|Publication number||US8127440 B2|
|Application number||US 11/897,077|
|Publication date||Mar 6, 2012|
|Filing date||Aug 29, 2007|
|Priority date||Oct 16, 2006|
|Also published as||US20080086876|
|Publication number||11897077, 897077, US 8127440 B2, US 8127440B2, US-B2-8127440, US8127440 B2, US8127440B2|
|Inventors||Joel S. Douglas|
|Original Assignee||Douglas Joel S|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (11), Referenced by (9), Classifications (23), Legal Events (5)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This application claims priority to U.S. Provisional Patent Application Ser. No. 60/851,946, filed Oct. 16, 2006, entitled “Solderable plastic components and process for soldering” and U.S. Provisional Patent Application Ser. No. 60/856,967, filed Nov. 6, 2006, entitled “Bondable plastic components and process for bonding,” the contents of which are both incorporated herein by reference in their entirety.
This invention generally relates to circuit assemblies such as flexible circuits and antennas and to a method for making the same and, more particularly, to a flexible type circuit assembly having at least one electrical conductor formed from a conductive ink, dye, or coating that is formulated as a wet dispersion and which further includes a portion that allows the at least one conductor to be easily, reliably, and selectively interconnected to another circuit assembly and/or to a device or apparatus by soldering or ultrasonically bonding due to the modified surface morphology and heat dissipation properties of the coating.
Flexible type circuit assemblies typically comprise a polymeric film, cloth, or other flexible substrate upon which a conductive ink, dye, or coating having a polymer matrix and conductive particles is applied to form a circuit member. These dyes, inks, and coatings are similar in nature in that they are dispersions of conductive particles in a polymer matrix and are applied first in a wet form and then cured by drying. These circuit assemblies are widely used due to their relatively low cost of production and flexible nature which allows them to be used in areas where traditional printed circuit boards can not be used such as in flexible connection circuits, Radio Frequency Identification (RFID) applications, particularly in clothing and low cost electronic components, and the like.
While such flexible printed circuit assemblies are relatively low in cost, they are not readily interconnected with and to other circuit assemblies, devices, and/or apparatuses. More particularly, such interconnections undesirably require crimping or the use of conductive adhesives or tapes, or relatively expensive separable mechanical connectors, each of which are relatively costly and produce substantially unreliable connections.
U.S. Pat. No. 7,211,205 issued to Conaghan, et al. describes using metal-coated tabs for soldering. This is an expensive and time consuming process.
U.S. Pat. No. 5,962,151 issued to Paszkiet, et al. describes forming a solderable deposition on a non solderable surface.
U.S. Pat. No. 7,144,830 issued to Hill, et al. describes attaching electrical components to woven fabric such as conductive yarn, for example, by connecting the components to the conductive yarn by soldering.
U.S. Pat. No. 7,224,280 issued to Ferguson et al. describes using electrically conductive adhesive.
European Patent Application EP 1039543 A2 to Morgan Adhesives Company comprises a thin substrate having two printed conductive ink pads. This method is said to be suitable for mass production of radio frequency identification tags (RFIDs) by mounting integrated circuits on interposers that are then physically and electrically connected to antenna sections using a pressure sensitive conductive adhesive.
U.S. Pat. No. 7,237,724 issued to Singleton describes a smart card and a method for manufacturing the same wherein the smart card is composed of a printed circuit board having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board, a filler board attached to the top surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board, and a thermosetting polymeric layer positioned between the top surface of the printed circuit board and the top overlay.
U.S. Pat. No. 6,381,482 issued to Jayaraman et al. uses conductive bumps that may be welded to the antenna by laser welding or ultrasonic welding.
U.S. Pat. No. 7,064,299 issued to Green et al. describes a flexible body that has a conductive resistance pathway which includes conductive resistance flexible strands of material connected in series between two supply bus flexible strands of material, and a temperature dependent variable resistance pathway with temperature dependent variable resistance flexible strands of material electrically connected in series by connection bus flexible strands of material.
