|Publication number||US8100081 B1|
|Application number||US 11/515,346|
|Publication date||Jan 24, 2012|
|Filing date||Aug 31, 2006|
|Priority date||Jun 30, 2006|
|Publication number||11515346, 515346, US 8100081 B1, US 8100081B1, US-B1-8100081, US8100081 B1, US8100081B1|
|Inventors||Jon Henri, Henner Meinhold, Christopher Gage, Dan Doble|
|Original Assignee||Novellus Systems, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (42), Non-Patent Citations (22), Referenced by (19), Classifications (26), Legal Events (3)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This application is a continuation-in-part of and claims priority to U.S. patent application Ser. No. 11/479,353, titled “M
This invention relates to technology for removing unwanted film from semiconductor wafers. More particularly, it pertains to methods for removing unwanted film, particularly film in the edge regions, using a plasma discharge.
During integrated circuit fabrication, various films are needed on the active circuit region of the wafer, i.e., the main interior region on the front side, but are undesirable elsewhere. Deposition processes, including chemical vapor deposition (CVD) and physical vapor deposition (PVD) processes, often deposit films out to the edge of the front side of the silicon substrate or wafer, generally beyond the printed or active area. In many cases, deposition of the films beyond the active circuit region creates difficulties in process integration. For example, drying and baking photoresist leaves a thick berm of material at the edge of the wafer, which can peel and flake during subsequent processing or handling. Other films susceptible to problematic delamination include tungsten, copper seed and organosilicate glass (OSG) films.
Methods of preventing deposition on unwanted areas or removing unwanted films have included using edge exclusion hardware (e.g., a shadow ring) and wet chemical etches using an acid spray directed at the edge. However, edge exclusion hardware may not be compatible with certain deposition systems, e.g. certain plasma deposition systems, and even in compatible systems, may cause problems with deposition uniformity. Wet etching may not be desirable in certain applications as it involves handling of wet solvents. Further, films such as silicon carbide and organosilicon glass (OSG) do not etch appreciably in known wet solvents.
Accordingly, it would be desirable to be able to have new methods of selectively removing unwanted film from the edge of substrates and/or selectively forming films on the active circuit regions of a substrates.
The present invention meets these needs by providing methods and apparatuses for removing unwanted film from the edge area of substrate using plasmas. In certain embodiments, the plasma is remotely generated. Activated plasma species are directed to the edge of the substrate to contact and remove the unwanted film, while intrusion of the activated species to areas above the active circuit region (where the film is desired) is suppressed. Intrusion of the activated species may be suppressed by the use of a purge gas and/or the use of materials that promote recombination of plasma species. In particular embodiments, atomic oxygen is used to remove ashable films from the edge of semiconductor wafers.
One aspect of the invention relates to a method of removing unwanted film deposited on an edge area of a semiconductor wafer. According to various embodiments, the method involves: (a) providing the semiconductor wafer to a chamber; (b) generating a plasma in a remote plasma generator; and (c) contacting the edge of the wafer to the plasma such that unwanted film is selectively removed from one or more edge regions of the wafer.
Another aspect of the invention relates to a method of removing unwanted film deposited on an edge region of a substrate using a remote plasma generator. According to various embodiments, the method involves providing a substrate having film deposited on an active circuit region and an edge region to a chamber; generating activated plasma species in a remote plasma generator; and selectively removing film from the edge region of the substrate by i) directing the plasma species to the edge region of the substrate, ii) contacting the plasma species to the edge region; and iii) suppressing intrusion of the plasma species to the area above the active circuit region.
Another aspect of the invention relates to apparatuses for removing unwanted film from the edge of a substrate while leaving film in an interior region of the substrate substantially intact. According to various embodiments, the apparatus includes a substrate support and a showerhead apparatus for directing the plasma species to the edge of the substrate and a purge gas to the interior region. The showerhead apparatus includes (i) an inner channel for directing a purge gas onto the interior region of the substrate; (ii) an outer channel for directing plasma species to the edge of the substrate; and (iii) a barrier extending over at least some of the substrate support. In certain embodiments, the apparatus additionally includes (iv) an angled deflector for deflecting activated species toward the edge of the substrate.
