|Publication number||US8016023 B2|
|Application number||US 12/372,660|
|Publication date||Sep 13, 2011|
|Filing date||Feb 17, 2009|
|Priority date||Jun 30, 2000|
|Also published as||CN1244853C, CN1440632A, DE60113264D1, DE60113264T2, EP1297730A2, EP1297730B1, US7086452, US7490656, US8701747, US20060272803, US20090145579, US20120000640, US20130301213, WO2002003770A2, WO2002003770A3|
|Publication number||12372660, 372660, US 8016023 B2, US 8016023B2, US-B2-8016023, US8016023 B2, US8016023B2|
|Inventors||Borys S. Senyk, Larry L. Moresco|
|Original Assignee||Intel Corporation|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (31), Non-Patent Citations (10), Referenced by (2), Classifications (12), Legal Events (1)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This application is a continuation of co-pending U.S. patent application Ser. No. 11/395,900, filed Mar. 30, 2006, which is a continuation of co-pending U.S. patent application Ser. No. 09/607,871, filed Jun. 30, 2000, issued U.S. Pat. No. 7,086,452.
1. Field of the Invention
This invention relates to electronic devices and more particularly to the dissipation of heat generated by a microprocessor.
In operation, microprocessors and other electronic devices generate heat. Excess heat can damage a device if it is not dissipated. Therefore, generally, microprocessors and other heat-generating electronic devices utilize heat dissipating structures to dissipate excess heat.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings,
The invention relates to a cooling system that improves the cooling capacity of a computer system and thereby improves the computing performance of the computer system. The computer system may include a notebook computer or other suitable portable computer systems. The computer system comprises a tube that is coupled to a first heat transfer plate and to a heat-generating element. The tube contains a fluid that removes heat from a heat source transferring it to a heat transfer plate. A second heat transfer plate is also used to transfer the waste heat from the cooling liquid to the ambient cooling air. In addition to cooling the computer system, techniques of the invention are also able to reduce noise about in the range of 35 to 45 decibels compared to conventional systems that use fans. An apparatus incorporating such a cooling system is described.
Tube 115, may comprise rubber, plastic such as polyvinyl chloride, aluminum, copper, stainless steel or other suitable material. Preferably, tube 115 in second part 120 of computing device 100 is comprised of metal such as stainless steel, aluminum, copper or any other suitable metal. Tube 115 located in first part 110 and second part 120 of computing device 100 may be made of the same or different material. In one embodiment, computer device 100 is a notebook or portable computer and first part 110 houses the motherboard, power supply and the like (not shown) as is well known in the art and second part 120 houses a liquid crystal display (not shown) or the like. Tube 115 has a diameter in the range of about 2 mm to 15 mm and a length that ranges from 500 mm to 5000 mm depending on the heat removal requirement. Tube 115 is secured to first part 110 and second part 120 of computer system 100. There are a variety of ways that tube 115 may be secured to computer system 100. Mechanical means may be used such as welding or soldering the tube to various heat spreaders and heat transfer plate, a stand off and clamps, or clips that surround tube 115 and attach to the base of computer system 110.
There are also numerous ways in which tube 115 may be arranged relative to heat transfer plate 125 in first part 110 and heat transfer plate 210 (also referred to herein as the second heat transfer plate) in second part 120 of computing system 100 to remove heat generated by computer system 100 in the range of 10 watts to 50 watts.
Temperature sensor 180 is coupled to fluid container 140, pump 150, and to power management system 132. Temperature sensor 180 is able to sense the temperature of microprocessor 130 when microprocessor 130 reaches a threshold level such as in the range of 70 to 100 Celsius that requires the cooling system to be activated in order to cool computer system 100. The cooling system is activated when temperature sensor 180 sends a signal to power management system 132 indicating that a threshold temperature has been reached by microprocessor 130. Power management system 132 controls operating conditions of the cooling system for computing device 100 such as the cooling fluid pumping rate. Power management system 132 may include memory or be coupled to a memory device. Memory may include read only memory (“ROM”), random access memory (“RAM”), magnetic disk storage media, optical storage media, flash memory devices, and/or other machine-readable media. Using program instructions stored within power management system 132 or in any other suitable location such as the chip set (not shown) of computer system 100, power management system 132 controls the cooling system by then sending a signal to pump 150 to start pumping fluid from fluid container 140. Once the temperature of microprocessor 130 is below the threshold temperature, power management system 132 sends another signal to pump 150 to stop pumping fluid from fluid container 150.
Fluid sensor 190 is also coupled to fluid container 140 and to power management system 132. Fluid sensor 190 is configured in such a manner to detect when the fluid contained in fluid container 140 reaches a level that requires fluid to be added to fluid container 140. If the fluid in fluid container 140 is low, fluid sensor 190 sends a signal to power management system 132. This indicates to power management system 132 that pump 150 should stop pumping. Power management system 132 may also send a signal to the graphic user interface of computer system 100 that the fluid is low in fluid container 140.