U.S. Pat. No. 7,025,596 issued to Zollo et al. describes a method and apparatus for forming electrical connections between electronic circuits and conductive threads that are interwoven into textile material.
Each of the above references is incorporated herein by reference in its entirety.
Since it is expensive to form a connection from the methods described in the prior art, such as mechanical connectors and conductive adhesives, there is a necessity of an improved process to simplify the attachment process and make use of traditional bonding methods. Therefore, there is a need for a flexible type electrical circuit assembly which may be selectively, reliably, and cost effectively interconnected to another circuit assembly, device, or apparatus. Furthermore, there is a need for a method to produce such a circuit assembly that is easily connectable to other circuit components using traditional cost effective methods such as soldering or ultrasonic bonding. There is a further need for such flexible circuit assembly which may be used in a wide variety of applications such as printed electronic circuit connections to conventional printed circuit boards, battery terminals, battery current collector terminals, or to other electronic components such as push buttons or alarms using traditional soldering or ultrasonic bonding. A significant obstacle in achieving this is the inability of the current coatings, inks, or dyes to conduct the heat used to create the bond or to provide a surface that is capable of being bonded to. The heat from ultrasonic welding is the result of the friction used to bond the materials, and soldering utilizes the heat of the applied solder. Additionally, the surface of the ink, dye, or coating is bondable so that there can be a strong and thermally conductive surface that can accept the bond materials or be capable of being melted by the vibration at the interface of the two components. The dyes, inks, and coatings also should be formed from a simple wet dispersion of conductive particles in a polymer matrix that can be applied first in a wet form and then cured by drying so that the conductive material is easily applied and formed.
It is a first object of the present invention is to provide an ink, dye, or coating for use in printed electronics assembly such as flexible circuits or antennas that overcome some or all of the previously mentioned drawbacks of prior printed electronics circuit assemblies so that the printed electrical traces are bondable without the use of mechanical connectors or adhesive materials. The dyes, inks, and coatings are similar in nature in that they are dispersions of conductive particles in a polymer matrix and are applied first in a wet form and then cured by drying.
It is a second object of the present invention is to provide a flexible circuit assembly that overcomes some or all of the previously mentioned drawbacks of prior circuit assemblies and which, by way of example and without limitation, may be selectively, reliably, and cost effectively attached and/or interconnected to another circuit assembly, device, and/or apparatus.
It is a third object of the present invention to provide a flexible circuit assembly which overcomes some or all of the previously mentioned drawbacks of prior circuit assemblies and which includes at least one conductive portion which may be selectively, reliably, and cost effectively attached and/or interconnected to another circuit assembly, device, and/or apparatus.
It is a fourth object of the present invention to provide a flexible Radio Frequency Identification (RFID) antenna circuit assembly which overcomes some or all of the previously mentioned drawbacks of prior antennas and which includes at least one conductive portion which may be selectively, reliably, and cost effectively attached and/or interconnected to another circuit assembly, device, and/or apparatus.
According to a first aspect of the present invention, a circuit assembly includes conductive ink formed from a wet dispersion of carbon nanotubes in a polymer binder. The wet dispersion of carbon nanotubes can also contain other conductive materials that form a blend of conductive materials.
According to a second aspect of the present invention, a method for producing a circuit assembly is provided. The method includes the steps of placing at least one trace formed from a wet dispersion of the invention and solderably interconnecting the formed conductive portion to at least one connection.
According to a third aspect of the present invention, a method for producing a circuit assembly includes the steps of placing at least one trace formed from a wet dispersion of the invention and ultrasonically welding to interconnect the formed conductive portion to at least one connection. These and other features, aspects, and advantages of the present invention will become apparent from a consideration of the following detailed description of the invention and by reference to the following drawings.
