|Publication number||US7993021 B2|
|Application number||US 11/601,295|
|Publication date||Aug 9, 2011|
|Filing date||Nov 17, 2006|
|Priority date||Nov 18, 2005|
|Also published as||EP1948993A1, EP1948994A1, EP1948994B1, US7959325, US8123375, US8556464, US20070115670, US20070115671, US20090219714, US20110228530, WO2007061758A1, WO2007061789A1, WO2007061815A1|
|Publication number||11601295, 601295, US 7993021 B2, US 7993021B2, US-B2-7993021, US7993021 B2, US7993021B2|
|Inventors||John K. Roberts, Paul E. Sims, Chenhua You|
|Original Assignee||Cree, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (108), Non-Patent Citations (10), Referenced by (12), Classifications (27), Legal Events (2)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This application claims the benefit of and priority to U.S. Provisional Patent Application No. 60/738,305 entitled “SYSTEM AND METHOD FOR INTERCONNECTION AND INTEGRATION OF LED BACKLIGHTING MODULES” filed Nov. 18, 2005, and U.S. Provisional Patent Application No. 60/749,133 entitled “SOLID STATE BACKLIGHTING UNIT ASSEMBLY AND METHODS” filed Dec. 9, 2005, the disclosures of which are hereby incorporated herein by reference as if set forth in their entirety.
The present invention relates to solid state lighting, and more particularly to tiles and/or panels including solid state lighting components.
Solid state lighting arrays are used for a number of lighting applications. For example, solid state lighting panels including arrays of solid state lighting devices have been used as direct illumination sources, for example, in architectural and/or accent lighting. A solid state lighting device may include, for example, a packaged light emitting device including one or more light emitting diodes (LEDs). Inorganic LEDs typically include semiconductor layers forming p-n junctions. Organic LEDs (OLEDs), which include organic light emission layers, are another type of solid state light emitting device. Typically, a solid state light emitting device generates light through the recombination of electronic carriers, i.e. electrons and holes, in a light emitting layer or region.
Solid state lighting panels are commonly used as backlights for small liquid crystal display (LCD) display screens, such as LCD display screens used in portable electronic devices. In addition, there has been increased interest in the use of solid state lighting panels as backlights for larger displays, such as LCD television displays.
For smaller LCD screens, backlight assemblies typically employ white LED lighting devices that include a blue-emitting LED coated with a wavelength conversion phosphor that converts some of the blue light emitted by the LED into yellow light. The resulting light, which is a combination of blue light and yellow light, may appear white to an observer. However, while light generated by such an arrangement may appear white, objects illuminated by such light may not appear to have a natural coloring, because of the limited spectrum of the light. For example, because the light may have little energy in the red portion of the visible spectrum, red colors in an object may not be illuminated well by such light. As a result, the object may appear to have an unnatural coloring when viewed under such a light source.
The color rendering index of a light source is an objective measure of the ability of the light generated by the source to accurately illuminate a broad range of colors. The color rendering index ranges from essentially zero for monochromatic sources to nearly 100 for incandescent sources. Light generated from a phosphor-based solid state light source may have a relatively low color rendering index.
For large-scale backlight and illumination applications, it is often desirable to provide a lighting source that generates a white light having a high color rendering index, so that objects and/or display screens illuminated by the lighting panel may appear more natural. Accordingly, such lighting sources may typically include an array of solid state lighting devices including red, green and blue light emitting devices. When red, green and blue light emitting devices are energized simultaneously, the resulting combined light may appear white, or nearly white, depending on the relative intensities of the red, green and blue sources. There are many different hues of light that may be considered “white.” For example, some “white” light, such as light generated by sodium vapor lighting devices, may appear yellowish in color, while other “white” light, such as light generated by some fluorescent lighting devices, may appear more bluish in color.
In order for a lighting source such as a display panel that includes a plurality of different-colored lighting elements, such as red, green and blue light sources, to display a consistent image, it is typically desirable for the light from the different colored lighting elements to be thoroughly mixed before it is emitted by the lighting source. However, achieving substantial mixing of light from different colored light sources may become more and more difficult as display panels are made thinner.
For larger display and/or illumination applications, multiple solid state lighting tiles may be connected together, for example, in a two dimensional array, to form a larger lighting panel. Unfortunately, however, the hue of white light generated may vary from tile to tile, and/or even from lighting device to lighting device. Such variations may result from a number of factors, including variations of intensity of emission from different LEDs, and/or variations in placement of LEDs in a lighting device and/or on a tile.
