|Publication number||US8002025 B2|
|Application number||US 11/380,763|
|Publication date||Aug 23, 2011|
|Filing date||Apr 28, 2006|
|Priority date||Apr 28, 2006|
|Also published as||US20070252610|
|Publication number||11380763, 380763, US 8002025 B2, US 8002025B2, US-B2-8002025, US8002025 B2, US8002025B2|
|Inventors||David M. Audette, Philip J. Diesing, David L. Gardell|
|Original Assignee||International Business Machines Corporation|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (13), Classifications (13), Legal Events (6)|
|External Links: USPTO, USPTO Assignment, Espacenet|
The invention relates to the fabrication of integrated circuits, and more specifically, to a method and device for containment of a fluid in a thermal interface system for use during testing and burn-in of integrated circuits.
Due to the high costs associated with manufacturing integrated circuits (ICs), manufacturers typically perform testing at the wafer level, before further processing and packaging, and more importantly, before a customer becomes dissatisfied. A typical conventional testing method is as follows. A wafer is mounted on a chuck and held in place through suction. Probes are brought into contact with the circuit devices on the side of the wafer opposite to the chuck. The circuits are tested, sometimes at high power levels (on the order of several hundred watts per square centimeter), for functionality, power integrity, reliability and speed.
High power levels during testing will cause the devices to overheat which may result in inaccurate test results or damage to the device or probes. As the temperature increases, the device may tend to draw even more current, which results in further temperature increase, also known as thermal runaway.
Commonly, the chuck is configured to act as a heater or heat sink, being composed of copper, and having channels or a manifold to carry a temperature-regulating fluid. Effectively, the fluid regulates the temperature of the chuck, and the chuck regulates the temperature of the wafer. Chucks may have heating or thermoelectric elements to further control the temperature.
However, as the power of the device increases, the device temperature will increase above the chuck temperature due to the thermal interface resistance between the device and chuck. Improvements to the chuck to reduce the thermal interface resistance have been attempted, such as optimizing the surface finish, hardness and thermal conductivity of the chuck or the introduction of a high conductivity gas (helium) between the wafer and the chuck.
Further improvements to the interface resistance have been attempted by introducing a thermal interface fluid between the wafer and chuck at atmospheric pressure and simultaneously drawing the fluid away by vacuum. Use of water or aqueous solutions as a thermal interface fluid is advantageous due to its high thermal conductivity. Disadvantages of water are the potential for corrosion or electrical shorts if there is a leak. Various dielectric fluids are advantageous because thermal conductivity is higher than helium, there is minimal risk of corrosion or electrical shorts and any small amount of liquid left on the wafer evaporates without leaving a residue.
Such methods are unfavorable, though. First, because the wafer is held on to the chuck by suction, and the thermal interface fluid is drawn away from the interface at reduced pressure, such a fluid will often vaporize at reduced pressure, reducing the efficiency of the vacuum, and frequently escaping from the system during use. Even if the fluid is cooled after being drawn away from the interface, in order to condense the vapor back into a liquid, a substantial amount of vapor may still be exhausted. The preferred dielectric thermal interface fluids, which readily evaporate and leave little residue, typically have a low vapor pressure and are both expensive and not environmentally friendly. Therefore, any such exhaust is to be avoided.
Second, such a system is necessarily so complex that it is not only initially costly, but also expensive to maintain and prone to failure. Third, the thermal conductivity of a vapor is lower than that of a liquid. Therefore, the more the fluid at the interface is composed of a vapor (and the less of a liquid), the worse the performance of the fluid as a thermal interface.
In a first aspect of the invention, a method comprises circulating a heat transferring fluid in a substantially closed system including an interstice between a wafer and a chuck at a first pressure. The method further comprises pumping the fluid out of the interstice and increasing the pressure of the fluid to a second pressure. The method further comprises reducing the pressure of the fluid to the first pressure and returning the fluid to the interstice.
In another aspect of the invention, a method of containing a heat transferring fluid for regulating a temperature of a device under test comprises conducting heat between a device under test and a device holder via a fluid circulating at a lower pressure. The method further comprises pressurizing the fluid such that any fluid vapor is condensed into a liquid, and containing the fluid in a substantially closed-loop system.