Conductive inks, dyes, and coatings currently available for producing printed or flexible electronics are formed by adding conductive materials in powder form to a polymer base with a solvent component and mixing the materials, base, and solvent to produce a uniform wet dispersion. The dispersion is used to print or apply the circuit members on the flexible non conductive polymeric film, cloth, or thread referred to as the flexible substrate. The dispersion is then cured with heat or ultraviolet light. The result is a conductive circuit formed on the flexible substrate.
In spite of the resulting circuit having a very low cost that is beneficial to the manufacturer and consumer, there are significant drawbacks such as being difficult to create a connection to another circuit component. These inks and coatings used to form these conductive traces do not have the ability to be wetted by the solder for a solder joint and have very low heat dissipation properties so that soldering or ultrasonic bonding damages the conductive properties of the circuits.
These circuits are also difficult to use for RFID antennas because they cannot be easily connected to the RFID integrated circuit.
To create thermally as well as electrically conductive ink, coating, or dye formed from a wet dispersion, various formulations can be identified. These include polymer resins filled with or made from dispersions of carbon nanotubes Multi Wall Carbon Nanotubes (MWNT), Double Wall Carbon Nanotubes (DWNT) or Single Wall Carbon Nanotubes (SWNT), any of which can be applied to or alloyed with other larger diameter conductive powders. These larger conductive particles have at least one dimension of at least 100 nanometers. The dispersion can be designed to achieve desired mechanical, thermal, and electrical conductive results to support bonding after application to the substrate and curing using heat. The conductive and non-conductive materials that can be alloyed with the carbon nanotubes include antimony tin oxide, platinum, carbon, silver or silver-chloride, lead, amorphous carbon, platinum, Au—Ni, Au—Fe, Au—Co and Au—Ir, carbon silver-chloride, graphite, tin, silicon, indium, lead, non-metal oxides and metal oxides on the substrate. These alloyed materials are formed such that the larger conductive particles have at least one dimension of at least 100 nano meters and when applied are spread further from each other than in traditional conductive materials formed from wet dispersions that form inks, dyes, and coatings of these materials. The carbon nanotubes are used to interconnect the larger particles creating a matrix with excellent heat dissipation/conduction properties, electrical conductivity, and mechanical strength and having a textured surface morphology that is hydrophilic. This was not intuitive because the carbon nanotubes are naturally hydrophobic. The resulting surface texture of the process creates the hydrophilic behavior. The minimum size of these larger conductive particles allows the nanotubes to interconnect the islands formed by these larger particles. The island formation as shown in
The carbon nanotube wet dispersion based coating, dye, or ink, on alloying with other conductive materials and solvents, creates a boundary layer between the substrate and the other components of the coating after being applied to the substrate and cured. This boundary layer also makes the overall coating adhere better to the substrate, providing a firm foundation for the coating to adhere to. The carbon nanotubes also provide the capability to increase the conduction of thermal and electrical energy between the other conductive materials in the wet dispersion that forms the coating, dye, or ink after it is applied and cured. They do this by forming highly conductive bonds from carbon nanotubes that interconnect larger conductive particles. See
Wet dispersions that form coatings, inks, and dyes of the invention can be made from conductive dispersions of single-wall (SWNT), double walled (DWNT), or multi-walled (MWNT) or mixtures thereof, preferably sized to be less than 100 nm in length and greater than 0.5 nm and less than 20 nm in diameter. The wet dispersions are capable of being cured with heat and allow the formation of a surface texture where capillaries are formed on the surface for the liquid such as solder or that form ideal attachment points and/or nano ultrasonic energy concentrator points for the ultrasonic welding (see