A solid state lighting tile according to some embodiments of the invention includes a substrate and a plurality of light sources on a surface of the substrate. Respective ones of the plurality of light sources include first and second mounting positions configured to receive solid state light emitting devices, and at least first and second ones of the solid state light sources may be electrically connected in series. The tile further includes a plurality of solid state light emitting devices configured to emit a first color light, and respective ones of the solid state light emitting devices may be mounted in respective ones of the plurality of solid state light sources. One of the first color light emitting devices may be mounted in the first mounting position of the first solid state light source and a second of the first color light emitting devices may be mounted in the second mounting position of the second solid state light source.
The solid state lighting tile may further include a third light source connected in series with the first and second light sources. Respective ones of the light sources include a third mounting position configured to receive a solid state light emitting device, and a third of the first color light emitting devices may be mounted in the third mounting position of the third solid state light source. The first, second and third of the first color light emitting devices may be electrically connected in series.
The first mounting position of a light source may be rotationally offset from the second mounting position of the light source relative to a center of the light source.
The respective ones of the light sources include a third mounting position configured to receive a solid state light emitting device, and the third mounting position of the light source may be rotationally offset from the first and second mounting positions relative to the center of the light source.
The solid state lighting tile may further include a reflector panel on the surface of the substrate, the reflector panel including a plurality of apertures aligned with respective ones of the plurality of light sources. The reflector panel may include a diffuse reflector and may include MCPET. Respective ones of the light sources include an encapsulant dome over the solid state lighting devices.
Respective ones of the mounting positions may include a mounting pad and an electrical lead extending away from the mounting pad, and respective ones of the light sources may further include a solder mask exposing the mounting positions of the respective light sources. The encapsulant dome of a respective light source may cover the mounting pads and the electrical leads of the light source.
The solid state lighting panel may further include electrical test pads adjacent one of the light sources. The electrical test pads may be configured to permit individual testing of the light emitting devices of the one of the light sources.
The first and second light sources may be connected in series in a first path extending from a first end of the substrate to a second end of the substrate opposite from the first end, and the lighting panel may further include third and fourth light sources connected in series in a second path and extending parallel to the first string from the second end of the substrate to the first end of the substrate.
The solid state lighting tile may further include a retention hole therethrough, the retention hole being located near the center of a triangle formed by the first and second light sources in the first string and one of the third or fourth light sources of the second string.
The solid state lighting tile may further include a third solid state light source defining a triangle on the tile together with the first and second light sources. Respective ones of the first, second and third solid state light sources may include a third mounting position configured to receive a solid state light source, and a third of the first color light emitting devices may be mounted in the third mounting position of the third solid state light source. The first, second and third light sources may be arranged to form an equilateral triangle.
A solid state lighting tile according to further embodiments of the invention includes a substrate and a plurality of light sources on a surface of the substrate. Respective ones of the plurality of light sources include first, second and third mounting positions configured to receive solid state light emitting devices, a plurality of first solid state light emitting devices configured to emit a first color light, a plurality of second solid state light emitting devices configured to emit a second color light, and a plurality of third solid state light emitting devices configured to emit a third color light. Respective ones of the first, second and third solid state light emitting devices may be mounted in respective ones of the plurality of solid state light sources so that respective ones of the light sources include a first solid state light emitting device, a second solid state light emitting device, and a third solid state light emitting device. The light sources may be configured such that the mounting positions of respective first, second and third light emitting devices in the light sources are not repeated in neighboring light sources.
The first mounting position of a solid state light source may be rotationally offset from the second mounting position of the solid state light source relative to a center of the solid state light source. The third mounting position of the light source may be rotationally offset from the first and second mounting positions relative to the center of the light source.
The plurality of light sources may include a first group of light sources arranged along a first line and a second group of light sources arranged along a second line that may be parallel to the first line, and the second group of light sources may be laterally offset from the first group of light sources. In some embodiments, the second group of light sources may be offset from the first group of light sources by a distance d that is about half the spacing between adjacent ones of the light sources in the first group of light sources.
A solid state lighting tile according to still further embodiments of the invention includes a substrate and a light source on a surface of the substrate. The light source includes first and second die attach pads configured to receive solid state light emitting devices, first and second wire bond pads associated with the respective first and second die attach pads, first and second electrical traces extending away from the respective first and second die attach pads on a first side of the light source, and third and fourth electrical traces extending away from the respective first and second wire bond pads on a second side of the light source opposite the first side. The second electrical trace may be nearer a third side of the light source between the first and second sides of the light source than the first electrical trace, and the third electrical trace may be nearer the third side of the light source than the fourth electrical trace.