In another aspect of the invention, a device comprises a chuck having one or more outlets, each outlet connected to a return line, and a pump in fluid communication with the return line to increase a pressure of a circulating fluid from a first pressure within the one or more outlets to a to a second pressure downstream from the pump. The device further comprises a supply line downstream of the pump to reduce the pressure of the fluid to substantially the first pressure, and an inlet in the chuck leading from the supply line to deliver the fluid into an interstice at substantially the first pressure.
The present invention is generally directed to containment of a fluid in a thermal interface system for use during testing and burn-in of integrated circuits. The device and method of the present invention comprise a substantially closed system that circulates a contained fluid. This is more cost effective than existing solutions in that virtually no fluid escapes the system, and in that the system itself is not complex. The simplicity of the system further enables its reliability; and the improved containment of the fluid makes its use more environmentally sound than existing solutions. The present invention will be useful in situations in which the device power is high resulting in a large temperature difference between the chuck and the wafer and will also be useful in situations in which the device power is relatively low but in which the temperature must be very accurately controlled.
While in the interstice 120, the fluid is at a pressure lower than that of the atmosphere surrounding the wafer 100 and chuck 110. Depending upon the circumstances, including the pressure and the temperature, various well known thermal interface fluids may be employed, including, for example: water (5° C. to 85° C.), water and propylene glycol (−20° C. to 110° C.), alcohol (−10° C. to 85° C.), SOLVAY SOLEXIS ZT130 (−65° C. to 85° C.), FLOURINERT™ FC-77 (−65° C. to 85° C.), and HFE 7500 (manufactured by 3M™, −65° C. to 85° C.). In a preferred embodiment, dielectric fluid is used as the fluid in the device, and the pressure of the fluid in the interstice 120 may range from −20 kiloPascals (kPa) to −60 kPa. This reduced pressure maintains the suction between the wafer 100 and the chuck 110, such that the wafer 100 is held in place for testing. It is noted that other pressures and temperatures are also contemplated, and that the above ranges are but one exemplary embodiment.
As is shown in
During operation of the device, the fluid flows in the interstice 120, between the wafer 100 and the chuck 110, to an outlet 130. The outlet 130 is effectively a hole in the chuck 110. Although
From the outlet 130, the fluid flows into a return line 140. In alternate embodiments, multiple outlets 130 may flow into one or more return lines 140. The pressure of the fluid in the interstice 120 may be controlled by a first pressure regulator and/or valve 145 in the return line 140.
The return line 140 carries the fluid through the chuck 110 to a pump 150. The pump increases the pressure of the fluid. By the action of the pump, fluid that is downstream from the pump is at a higher pressure, and fluid that is upstream from the pump is at a lower pressure. Such increased pressure has the effect that, if any of the fluid vaporized while under reduced pressure or increased temperature, that fluid is re-condensed into its liquid phase. From the pump 150, the fluid travels to a reservoir 160.
In a preferred embodiment, the reservoir 160 may cool the fluid via a cooler 160 a to further precipitate the fluid's shift from the vapor to the liquid phase. Optionally, the cooler 160 a may be eliminated, depending on the pressure and type of fluid. Optionally, the pressure in the reservoir 160 may be controlled by a second pressure regulator and/or valve 165, which is preferably positioned on the reservoir such that it releases only air, while the fluid in its liquid form remains in the reservoir. Also optionally, this second pressure regulator and/or valve 165 may be connected to an exhaust line 170, such that any harmful vapors may be captured.
In a further alternative embodiment, the reservoir 160 may be equipped with a fluid access port 180 such that fluid may be added to or removed from the system. The fluid access port 180 may be controlled by a third pressure regulator and/or valve 175.
From the reservoir 160, the fluid travels through a supply line 190. Optionally, foreign particles may be removed from the fluid by a filter 200 along the supply line 190 or the return line 140. During the fluid's travel in the supply line 190, the pressure of the fluid is reduced. This may be accomplished by any of several known methods. For example, a fourth pressure regulator and/or valve 195 may be employed on the supply line, or the diameter of the supply line may be reduced such that the resistance in the supply line 190 causes the pressure to drop.
In an alternative embodiment, an air supply line 210, including a fifth pressure regulator and/or valve 205 may supply air to the supply line 190. In this alternative embodiment, after completion of testing and/or burn-in, the fluid may be cleared from the interstice 120. The wafer 100 is thus more easily removed from the chuck 110. Moreover, the fluid in the interstice 120 is recovered and not released.