Additionally, conductive dispersions such as Acheson Electrodag PF 427 ATO ink or Electrodag PF-407C conductive carbon ink, both of which have conductive particles having at least one dimension of at least 100 nano meters, can be alloyed/mixed with carbon nanotubes such that the carbon nanotubes form a colloidal suspension with the ink to produce a more conductive ink and one that is capable of forming a surface morphology after curing that provides capillary channels formed on the surface for attachment points and/or nano ultrasonic energy concentrator points to facilitate ultrasonic welding (see
One novel application of the invention involves the application of an ink, for example Acheson Electrodag PF 427 ATO ink or Electrodag PF-407C conductive carbon ink, by diluting it with a solvent, applying it to a substrate, and then curing it. These inks have conductive particles whose size is larger than 100 nanometers and form a wet dispersion when diluted with a solvent. To form a bondable surface and improve the electrical and thermal conductivity additional layers of carbon nanotube ink formed from a wet dispersion of carbon nanotubes are applied over the first layer to enhance conductivity. This second application creates a textured surface morphology after being cured on the coated substrate that consists of nanotubes oriented so that they form interconnects with the larger conductive particles of the first layer and form nano channels/capillaries on the surface for the liquid solder or attachment points/nano ultrasonic energy concentrator points on the surface for the ultrasonic welding (see
In a preferred embodiment, the carbon nanotubes (0.5%-10% by weight) are mixed uniformly into the ink (e.g., Acheson Electrodag 427). The carbon nanotubes can be selected from single-wall, double wall, or multi-wall carbon nanotubes, preferably sized to be less than 100 nm in length and greater than 0.5 nm and less than 20 nm in diameter. Preferably the carbon nanotubes are added such that they make up 10% by weight of the mixture. Additionally, platinum or other metal nano particles can be added and mixed uniformly with the wet dispersion so as to form a coating, dye, or ink such that the percentage by weight is from 0.5% to 10% after application and curing. An alternative embodiment involves functionalizing the carbon nanotubes with the metal by chemically adhering the metal to the carbon nanotubes by plating or by another chemical process. Preferably, the nano size platinum particles are added such that they make up less than 4% by weight of the mixture. The resulting thickness of the coating, dye, or ink, when applied to a substrate and cured with heat, is between approximately 0.5 nm to 130 microns. Adhesion to the substrate is increased over the initial commercial dispersion. This is observed when a 1 millimeter (mm) stainless steel flat edge implement is used to scratch the surface of the material using 98 Dynes of force. To compare the two coatings the Acheson Electrodag is first applied and cured per the supplier specification. The modified dispersion of the invention is applied and cured for 20 minutes at 90 degrees C. The Acheson Electrodag coating is removed when a 1 millimeter (mm) stainless steel flat edge implement is used to scratch the surface of the material using 98 Dynes of force, leaving the uncoated substrate, whereas the coating of the invention when a 1 millimeter (mm) stainless steel flat edge implement is used to scratch the surface of the material using 98 Dynes of force is still attached to the substrate.
Any of the aforementioned coatings, paints, dyes, or inks made from the wet dispersion of the invention result in improved electrical conductivity with surface resistance in the range of less than approximately 106 ohms/square per 1 mm square area when applied and then cured. They also have surface morphologies that exhibit the nano channels and nano energy concentrators found on the surface of the ink, dye, or coating. The excellent conductivity, both thermally and electrically, and the nano channels and nano energy concentrators found on the surface of the resulting cured ink, dye, or coating make them ideally suited for non mechanical bonding processes. The same structure that allows the solder to flow between the two parts being soldered also forms a natural ultrasonic energy concentrator. In the ultrasonic energy concentrator design, the mating surfaces make initial contact only along a raised portion of the work piece, ensuring that the ultrasonic energy is concentrated into a small area. As welding proceeds this material softens and flows to form the weld, allowing the rest of the contact surfaces to come together forming a natural stop. The nanotubes protruding from the surface of coatings of the invention act as these ultrasonic energy concentrators.