These and other aspects and advantages of the invention are described further below and with reference to the drawings.
Reference will now be made in detail to specific embodiments of the invention. Examples of the specific embodiments are illustrated in the accompanying drawings. While the invention will be described in conjunction with these specific embodiments, it will be understood that it is not intended to limit the invention to such specific embodiments. On the contrary, it is intended to cover alternatives, modifications, and equivalents as may be included within the spirit and scope of the invention as defined by the appended claims. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be practiced without some or all of these specific details. In other instances, well known process operations have not been described in detail in order not to unnecessarily obscure the present invention.
A schematic illustration of a semiconductor wafer is shown in
As shown, integrated circuit wafers also include a “front edge” area 103, which is the region on the front of the wafer that lies outside the active circuit region, a “side edge” area 104 and a “back edge” area 105. The side edge lies in the area between the front side and the backside, and the back edge is roughly the area near the outer boundary of the wafer on its backside, approximately analogous to the front edge area. Unwanted film may deposit on regions 103, 104, and 105. Some material may also deposit over some or all of the entire backside 101. One use of the present invention is to remove unwanted material from one or more of these regions without substantially affecting material deposited on active region 102.
As indicated above, wet chemical etching may be used to remove some deposited films, for example, organic solvents may be used to remove photoresist from wafer edges. Similarly, in physical vapor deposition (PVD) deposited copper may be removed by acid wet etching. Wet etching apparatus and methods for removal of copper from edge regions is described in U.S. Pat. Nos. 6,309,981, 6,586,342, 6,537,416 and 6,333,275, which are hereby incorporated by reference.
However, in some applications wet etching is not appropriate, for example, for films for which there is no commonly used wet solvent. Silicon-containing films, including organo-silicate glass films, silicon carbide and silicon nitride, are not removable by common wet chemistries. In addition, in certain applications, it may be undesirable to work with wet chemicals.
The methods of the present invention involve selective removal of unwanted film from outside the active circuit region (i.e., the edge region(s) and/or backside) of a substrate via a plasma etch. Unwanted film is removed from these regions, while leaving film in the center of the wafer substantially intact, thereby allowing successful integration. As indicated, methods of the invention may be used to remove film for which wet etches are not practical. The methods of the invention are not limited to such films, however, but may be used to selectively removed any film that may be removed by a plasma etch, including silicon-containing films, metallic films, photoresist, and organic films such as ashable hard masks. In certain embodiments, the methods may be used to remove film previously deposited using a plasma, e.g. by plasma enhanced chemical vapor deposition.
The methods of the invention selectively remove unwanted film from the edge regions of a substrate by directing activated species to those areas while preventing or suppressing the plasma from contacting the active circuit region. Selective removal refers to removing the film from one or more of the edge regions described above while leaving the film in the active circuit region of the wafer substantially intact. According to various embodiments, the methods involve using generating a plasma in a remote plasma generator and then directing the activated plasma species to the edge area of the wafer or other substrate. The activated species react with the unwanted film to remove it.
The methods of the invention eliminate the need for shadow ring hardware for deposition. This also removes wafer uniformity be eliminating shadow ring interference with film deposition. Particles from film flaking from the edge of substrates are also eliminated or reduced resulting in fewer defects.
As indicated, the activated species are selectively directed to the edge areas of the substrate to remove the unwanted film deposited thereon. In some embodiments, this involves directing the plasma to the edge region or regions, while suppressing intrusion of the activated species in the area above the active circuit region so that is does not contact the film deposited on the active circuit region. Suppressing intrusion may involve providing an inert or purge gas over the active circuit region and/or using materials that promote recombination of activated species.
