|Publication number||US8139369 B2|
|Application number||US 12/102,169|
|Publication date||Mar 20, 2012|
|Filing date||Apr 14, 2008|
|Priority date||Apr 14, 2008|
|Also published as||US20090258511|
|Publication number||102169, 12102169, US 8139369 B2, US 8139369B2, US-B2-8139369, US8139369 B2, US8139369B2|
|Inventors||Jeremy F. Weinstein, Robert M. Ward|
|Original Assignee||Lockheed Martin Corporation|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (29), Non-Patent Citations (2), Classifications (19), Legal Events (2)|
|External Links: USPTO, USPTO Assignment, Espacenet|
The present invention relates to printed wiring boards and solder pads for connecting component leads thereto.
In one embodiment, the invention provides a printed wiring board defining a plane and having a first solder pad including a first solder member electrically connected to a second solder member. The first and second solder members include respective first and second longitudinal axes in the plane of the printed wiring board along either of which a first lead may be soldered. The first lead can be selectively connected to either the first solder member or the second solder member. The first and second longitudinal axes intersect at a first intersection point. The first solder member extends along the first longitudinal axis in a direction away from the first intersection. The second solder member extends along the second longitudinal axis in a direction away from the first intersection. The first and second longitudinal axes define an included angle therebetween, the included angle being between 45 and 135 degrees.
Other aspects of the invention will become apparent by consideration of the detailed description and accompanying drawings.
Before any embodiments of the invention are explained in detail, it is to be understood that the invention is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the following drawings. The invention is capable of other embodiments and of being practiced or of being carried out in various ways. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless specified or limited otherwise, the terms “mounted,” “connected,” “supported,” and “coupled” and variations thereof are used broadly and encompass both direct and indirect mountings, connections, supports, and couplings. Further, “connected” and “coupled” are not restricted to physical or mechanical connections or couplings. Further still, a range defined as being “between” two given values also includes those given values.
A lead wire may be soldered to each solder pad 14 a through 14 d along one of the respective axes Aa through Ad or Ba through Bd. The axes Aa through Ad and Ba through Bd lie in a plane defined by the printed wiring board 10. It is to be understood that all four solder pads 14 a through 14 d can be described in the same way; therefore, any description of one solder pad and its respective axes, angles and other features may be extended to the remaining solder pads and their respective axes, angles and other features. However, it is not necessary for all solder pads on the same printed wiring board to be the same.
The axes Aa, Ba of a single solder pad 14 a have an included angle Ca therebetween. Accordingly, the remaining solder pads 14 b through 14 d have respective included angles Cb through Cd between their respective axes. Each respective included angle Ca through Cd may be between 45 and 135 degrees. Preferably, the included angles Ca through Cd are between 60 and 120 degrees. More preferably, the included angles Ca through Cd are substantially 90 degrees, as shown in
Thus, the L-shaped solder pads 14 a through 14 d provide a mounting surface that can be approached by the wires 38, 40, 42, 44 from all four major directions (top, bottom, right, left). Each wire 38, 40, 42, 44 can be soldered to the board 10 from any of the board's major sides (corresponding to the four major directions) and be securely soldered to the board 10, reducing the overall amount of space and material required by eliminating large twists and turns of wire.
Furthermore, the printed wiring board 10 may be attached to the device in any orientation and still provide similar functionality. As shown in
With further reference to
The solder pads 14 a through 14 d and 62 a through 62 d need not be limited to having two legs and two axes each.