The light source may further include a third die attach pad configured to receive solid state a light emitting device, a third wire bond pad associated with the third die attach pad, a fifth electrical trace extending away from the third die attach pad on the first side of the light source, and a sixth electrical trace extending away from the third wire bond pads on the second side of the light source. The fifth electrical trace may be between the first and second electrical traces on the first side of the light source, and the third electrical trace may be between the fourth and sixth electrical traces on the second side of the light source.
The first die attach pad may be rotationally offset from the second die attach pad relative to a center of the light source. The third die attach pad may be rotationally offset from the first and second die attach pads relative to the center of the light source.
Methods of forming a solid state lighting tile according to some embodiments of the invention include defining a plurality of light source locations on the tile, the light source locations including first, second and third die attach pads in first, second and third mounting positions, respectively, mounting a first light emitting device configured to emit a first color of light in a first mounting position of a first light source location, and mounting a second light emitting device configured to emit a color of light different than the first color of light in the first mounting position of a second light source location neighboring the first light source location. Defining the light source locations may include arranging the light source in an array of triangles on the tile.
The methods may further include mounting a third light emitting device configured to emit the first color of light in a mounting position of the second light source location other than the first mounting position. The first, second and third mounting positions of respective light source locations may be rotationally offset from one another.
The methods may further include forming a retention hole positioned at the center of one of the triangles of the array of triangles. The methods may further include connecting the first light emitting device in series with the third light emitting device.
A solid state lighting tile according to further embodiments of the invention includes a plurality of lighting element clusters on a surface of the tile. Each of the lighting element clusters is configured to receive a plurality of different color LEDs, and at least two of the lighting element clusters are configured to receive the different color LEDs at different mounting positions therein.
Each of the lighting element clusters may include first and second mounting positions. The first mounting position of a lighting element cluster may be rotationally offset from the second mounting position of the lighting element cluster relative to a center of the lighting element cluster.
Each of the lighting element clusters may include a third mounting position configured to receive a solid state light emitting device, and the third mounting position of the lighting element cluster may be rotationally offset from the first and second mounting positions relative to the center of the lighting element cluster.
Other apparatus and/or methods according to embodiments of the invention will be or become apparent to one with skill in the art upon review of the following drawings and detailed description. It is intended that all such additional apparatus and/or methods be included within this description, be within the scope of the present invention, and be protected by the accompanying claims.
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate certain embodiment(s) of the invention. In the drawings:
Embodiments of the present invention now will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present invention. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
It will be understood that when an element such as a layer, region or substrate is referred to as being “on” or extending “onto” another element, it can be directly on or extend directly onto the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” or extending “directly onto” another element, there are no intervening elements present. It will also be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present.
Relative terms such as “below” or “above” or “upper” or “lower” or “horizontal” or “vertical” may be used herein to describe a relationship of one element, layer or region to another element, layer or region as illustrated in the figures. It will be understood that these terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” “comprising,” “includes” and/or “including” when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The present invention is described below with reference to flowchart illustrations and/or block diagrams of methods, systems and computer program products according to embodiments of the invention. It is to be understood that the functions/acts noted in the blocks may occur out of the order noted in the operational illustrations. For example, two blocks shown in succession may in fact be executed substantially concurrently or the blocks may sometimes be executed in the reverse order, depending upon the functionality/acts involved. Although some of the diagrams include arrows on communication paths to show a primary direction of communication, it is to be understood that communication may occur in the opposite direction to the depicted arrows.
Referring now to
In the embodiments illustrated in
A locking feature 27 is disposed approximately in the center of the tile 10. In particular, the locking feature 27 may include an aperture in tile 10 that may receive a twist-locking mechanism therethrough.
An alignment notch 29 may be provided in the tile 10 to assist connection of an edge connector (not shown). Furthermore, notches 33 may be provided in the corners of the tiles 10 to avoid contact between the reflector panel 40 and/or tile 10 and the screws of a substrate board and/or bar on which the tile 10 is mounted. The tile 10 may further include one or more automation indexing holes (not shown) that may be used to move the tile during automated manufacturing steps.