Another embodiment includes a conductive carbon nanotube layer formed by coating the substrate with conductive carbon nanotube ink formed from a wet dispersion of carbon nanotubes. The dispersion is then cured with heat. The ink of the wet dispersion can be made from SWNT, DWNT or MWNT, preferably sized to be less than 100 nm in length and greater than 0.5 nm and less than 20 nm in diameter. Additionally, conductive inks such as Acheson Electrodag PF 427 ATO ink can be alloyed with either single-wall nanotubes (SWNT), double wall carbon nanotubes (DWNT), or multi-wall carbon nanotubes (MWNT) and nanotube bundles or ropes, preferably sized to be greater than 0.5 nm and less than 20 nm and less than 100 nm in length in diameter. This is done to achieve a coating that creates a textured morphology when compared to the base material and has excellent conductivity, both thermally and electrically, and is very ductile after it is applied and cured. When Acheson Electrodag PF 427 ATO ink is alloyed with either single-wall carbon nanotubes or multi-wall carbon nanotubes, preferably sized to be greater than 0.5 nm and less than 20 nm and less than 100 nm in length in diameter, the conductivity of the resulting coating is approximately 1100 ohms/sq. The carbon nanotube bundles or ropes formed during the curing provide the mechanism for this excellent electrical and thermal conductivity and create a three dimensional matrix capable of forming a surface morphology after curing that provides capillary channels formed on the surface or attachment points and/or nano ultrasonic energy concentrator points to facilitate ultrasonic welding.
The carbon nanotubes are mixed uniformly into the ink, (e.g., Acheson Electrodag PF 427) such that the percent by weight is 0.0001% to 10%. Preferably, the carbon nanotubes are added such that they make up 1% by weight of the mixture. Additionally, platinum nano particles can be added and mixed uniformly into the coating such that the percent by weight is 0.5% to 10%. Preferably, the nano size platinum particles are added such that they make up 0.01 to 10% by weight of the mixture. Also, nano particles or particles (nano/micro) of other metals such as silver, copper, gold, lead, other metals, and oxides as well as metal oxides can be used to produce conductive coatings, inks, and dyes of the present invention. However, any commercially conductive or specialty conductive ink, paint, dye, or coating which is formed from a wet dispersion and whose conductive material is selected with at least one dimension of at least 100 nano meters can be used that is formed from conductive organics, inorganics, metals, oxides, metal oxides, and/or carbon in the embodiments described.
The present application can be used for inexpensively coating low melting point polymers, paper, thread, and cloth using a process that can be scaled up to industrial production scale. The wet dispersion that forms the ink or coating can also be blended with various metals and/or non-metallic materials. These metals and non metals can be selected from carbon, Au—Ni, Au—Fe, Au—Co and Au—Ir, bi-metallics and their oxides, LiNiCoO2, LiNiCoAlO2, LiNiMnCoO2, coke, graphite, tin, silicon, non metal oxides and metal oxides or various nano oxide layers. The metal particle or oxides sizes range from 0.5 nm to 40 nm. The materials of the invention can be used as conductors for electrical applications where their light weight, ability to be bonded to other conductors, bondability, and high conductivity can replace the existing metals. Additionally, the inks or coatings can be used to form conductive traces on printed electronics when applied and cured.
A novel application of the invention involves the application of an ink (e.g., Electrodag PF-407C conductive carbon ink) by diluting it with a solvent and carbon nanotubes and subsequently applying it to a substrate. This creates an ink is that is conductive and where the larger size particles are connected by the carbon nanotubes after application and proper curing as shown in
An example of this formulation is 0.87 grains of Electrodag PF407 ink diluted with 1500 microliters of acetone to form a diluted wet dispersion ink. The resulting ink is sonicated, or mixed, in an ultrasonic cleaner such as a VWR 50HT for 10 minutes. The second ink is formed from a dispersion of carbon nanotubes that is made by taking SWNT, DWNT, or MWNT, preferably sized to be less than 100 nm in length and greater than 0.5 nm and less than 20 nm in diameter, suspended in acetone. This specific second wet dispersion ink is made by taking 40 mg of MWNT carbon nanotubes and dispersing them in 40 ml of acetone by sonication in the VWR 50HT for 20 minutes. The PF407 wet dispersion ink can be applied by a method selected from the group consisting of spray painting, dip coating, spin coating, knife coating, kiss coating, gravure coating, screen printing, stenciling, ink jet printing, and pad printing. Then the carbon nanotube wet dispersion ink is applied to the top of the first ink and then the composite structure is cured using heat for a specific period of time. The multilayered coating of the invention is applied and cured for 20 minutes at 90 degrees C. Properties of typical conductive formulations of the invention are found in Table 1.