Tube 115 is also coupled to coupling disconnect 170 which allows a user to detach tube 115 and couple tube 115 to an externally supplied chilled fluid or a fluid that is capable of reducing heat generated from microprocessor 130. This externally supplied fluid is stored and pumped by the external cooling loop inside container 200. Coupling disconnect 170 may be used to either augment the existing cooling system or disable a portion of the closed loop system formed by tube 115.
Thereafter, tube 115 is connected to heat transfer plate 125 such as a plate-fin type liquid heat transfer plate that is located near microprocessor 130 in the first part 110 of computer system 100. Plate-fin type liquid heat transfer plates utilize plates or fins that serve as heat-transfer surfaces and a frame to support the plates or fins. Heat-transfer plates generally comprise copper, aluminum, or stainless steel, but titanium, nickel, monel, Incoloy 825, Hastelloy C, phosphor bronze and cupronickel may also be used. Heat transfer plates or fins induce turbulence in the fluids and assure more efficient heat transfer and complete flow distribution. The cooling fluid passes through tube 115 and into one side of the heat transfer plate 125. As the cooler fluid passes through heat transfer plate 125 and through a plurality of heat transfer fins 360 shown in
After the heat is exchanged through heat transfer plate 125 which results in cooling microprocessor 130, the fluid in tube 115 travels through the remainder of first part 110 and enters second part 120 of computing device 100. The fluid follows the path of tube 115 in a vertical direction relative to first part 110 of computing device 100. In the top portion of second part 120, the fluid travels in a generally horizontal direction and then in a downward direction of second part 120 of computing device 100. The fluid then exits second part 120 and enters coupling disconnect 170 and passes back into fluid container 140. The cycle then repeats until microprocessor 130 is properly cooled to a temperature that is generally designated by the manufacturer of the computer system such as in the range of 70 to 100 Celsius. Alternatively, the fluid may be pumped in the reverse direction of the path described above.
In yet another embodiment of the invention, a different path of the fluid flow is shown in
In yet another embodiment, the fluid does not bypass heat transfer plate 210. Instead, after the fluid travels beneath or around microprocessor 130, the fluid exits the first part 110 and enters the second part 120 of computing system 100. The fluid then travels through heat transfer plate 210 of second part 120 of computing device 100. Thereafter, the fluid exits tube 115 and enters container 200 or some other container (not shown).
In another embodiment, the fluid may flow in the reverse path. For example, the fluid may be pumped from container 200 to coupling disconnect 170. From coupling disconnect 170, the fluid enters tube 115 and begins to travel through second part 120 of computing device 100 following the path defined by tube 115. The fluid exits second part 120 of computing device 100 and enters first part 110 of computing device 100. The fluid travels beneath or near microprocessor 130 and then enters fluid container 140. The fluid exits fluid container 140 and then enters container 200. This external cooling system may be located in a variety of places such as a docking station, an alternating current battery charger brick, or some other suitable location.
In the preceding detailed description, the invention is described with reference to specific embodiments thereof. It will, however, be evident that various modifications and changes may be made thereto without departing from the broader spirit and scope of the invention as set forth in the claims. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US3724536||Aug 14, 1970||Apr 3, 1973||Gen Instrument Corp||Heating and cooling device|
|US4915167||Aug 5, 1988||Apr 10, 1990||Westinghouse Electric Corp.||Thermal coupling to enhance heat transfer|
|US5034688||Apr 28, 1989||Jul 23, 1991||Ets Gourdon||Temperature conditioning support for small objects such as semi-conductor components and thermal regulation process using said support|
|US5121291||Feb 13, 1991||Jun 9, 1992||Mentor Systems, Inc.||Ventilation system in a portable computer|
|US5198189||Apr 13, 1992||Mar 30, 1993||International Business Machines Corporation||Liquid metal matrix thermal paste|
|US5323294||Mar 31, 1993||Jun 21, 1994||Unisys Corporation||Liquid metal heat conducting member and integrated circuit package incorporating same|
|US5333676||Nov 8, 1993||Aug 2, 1994||Nec Corporation||Cooling abnormality detection system for electronic equipment|