In certain embodiments, the apparatuses of the invention have an outer channel or channels to direct the activated species to the outer edge of the substrate. A barrier may be positioned above the substrate to prevent the etchant species from reaching the film deposited on the active circuit region. Angled deflectors may deflect the activated species away from the active circuit region and/or toward the edge region of the wafer. Purge gas may also be flowed across the wafer to suppress intrusion of the etchant species. In some embodiments, the barrier is an overlying showerhead through which the purge gas is directed. The showerhead may be the part of the same component as the deflector or deflectors or a different component. These features are discussed further below with reference to
In operation, etchant species are generated in a remote vacuum chamber are directed to the inlet 318. The etchant flow is then channeled through the outer channel 306 to contact edge region 304. The flow is blocked from the active circuit region by barrier 313 and deflected by the deflector 310. A schematic illustrating deflection is shown in
In the embodiment depicted in
The apparatus depicted in
A simple schematic of another arrangement is depicted in
In many embodiments, the barrier is provided by a showerhead, which also directs purge gas flow across the wafer. In
In certain embodiments, the underside of the showerhead (or other component that overlies the active circuit region) is coated with or made from a material that promotes recombination. Stray activated species that intrude into the area above the active circuit region recombine, becoming unreactive and harmless to the film deposited there. Materials including aluminum, iron, nickel, copper surfaces may be used to, for example, promote recombination of atomic oxygen to oxygen gas. Reference number 412 in
Another example of an assembly remove film from the edge of a wafer is shown in
Chuck 526 may be of any suitable design that holds wafer 524 in position during various rotational speeds. It may also facilitate alignment of wafer 524 for the etching process. Examples of wafer chucks are described in above-referenced U.S. Pat. No. 6,537,416.
Module or chamber 522 may be of any suitable design that confines the plasma. The chamber may be used for other applications, for example, deposition of the film. In certain embodiments, module 522 may be a vacuum chamber of a deposition tool, for example, a transfer module, loadlock, or a separate module docked to the deposition tool. In certain embodiments, the interior of the chamber may be made of or coated with a material (e.g., aluminum) that promotes recombination of the activated species.
In the examples shown in
Another example of suitable assembly is shown in
Particular etch chemistries depend on the deposited film. Examples of etchant chemicals include O2, H2, N2, He, Ar, and fluorine based chemicals including fluorine (F2), hydrogen flouride (HF), fluorcarbons (CxHy), hydroflourocarbons (CxFyHz), NF3 and SF6. For example, fluorine bearing gases may be used to etch silicon-containing films. Metallic films may also be etched by similar fluorine-based chemicals. Organic films may be etched by oxygen or oxygen-containing gases such as CO2, CO, and N2O, hydrogen or hydrogen-containing gases such as forming gas (N2/H2), as well as other gases including He/N2, He/Ar, NH3, and H2O.
Ashable Hard Masks
In a specific embodiment, edge removal of ashable hard masks is performed. Hard masks are used as etch stop layers in semiconductor processing. Ashable hard masks (AHMs) have a chemical composition that allows them to be removed by a technique referred to as ashing once they have served their purpose. An ashable hard mask is generally composed of carbon & hydrogen with trace amount of one or more dopants (e.g., nitrogen, fluorine, boron, silicon). As indicated, certain embodiments of the invention relate to formation of an ashable hard mask on the active interior region of a wafer or other semiconductor substrate.
Referring back to
Certain methods of the present invention allow the film to be etched from the backside and edge regions in the reactor in which the deposition is performed. In particular PECVD reactors, such as Sequel™ or Vector™ reactor chambers available from Novellus Systems, Inc., San Jose, Calif. are suitable for the methods of this invention. According to various embodiments, methods of the invention involve depositing an ashable hard mask film on a semiconductor substrate by a PECVD process. After deposition of the film, the substrate is exposed to a plasma to etch unwanted film from the edge regions. As discussed further below, the edge removal may take place in a load lock or in a separate station of PECVD reactor. Alternatively the substrate may be transferred to another tool for edge removal.
In certain embodiments, atomic oxygen in a vacuum chamber is used for edge removal of AHMs, which are composed mainly of carbon and hydrogen, and may contain nitrogen and/or other dopants. The process of burning off the edge film with atomic oxygen does not generate particles. The gaseous products such as CO, CON, etc., do not affect the desired deposited film and may be purged from the chamber. In certain embodiments, the etchant may consist essentially of atomic oxygen. Other etchant chemistries, such as those described in U.S. patent application Ser. No. 11/479,353, may also be used to remove the AHM.