In another embodiment, the nanotubes comprise single-wall, double wall, or multi-wall carbon-based carbon nanotubes containing other material. Carbon nanotubes can be formed by a number of techniques, such as laser ablation of a carbon target, CVD (Chemical Vapor Deposition) of hydrocarbon, or causing an arc between two graphite conductive inks and coatings. For example, U.S. Pat. No. 6,221,330, which is incorporated herein by reference in its entirety, discloses methods of producing single-wall carbon nanotubes that employ gaseous carbon feedstocks and unsupported catalysts.
Carbon nanotubes are very flexible and naturally aggregate to form ropes of tubes known as nanoropes. The nanoropes are connected by metallic catalyst particles that help to increase the inter-rope conductivity because they are grown from the catalyst particles. The formation of carbon nanotubes ropes is used by the present invention in the conductive inks, and coatings produced to form island structures as shown in
Additionally, a second refinement method can be used after the initial mixing phase. The wet dispersion ink, dye, or coating can be refined by micro flocculation methods to refine the carbon nanotubes mixture. Flocculation helps eliminate carbon nanotube chains that have formed in the wet dispersion so that mostly individual nanotubes are applied as part of a wet dispersion.
Flocculation is the agglomeration of destabilized particles into micro floc and subsequently into bulky floccules which can be settled, called floc. The addition of another reagent called flocculant or a flocculant aid promotes the formation of the floc. Factors that can promote the coagulation-flocculation are the concentration gradient, diffusion rate, surface tension time, temperature, and pH. Time and diffusion rate increase the probability of the particles coming together. One alternative way to refine the carbon nanotube mix involves first heating the mixture to 70 degrees C. The carbon nanotubes flocculate to the bottom of the container when subjected to centrifuging or extended settling time. Also, the carbon nanotubes can be induced to flocculate with the addition of NaCl concentrations or nano size metal particles, such as platinum. Nano size platinum material can be obtained from Sigma-Aldrich company item 483966 as platinum nanosize activated powder, which can be added to the dispersion to achieve a percent weight of between 0.5% and 10%. Similar results can be achieved by adding a variety of nano size metal particles such as iron, copper, gold, or silver. Additionally, MgCl2 or NaCl can be added to the dispersion to increase the flocculation and refinement of the carbon nanotubes.
The resulting conductive inks and coatings made from the wet dispersions of the invention provide excellent conductivity. In a preferred embodiment, the nanotubes are present in the dye, ink, or coating at about 0.001% to 10% based on weight. Preferably, the nanotubes are present in the previously mentioned conductive ink or coating at about 0.01% to 0.1%, resulting in good conductivity and good adhesion to the substrate and to materials applied to the free surface. When the conductive ink is used with a more traditional conductive coating, the more traditional coating can be applied in a much thinner layer, thereby allowing the carbon nanotube ropes to form connections between the larger conductive particles, thereby also transferring electrical and thermal energy more efficiently. This interconnection mechanism makes it possible to achieve a similar level of conduction on a much thinner coating. Moreover, the thinner layer facilitates a textured surface morphology that promotes the adhesion of materials to the free surface by the formation of nanochannels or nano concentrators by the protruding carbon nanotubes above the cured polymer surface as shown in
The conductive inks and coatings formed from dispersions of the invention are disclosed in detail in the co-pending applications U.S. Patent Application No. 60/726,519 entitled “Coatings comprising carbon nanotubes for batteries and other electrochemical applications,” and U.S. Patent Application No. 60/708,510 entitled “Coatings comprising carbon nanotubes,” the contents of all of the foregoing being incorporated by reference in their entireties. The surface resistance of the conductive inks and coatings can be easily adjusted to adapt the conductive inks and coatings for these applications with different target ranges for electrical and thermal conductivity. The electrical conductivity can be as low as ITO (indium titanium oxide) coated substrate and thermal conductivity rivaling diamond films. Properties of typical conductive formulations of the invention are found in Table 1.