One or more retention holes 35 may also be present in the tile 10, as shown in
The solid state lighting element clusters 12 may include, for example, organic and/or inorganic light emitting devices. An example of a solid state lighting element cluster 12 for high power illumination applications is illustrated in
The LED chips 16 may include at least a red LED 16R, a green LED 16G and a blue LED 16B. The blue and/or green LEDs may be InGaN-based blue and/or green LED chips available from Cree, Inc., the assignee of the present invention. The red LEDs may be, for example, AlInGaP LED chips available from Epistar, Osram and others. The lighting device 12 may include an additional green LED in order to make more green light available.
In some embodiments, the LEDs 16 may have a square or rectangular periphery with an edge length of about 900 μm or greater (i.e. so-called “power chips.” However, in other embodiments, the LED chips 16 may have an edge length of 500 μm or less (i.e. so-called “small chips”). In particular, small LED chips may operate with better electrical conversion efficiency than power chips. For example, green LED chips with a maximum edge dimension less than 500 microns and as small as 260 microns, commonly have a higher electrical conversion efficiency than 900 micron chips, and are known to typically produce 55 lumens of luminous flux per Watt of dissipated electrical power and as much as 90 lumens of luminous flux per Watt of dissipated electrical power.
As further illustrated in
LED chips 16 of the lighting element clusters 12 in the tile 10 may be electrically interconnected as shown in the schematic circuit diagram in
A string 32R, 32G, 32B may include all, or less than all, of the corresponding LEDs in the first path 20. For example, the string 32B may include all of the blue LEDs 16B from all of the lighting element clusters 12 in the first path 20. Alternatively, a string 32R, 32G, 32B may include only a subset of the corresponding LEDs in the first path 20. Accordingly the first path 20 may include three serial strings 32R, 32G, 32B arranged in parallel on the tile 10.
The second path 21 on the tile 10 may include three serial strings 31R, 31G, 31B arranged in parallel. The strings 31R, 31G, 31B are connected to anode contacts 26R, 26G, 26B, which are arranged at the second end of the tile 10 and to cathode contacts 28R, 28G, 28B, which are arranged at the first end of the tile 10, respectively.
It will be appreciated that, while the embodiments illustrated in
Multiple tiles 10 may be assembled to form a larger lighting bar assembly 30 as illustrated in
Furthermore, the cathode contacts 24 of the first path 20 of the rightmost tile 10″ may be electrically connected to the anode contacts 26 of the second path 21 of the rightmost tile 10″ by a loopback connector 35. For example, the loopback connector 35 may electrically connect the cathode 24R of the string 32R of red LED chips 16R of the first path 20 of the rightmost tile 10″ with the anode 26R of the string 31R of red LED chips of the second path 21 of the rightmost tile 10″. In this manner, the string 32R of the first path 20 may be connected in serial with the string 31R of the second path 21 by a conductor 35R of the loopback connector 35 to form a single string of red LED chips 16R. The other strings of the paths 20, 21 of the tiles 10, 10′, 10″ may be connected in a similar manner.
The loopback connector 35 may include an edge connector, a flexible wiring board, or any other suitable connector. In addition, the loop connector may include printed traces and/or wire loops formed on/in the tile 10.
While the bar assembly 30 shown in
In some embodiments, a bar assembly 30 may include three LED strings (one red, one green and one blue). Thus, a lighting panel 40 including nine bar assemblies may have 27 separate strings of LEDs. Moreover, in a bar assembly 30 including six tiles 10 with eight solid state lighting element clusters 12 each, an LED string may include 48 LEDs connected in series.
A backlight assembly 100 is shown in exploded perspective view in
An optional thermal spacer, such as a graphite thermal spacer 41, may be provided between the cover bottom 44 and the bars 20. The thermal spacer 41 may include, for example, an anisotropic carbon spreader such as the Spreadershield available from Graphtec International, Ltd., of Cleveland, Ohio. The thermal spacer 41 may help disperse residual thermal nonuniformities in the system. The thermal spacer 41 may be held in place by compression force between the cover bottom 44 and the bars 20. Alternatively or additionally, the thermal spacer 41 may be pre-installed in the cover bottom 44 held in place using, for example, a two-sided pressure sensitive adhesive tape until final assembly.
The tiles 10 may be affixed to respective bars 20, for example, by means of an adhesive. In some embodiments, the adhesive may be a thermally conductive, pressure sensitive adhesive to provide a thermally conductive interface between the bars 20 and the tiles 10. The entire assembly may be fastened together, for example, by means of mechanical fasteners (not shown).