In one example, the side region (also referred to as the bevel) is bare is 0.8 mm of the front edge. The film is unaffected at distance of 2 mm from the edge, resulting in an allowable transition region of 1.2 mm.
Purge Gas: Any suitable inert gas may be used, e.g., argon or nitrogen. Although flow rates depend on the particular apparatus used, exemplary flow rates are between 100-5000 scmm.
Etchant Gas: In the case of atomic oxygen, O2 flow may be controlled into the remote plasma generator. In many embodiments, N2 is added to the gas to aid in etchant. For example, a flow may be about 10% N2. The actual amount of atomic oxygen (or other etchant species) that reaches the wafer depends on the efficiency of the remote plasma generator as well as the amount of recombination as it travels to the wafer edge. In certain embodiments involving etching the AHM as described above, examples of typical O2 flow range from 1-5 lpm. Efficiency of the remote plasma generator at generating atomic O2 is typically around 90%.
Deflector Gap: The gap between the wafer and the deflector may be varied to control exclusion. In an apparatus such as that depicted in
Deflector Diameter: Deflector diameter may also be varied to change the amount of the wafer exposed according to process needs. For example, the diameter may be varied from 297-299 mm.
Pressure: Pressure typically ranges from 0.5-4 Torr.
Process Time: Typically ranges from 0.5-12 seconds, e.g., 2 seconds.
The invention may be implemented on a multi-station or single station tool. In specific embodiments, the 300 mm Novellus Vector™ tool having a 4-station deposition scheme or the 200 mm Sequel™ tool having a 6-station deposition scheme are used. It is possible to index the wafers after every deposition and/or post-deposition plasma etch treatment until all the required depositions and treatments are completed, or multiple depositions and etches can be conducted at a single station before indexing the wafer. Alternatively, deposition may be conducted at all stations, with etch conducted at, for example, the final station. Also, as indicated, the apparatuses are incorporated into a load lock or post process module, thus increasing versatility of the tool without significant cost increase. For example, a chamber as depicted in
The following examples are provided to further illustrate aspects and advantages of the present invention. These examples are provided to exemplify and more clearly illustrate aspects of the present invention and are in no way intended to be limiting.
AHMs of 3500 Angstroms were deposited on substrates by PECVD using a Novellus Vector™ tool on 300 mm wafers.
Edge removal of the unwanted film was then performed using a chamber similar to that depicted in
Purge Gas: Argon, 750 sccm
Deflector gap: 0.012 inch
Etchant Gas Flow: 3.5 L O2+10% N2
Pressure: 1.5 Torr
Process time: 2 seconds
Film was completely removed from the side edge, underside, and front edge of the wafer.
Although the foregoing invention has been described in some detail for purposes of clarity of understanding, it will be apparent that certain changes and modifications may be practiced within the scope of the appended claims. It should be noted that there are many alternative ways of implementing both the process and compositions of the present invention. Accordingly, the present embodiments are to be considered as illustrative and not restrictive, and the invention is not to be limited to the details given herein.
All references cited herein are incorporated by reference for all purposes.
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|U.S. Classification||118/723.00R, 118/723.0IR, 156/345.34, 118/728, 118/723.0ME, 118/723.0ER, 156/345.35, 156/345.33|
|International Classification||C23C16/455, C23C16/06, C23C16/452, H01L21/306, C23C16/22, C23F1/00|
|Cooperative Classification||H01L21/31138, H01L21/6708, C23F4/00, H01J37/32385, H01L21/02087, H01J37/32449|
|European Classification||H01L21/311C2B, H01L21/02F12D, H01L21/67S2D8W4, C23F4/00, H01J37/32O2B, H01J37/32M18D|
|Oct 12, 2006||AS||Assignment|
Owner name: NOVELLUS SYSTEMS, INC., CALIFORNIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HENRI, JON;MEINHOLD, HENNER;GAGE, CHRISTOPHER;AND OTHERS;SIGNING DATES FROM 20060919 TO 20060921;REEL/FRAME:018393/0559
|May 15, 2012||CC||Certificate of correction|
|Jul 24, 2015||FPAY||Fee payment|
Year of fee payment: 4