Accordingly, in one embodiment, the conductive coating or ink has a surface resistance in the range of less than about 10,000 ohms/square per 1 mm square area. Preferably, the conductive ink or coating has a surface resistance in the range of about 10-10,000 ohms/square per 1 mm square area. Preferably, the conductive ink or coating has a surface resistance in the range of about 100-10,000 ohms/square per 1 mm square area. Preferably, the conductive coating or ink has a surface resistance in the range of less than about 1000 ohms/square per 1 mm square area. Preferably, the conductive ink or coating has a surface resistance in the range of less than about 100 ohms/square per 1 mm square area. Preferably, the conductive ink or coating has a surface resistance in the range of about 10-100 ohms/square per 1 mm square area.
The conductive inks and coatings also have volume resistances, as defined in ASTM D4496-87 and ASTM D257-99, in the range of about 100 ohms-cm to 10×106 ohms-cm. They also have thermal resistances measured in watts per meter per Kelvin in the range of about 600 watts per meter per Kelvin to 30 watts per meter per Kelvin.
A novel application of the invention involves the application of a commercially conductive or specialty conductive ink, paint, dye, or coating that is formed from conductive organics materials, inorganic materials, metals, oxides, metal oxides, and carbon whose conductive material is selected with at least one dimension of at least 100 nano meters. Either the Acheson Electrodag PF 725 Silver ink or Electrodag PF-407C conductive carbon ink can be used, although the present invention is not limited in this regard as other inks can be used. The conductive materials are at least 100 nanometers in diameter. The ink is first diluted with a solvent such as acetone and applied to a substrate to form a first layer. Then a carbon nanotube wet dispersion ink made from DWNT dispersed in acetone is formed and applied to the first layer to form a second layer. After the final application the composite structure is cured to form an ink that has good electrical and thermal conductive properties and a surface that has excellent wetability, i.e., hydrophilic surface formed from nano capillaries on the surface for the liquid solder. These same channels can also create attachment points and/or nano ultrasonic energy concentrator points for the ultrasonic welding (see
Referring now to
Referring now to
Sample Films of the invention and their respective properties are shown in Table 1.
Coatings cured for 20 min. at 95 degrees C.
2 mm soldered
joint pull test
joint pull test
Two layer conductive coating with
Acheson Electrodag - PF 427 and two
layers of carbon nanotubes as the top
layers coated on polyester substrate and
cured at 90 degrees C. for 20 minutes
Single layer conductive coating with
carbon nanotubes and Acheson
Electrodag - PF 407 coated on polyester
substrate and cured at 90 degrees C. for
Film formed from kynarflex 2801 and
carbon nanotube coating and cured at 90
degrees C. for 20 minutes
MWNT Carbon nanotubes and
polyurethane binder and cured at 95
degrees C. for 20 minutes
DWNT Carbon nanotubes and
polyurethane binder and cured at 95
degrees C. for 20 minutes
SWNT Carbon nanotubes and
polyurethane binder and cured at 95
degrees C. for 20 minutes
The novel interconnects allows for both traces and contacts to be affixed on one surface, thereby allowing the tolerance between adjacent traces to be controlled more precisely than in prior connection methods. Moreover, the present connection eliminates the need for crimping or adhesive bonding with conductive adhesives and thereby provides for a more robust connection between flat circuit assemblies.