|US5441102||Jan 26, 1994||Aug 15, 1995||Sun Microsystems, Inc.||Heat exchanger for electronic equipment|
|US5513361||Jul 25, 1994||Apr 30, 1996||Intel Corporation||Method and apparatus for reducing power consumption of a fan in a computer system|
|US5535818||Oct 12, 1993||Jul 16, 1996||Fujitsu Limited||Cooling system for electronic device|
|US5588483||Jan 26, 1996||Dec 31, 1996||Diamond Electric Mfg. Co., Ltd.||Heat radiating apparatus|
|US5606341||Oct 2, 1995||Feb 25, 1997||Ncr Corporation||Passive CPU cooling and LCD heating for a laptop computer|
|US5646822||Aug 30, 1995||Jul 8, 1997||Intel Corporation||Heat pipe exchanger system for cooling a hinged computing device|
|US5718282||Dec 2, 1996||Feb 17, 1998||Intel Corporation||Heat pipe exchanger system for cooling a hinged computing device|
|US5757615||Jul 1, 1996||May 26, 1998||Compaq Computer Corporation||Liquid cooled computer apparatus and associated methods|
|US5764483||Oct 15, 1996||Jun 9, 1998||Hitachi, Ltd.||Cooling unit for electronic equipment|
|US5880929||Dec 1, 1997||Mar 9, 1999||Intel Corporation||Heat exchanger system for cooling a hinged computing device|
|US5966286 *||May 31, 1996||Oct 12, 1999||Intel Corporation||Cooling system for thin profile electronic and computer devices|
|US6026896||Apr 10, 1997||Feb 22, 2000||Applied Materials, Inc.||Temperature control system for semiconductor processing facilities|
|US6047766||Aug 3, 1998||Apr 11, 2000||Hewlett-Packard Company||Multi-mode heat transfer using a thermal heat pipe valve|
|US6097597||Dec 3, 1998||Aug 1, 2000||Mitsubishi Denki Kabushiki Kaisha||Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus|
|US6125035 *||Oct 13, 1998||Sep 26, 2000||Dell Usa, L.P.||Heat sink assembly with rotating heat pipe|
|US6166907||Nov 26, 1999||Dec 26, 2000||Chien; Chuan-Fu||CPU cooling system|
|US6191546||Oct 1, 1999||Feb 20, 2001||Hewlett-Packard Company||Proportional integral cooling device controller for electronic device|
|US6196003||Nov 4, 1999||Mar 6, 2001||Pc/Ac, Inc.||Computer enclosure cooling unit|
|US6226178||Oct 12, 1999||May 1, 2001||Dell Usa, L.P.||Apparatus for cooling a heat generating component in a computer|
|US6255622||Oct 27, 1999||Jul 3, 2001||Hewlett-Packard Company||Electronic device having external surface thermal feedback|
|US6288371||Jul 13, 1999||Sep 11, 2001||Micro Control Company||Temperature controlled high power burn-in board heat sinks|
|US7086452||Jun 30, 2000||Aug 8, 2006||Intel Corporation||Method and an apparatus for cooling a computer|
|US7490656 *||Mar 30, 2006||Feb 17, 2009||Intel Corporation||Method and an apparatus for cooling a computer|
|CN296083A||Title not available|
|1||Final Office Action (dated Aug. 11, 2005), U.S. Appl. No. 09/607,871, filed Jun. 30, 2000, First Named Inventor: Borys S. Senyk, Whole Document.|
|2||Final Office Action (dated Aug. 20, 2003), U.S. Appl. No. 09/607,871, filed Jun. 30, 2000, First Named Inventor: Borys S. Senyk, Whole Document.|
|3||Final Office Action (dated Dec. 18, 2001), U.S. Appl. No. 09/607,871, filed Jun. 30, 2000, First Named Inventor: Borys S. Senyk, Whole Document.|
|4||Final Office Action (dated Feb. 25, 2008), U.S. Appl. No. 11/395,900, filed Mar. 30, 2006; First Named Inventor: Borys S. Senyk, Whole Document.|
|5||Non-Final Office Action (dated Aug. 10, 2007), U.S. Appl. No. 11/395,900, filed Mar. 30, 2006; First Named Inventor: Borys S. Senyk, Whole Document.|
|6||Non-Final Office Action (dated Jul. 9, 2003), U.S. Appl. No. 09/607,871, filed Jun. 30, 2000, First Named Inventor: Borys S. Senyk, Whole Document.|
|7||Non-Final Office Action (dated Jun. 26, 2001), U.S. Appl. No. 09/607,871, filed Jun. 30, 2000, First Named Inventor: Borys S. Senyk, Whole Document.|
|8||Non-Final Office Action (dated Mar. 29, 2005), U.S. Appl. No. 09/607,871, filed Jun. 30, 2000, First Named Inventor: Borys S. Senyk, Whole Document.|
|9||Non-Final Office Action (dated May 8, 2002), U.S. Appl. No. 09/607,871, filed Jun. 30, 2000, First Named Inventor: Borys S. Senyk, Whole Document.|
|10||Non-Final Office Action (dated Nov. 6, 2002), U.S. Appl. No. 09/607,871, filed Jun. 30, 2000, First Named Inventor: Borys S. Senyk, Whole Document.|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US8395898 *||Mar 12, 2013||Dell Products, Lp||System, apparatus and method for cooling electronic components|
|US8619426||Feb 25, 2013||Dec 31, 2013||Dell Products, Lp||System, apparatus and method for cooling electronic components|
|U.S. Classification||165/11.1, 165/104.33, 165/80.4, 361/699|
|International Classification||F28F7/00, G06F1/20, H05K7/20, B60H1/00, F28D15/00|
|Cooperative Classification||G06F2200/201, G06F1/203|