The supply line 190 travels through the chuck 110, and delivers the fluid back to the interstice 120 through an inlet 220. Although
The advantages of the continuous fluid recovery in the present invention include a substantial reduction in costs of operation. For example, in a prior art method employing a thermal interface fluid, more than 2-4 milliliters per hour may have been diffused and lost from the system. For example, at present, the thermal interface fluid GALDENŽ HT-110 costs approximately $450 per gallon. In a factory running twenty tools, the cost savings of preventing the above loss may amount to as much as $650,000 per year. Additional cost savings include a reduction of the facilities exhaust scrubber costs, and the lower cost of maintenance of the simpler design of the present invention. A further advantage is in improved safety and a reduction in environmental concerns. Additionally, the method of the present invention enables better thermal performance at a wider range of fluid pressures within the interstice 120.
As will be understood by one of skill in the art, the temperature of the chuck 110 itself may be regulated by a second fluid. In this case, the chuck may include channels for circulating a second temperature controlling fluid. This second fluid cools or heats the chuck 110 by convection. Such regulation of the chuck 110 by channels and/or a manifold are well understood in the art, and are therefore not shown in the figures. The chuck may also contain heating or thermoelectric elements and temperature sensors as is well known in the art.
The present invention would be useful in other situations in which a heat sink is placed in contact with a product or device under test where the test is conducted in a vacuum, and the temperature must be controlled. Specifically, after wafers are tested, they are diced, mounted, and tested again at the module level. During such testing, the temperature must likewise be controlled for many of the same reasons discussed herein.
The method as described above is used in the fabrication of integrated circuit chips. The resulting integrated circuit chips can be distributed by the fabricator in raw wafer form (that is, as a single wafer that has multiple unpackaged chips), as a bare die, or in a packaged form. In the latter case the chip is mounted in a single chip package (such as a plastic carrier, with leads that are affixed to a motherboard or other higher level carrier) or in a multichip package (such as a ceramic carrier that has either or both surface interconnections or buried interconnections). In any case the chip is then integrated with other chips, discrete circuit elements, and/or other signal processing devices as part of either (a) an intermediate product, such as a motherboard, or (b) an end product. The end product can be any product that includes integrated circuit chips, ranging from toys and other low-end applications to advanced computer products having a display, a keyboard or other input device, and a central processor.
While the invention has been described in terms of exemplary embodiments, those skilled in the art will recognize that the invention can be practiced with modifications and in the spirit and scope of the appended claims.
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|U.S. Classification||165/281, 165/104.19, 165/296, 165/278, 165/104.33, 62/259.2, 34/404|
|International Classification||G05D23/00, F28F27/00|
|Cooperative Classification||H01L21/67109, G01R31/2874|
|European Classification||H01L21/67S2H4, G01R31/28G2D1|
|Apr 28, 2006||AS||Assignment|
Owner name: INTERNATIONAL BUSINESS MACHINES CORPORATION, NEW Y
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:AUDETTE, DAVID M.;GARDELL, DAVID L.;DIESING, PHILIP J.;REEL/FRAME:017545/0531;SIGNING DATES FROM 20060421 TO 20060425
Owner name: INTERNATIONAL BUSINESS MACHINES CORPORATION, NEW Y
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:AUDETTE, DAVID M.;GARDELL, DAVID L.;DIESING, PHILIP J.;SIGNING DATES FROM 20060421 TO 20060425;REEL/FRAME:017545/0531
|Apr 3, 2015||REMI||Maintenance fee reminder mailed|
|Jun 16, 2015||FPAY||Fee payment|
Year of fee payment: 4
|Jun 16, 2015||SULP||Surcharge for late payment|
|Sep 3, 2015||AS||Assignment|
Owner name: GLOBALFOUNDRIES U.S. 2 LLC, NEW YORK
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:INTERNATIONAL BUSINESS MACHINES CORPORATION;REEL/FRAME:036550/0001
Effective date: 20150629
|Oct 5, 2015||AS||Assignment|
Owner name: GLOBALFOUNDRIES INC., CAYMAN ISLANDS
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GLOBALFOUNDRIES U.S. 2 LLC;GLOBALFOUNDRIES U.S. INC.;REEL/FRAME:036779/0001
Effective date: 20150910