It is to be understood that the invention is not limited to the exact construction and method which has been previously delineated, but that various changes and modifications may be made without departing from the scope of the inventions as are set forth in the following claims.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US5962151||Dec 5, 1997||Oct 5, 1999||Delco Electronics Corp.||Method for controlling solderability of a conductor and conductor formed thereby|
|US6018299 *||Jun 23, 1998||Jan 25, 2000||Motorola, Inc.||Radio frequency identification tag having a printed antenna and method|
|US6381482||Mar 19, 1999||Apr 30, 2002||Georgia Tech Research Corp.||Fabric or garment with integrated flexible information infrastructure|
|US7025596||Jun 14, 2004||Apr 11, 2006||Motorola, Inc.||Method and apparatus for solder-less attachment of an electronic device to a textile circuit|
|US7064299||Sep 30, 2003||Jun 20, 2006||Milliken & Company||Electrical connection of flexible conductive strands in a flexible body|
|US7144830||May 8, 2003||Dec 5, 2006||Sarnoff Corporation||Plural layer woven electronic textile, article and method|
|US7211205||Jan 29, 2003||May 1, 2007||Parelec, Inc.||High conductivity inks with improved adhesion|
|US7224280||Jun 18, 2004||May 29, 2007||Avery Dennison Corporation||RFID device and method of forming|
|US7237724||Apr 6, 2005||Jul 3, 2007||Robert Singleton||Smart card and method for manufacturing a smart card|
|EP1039543A2||Mar 23, 2000||Sep 27, 2000||Morgan Adhesives Company||Circuit chip connector and method of connecting a circuit chip|
|WO2005119772A2 *||May 31, 2005||Dec 15, 2005||Douglas Joel S||Coatings comprising carbon nanotubes|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US8248313 *||Nov 2, 2009||Aug 21, 2012||Shenzhen Futaihong Precision Industry Co., Ltd.||Antenna module and wireless communication device using the same|
|US8341762 *||Mar 21, 2008||Jan 1, 2013||Alfiero Balzano||Safety vest assembly including a high reliability communication system|
|US8692716 *||Feb 16, 2009||Apr 8, 2014||Board Of Trustees Of The University Of Arkansas||Nano and micro based antennas and sensors and methods of making same|
|US20080264330 *||Mar 6, 2008||Oct 30, 2008||Board Of Trustees Of The University Of Arkansas||Production of nanostructure by curie point induction heating|
|US20100097273 *||Feb 16, 2009||Apr 22, 2010||Board Of Trustees Of The University Of Arkansas||Nano and micro based antennas and sensors and methods of making same|
|US20110036448 *||Apr 22, 2009||Feb 17, 2011||Koninklijke Philips Electronics N.V.||Electronic textile|
|US20110063173 *||Nov 2, 2009||Mar 17, 2011||Shenzhen Futaihong Precision Industry Co., Ltd.||Antenna module and wireless communication device using the same|
|US20120174299 *||Mar 21, 2008||Jul 12, 2012||Alfiero Balzano||Safety vest assembly including a high reliability communication system|
|US20140068935 *||Jan 24, 2013||Mar 13, 2014||Tsinghua University||Methods for making implantable lead and medical device|
|U.S. Classification||29/846, 174/254, 174/257, 252/502, 29/842|
|International Classification||H05K1/09, H05K3/10|
|Cooperative Classification||Y10T29/49155, H05K3/363, H05K3/328, H05K2203/0285, Y10T29/49126, H05K1/095, H05K3/245, H05K3/361, H05K2201/026, H05K2201/0323, B82Y10/00, Y10T29/49124, Y10T29/49147|
|European Classification||H05K1/09D2, B82Y10/00, H05K3/36B|
|Aug 29, 2007||AS||Assignment|
Owner name: MYSTICMD, INC., CONNECTICUT
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:DOUGLAS, JOEL S.;REEL/FRAME:019797/0956
Effective date: 20070828
|Jan 27, 2011||AS||Assignment|
Owner name: DOUGLAS, JOEL S, MR, CONNECTICUT
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MYSTICMD;REEL/FRAME:025706/0950
Effective date: 20110126
|Oct 16, 2015||REMI||Maintenance fee reminder mailed|
|Oct 26, 2015||FPAY||Fee payment|
Year of fee payment: 4
|Oct 26, 2015||SULP||Surcharge for late payment|