide organizational cues. These headings shall not limit or characterize the invention(s) set out in any claims that may issue from this disclosure. Specifically and by way of example, although the headings refer to a “Technical Field,” the claims should not be limited by the language chosen under this heading to describe the so-called field. Further, a description of a technology in the “Background” is not to be construed as an admission that certain technology is prior art to any invention(s) in this disclosure. Neither is the “Summary” to be considered as a characterization of the invention(s) set forth in issued claims. Furthermore, any reference in this disclosure to “invention” in the singular should not be used to argue that there is only a single point of novelty in this disclosure. Multiple inventions may be set forth according to the limitations of the multiple claims issuing from this disclosure, and such claims accordingly define the invention(s), and their equivalents, that are protected thereby. In all instances, the scope of such claims shall be considered on their own merits in light of this disclosure, but should not be constrained by the headings set forth herein.
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|U.S. Classification||313/498, 313/506, 313/512, 313/500|
|International Classification||H01J1/62, H01J63/04|
|Cooperative Classification||F21V29/83, F21K9/135, F21Y2111/001, F21Y2111/007, F21Y2101/02, F21V29/20|