Some further aspects of a tile 10 according to embodiments of the invention are illustrated in
A lighting element cluster 12 is shown in more detail in the partial cross-section of
As further illustrated in
The lighting element cluster 12 may include more than one pair of die attach/wirebond pads to accommodate more than one LED 76, as illustrated in
The die attach pads 85 a-c provide a plurality of LED mounting positions in the lighting element cluster 12. For example, as seen in
In some embodiments, however, the electrical traces may be arranged such that the electrical traces on one side of the light source are re-oriented with respect to the electrical traces on the other side of the light source. For example, as shown in
A second light source 92 is connected in series with the lighting element cluster 12′. The second light source 92 includes first, second and third die mounting pads 95 a, 95 b and 95 c and associated wirebond pads 97 a, 97 b and 97 c. Wirebond connections 98 a-c connect LEDs (not shown) on the die attach pads 95 a-c to the wirebond pads 97 a-c. A first set of electrical traces 94 a, 94 b and 94 c extend from respective ones of the die mounting pads 95 a, 95 b, 95 c at a first side of the second light source 92. The second light source 92 further includes a second set of electrical traces 96 a, 96 b and 96 c that extend from respective ones of the wire bond pads 97 a, 97 b and 97 c toward the second side of the second light source 92.
As shown in
In the adjacent lighting element cluster 12 a-2 in the same line 74 a, the red LED is mounted in the third mounting position, while the green LED is mounted in the first mounting position and the blue LED is mounted in the second mounting position. Continuing on, in the next lighting element cluster 12 a-3 in the first line 74 a, the red LED is mounted in the second mounting position, while the green LED is mounted in the third mounting position and the blue LED is mounted in the first mounting position.
Similarly, the LEDs in neighboring light sources in adjacent lines may be mounted in different mounting positions. For example, the mounting positions of the LEDs in the lighting element cluster 12 b-1 in the second line 74 b are different from the mounting positions of the neighboring LEDs in the lighting element clusters 12 a-1 and 12 a-2 in the first line 74 a.
More generally, the lighting element clusters 12 may be configured such that the mounting positions of LEDs in the light sources are not repeated in the neighboring light sources. For example, in the lighting element cluster 12 b-2, the red LED is located in the first mounting position, while in each of the light sources neighboring the lighting element cluster 12 b-2 (namely, lighting element clusters 12 b-1, 12 a-2, 12 a-3 and 12 b-3), a blue or green LED is located in the first mounting position.
The color uniformity of the tile 10 may be improved by placing same color LEDs in different mounting positions in adjacent lighting element clusters 12. For example, LEDs mounted in different mounting positions may have different emission patterns due to lensing, shadowing, reflection, and/or other optical effects. Thus, by alternating the mounting positions of different colored LEDs, the effects of lensing, shadowing, reflection, and/or other optical effects may be distributed across all of the constituent colors produced by the lighting element clusters 12 on the tile 10.
Methods of forming a solid state lighting tile are illustrated in
First color LEDs are mounted in mounting positions of neighboring light source locations other than the first mounting position (block 640. In particular, a third light emitting device configured to emit the first color of light is mounted in a mounting position of the second light source location other than the first mounting position. Other color LEDs are then mounted in mounting positions of the first light source location other than the first mounting position (block 650). The pattern may be repeated for each light source location until all mounting positions are filled (block 660).
Furthermore, the lighting element clusters 12 may be arranged in a pattern such that adjacent light sources form triangles, as shown in
In the drawings and specification, there have been disclosed typical embodiments of the invention and, although specific terms are employed, they are used in a generic and descriptive sense only and not for purposes of limitation, the scope of the invention being set forth in the following claims.
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|U.S. Classification||362/97.3, 362/249.06, 362/249.02, 362/231, 315/185.00S|
|International Classification||F21K99/00, G02F1/13357, F21V9/16, F21S4/00|
|Cooperative Classification||H01L2224/8592, H01L2224/49175, Y10S362/80, H05B33/0821, H05K1/142, H05K3/0058, G02F1/133603, F21K9/00, H05K1/181, G02F2001/133613, H05B33/0803, F21Y2101/02, G09F9/35, F21Y2105/001|
|European Classification||G02F1/1336B1, G09F9/35, H05B33/08D, H05B33/08D1L|
|Dec 18, 2006||AS||Assignment|
Owner name: CREE, INC., NORTH CAROLINA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ROBERTS, JOHN K.;SIMS, PAUL E.;YOU, CHENHUA;SIGNING DATES FROM 20061101 TO 20061120;REEL/FRAME:018676/0605
|Jan 21, 2015||FPAY||Fee payment|
Year of fee payment: 4