Other constructions of the solder pad that allow a wire to be selectively soldered to the solder pad at one of a plurality of angles lying within the plane of the printed wiring board are also possible. Alternate solder pad shapes that include a first axis Aa through Ad and a second axis Ba through Bd along which a lead wire may be soldered to the solder pad could be used instead of (or in addition to) the L-shaped solder pad and the variations thereof shown in
Thus, the invention provides, among other things, a printed wiring board having solder pads to which leads and grounds may approach from any of the four major sides of the board and be soldered securely thereto. Various aspects of the invention are set forth in the following claims.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US4775917||Dec 3, 1985||Oct 4, 1988||Wells Manufacturing Company||Thermal compensated circuit board interconnect apparatus and method of forming the same|
|US5892275||Sep 4, 1997||Apr 6, 1999||Intel Corporation||High performance power and ground edge connect IC package|
|US6027791||Sep 29, 1997||Feb 22, 2000||Kyocera Corporation||Structure for mounting a wiring board|
|US6083045||May 28, 1999||Jul 4, 2000||Hon Hai Precision Ind. Co., Ltd.||Electrical connector|
|US6115262 *||Jun 8, 1998||Sep 5, 2000||Ford Motor Company||Enhanced mounting pads for printed circuit boards|
|US6159051||Jun 2, 1999||Dec 12, 2000||Hon Hai Precoision Ind. Co., Ltd.||Low profile smart card system|
|US6225573||May 30, 1997||May 1, 2001||Rohm Co., Ltd.||Method for mounting terminal on circuit board and circuit board|
|US6231386||Dec 29, 1999||May 15, 2001||Hon Hai Precision Ind. Co., Ltd.||Electrical connector with improved solder pads|
|US6280247||Feb 29, 2000||Aug 28, 2001||Hon Hai Precision Ind. Co., Ltd.||Surface mounted electrical connector|
|US6320139 *||Nov 12, 1998||Nov 20, 2001||Rockwell Automation Technologies, Inc.||Reflow selective shorting|
|US6511347 *||Jun 28, 2001||Jan 28, 2003||International Business Machines Corporation||Terminating floating signals on a BGA module to a ground plane on a ball grid array (BGA) circuit board site|
|US6570246||Jun 12, 2002||May 27, 2003||United Microelectronics Corp.||Multi-die package|
|US6639154 *||Oct 10, 2000||Oct 28, 2003||Teradyne, Inc.||Apparatus for forming a connection between a circuit board and a connector, having a signal launch|
|US6667557||Apr 9, 2003||Dec 23, 2003||International Business Machines Corporation||Method of forming an apparatus to reduce thermal fatigue stress on flip chip solder connections|
|US7045392||Sep 16, 2002||May 16, 2006||Seiko Epson Corporation||Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment|
|US7081019||Sep 15, 2004||Jul 25, 2006||Motorola, Inc.||Low profile contact block for a rechargeable cell of a wireless communication device|
|US7084353 *||Dec 11, 2002||Aug 1, 2006||Emc Corporation||Techniques for mounting a circuit board component to a circuit board|
|US7097463||Dec 28, 2004||Aug 29, 2006||Hon Hai Precision Ind. Co., Ltd.||Electrical connector|
|US7156667||Aug 26, 2005||Jan 2, 2007||Hon Hai Precision Ind. Co., Ltd.||Electronic card assembly|
|US7416106 *||Sep 29, 2003||Aug 26, 2008||Emc Corporation||Techniques for creating optimized pad geometries for soldering|
|US20030060062 *||Sep 19, 2002||Mar 27, 2003||Olympus Optical Co., Ltd.||Flexible Printed Circuit Board Having Conductor Lands Formed Thereon|
|US20050059277||Sep 13, 2004||Mar 17, 2005||Mao Yu Hua||Board-mounted electrical connector|
|US20050116801||Mar 3, 2004||Jun 2, 2005||Proehl Gregory L.||Sensor coil and method of manufacturing same|
|US20050264389||May 25, 2005||Dec 1, 2005||Coilcraft, Incorporated||Method of assembling an electronic component|
|EP1624736A2||Jul 20, 2005||Feb 8, 2006||Siemens Aktiengesellschaft||Method for making an electrical contact between printed circuit boards arranged in a T or L-shaped configuration|
|GB2284948A||Title not available|
|JP2004079776A||Title not available|
|JPH0758247A||Title not available|
|JPH05267493A||Title not available|
|1||"Engineering productivity kit: fastening, joining, & assembly", Design News, Apr. 6, 1998, v. 53 [i.e. 54] No. 7, p. 109-18, retrieved from Wilson Applied Science and Technology database.|
|2||Thompson, T.B.; Subbarayan, G.; James, R.; and Renken, F.P., "A model for assessing the shape of solder joints in the presence of board warpage and volume variation in area-array packages", 2000 Intersociety Conference on Thermal Phenomena, pp. 405-414.|
|U.S. Classification||361/767, 174/250|
|Cooperative Classification||Y02P70/613, Y02P70/611, H01R12/515, H05K2201/10287, H05K3/3421, H05K3/32, H05K2201/09272, H05K1/111, H05K3/3405, H05K2201/09381, H05K2201/09954, H05K1/0295, H05K2201/10409|
|European Classification||H05K3/34C3, H05K1/11C, H01R9/09B3|
|Apr 14, 2008||AS||Assignment|
Owner name: LOCKHEED MARTIN CORPORATION, MARYLAND
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WEINSTEIN, JEREMY F.;WARD, ROBERT M.;REEL/FRAME:020797/0181;SIGNING DATES FROM 20080407 TO 20080408
Owner name: LOCKHEED MARTIN CORPORATION, MARYLAND
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WEINSTEIN, JEREMY F.;WARD, ROBERT M.;SIGNING DATES FROM 20080407 TO 20080408;REEL/FRAME:020797/0181
|Sep 21, 2015||FPAY||Fee payment|
Year of fee payment: 4