USB542135I5 - - Google Patents

Info

Publication number
USB542135I5
USB542135I5 US54213575A USB542135I5 US B542135 I5 USB542135 I5 US B542135I5 US 54213575 A US54213575 A US 54213575A US B542135 I5 USB542135 I5 US B542135I5
Authority
US
United States
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to US05/542,135 priority Critical patent/US3986939A/en
Publication of USB542135I5 publication Critical patent/USB542135I5/en
Application granted granted Critical
Publication of US3986939A publication Critical patent/US3986939A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
US05/542,135 1975-01-17 1975-01-17 Method for enhancing the bondability of metallized thin film substrates Expired - Lifetime US3986939A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US05/542,135 US3986939A (en) 1975-01-17 1975-01-17 Method for enhancing the bondability of metallized thin film substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/542,135 US3986939A (en) 1975-01-17 1975-01-17 Method for enhancing the bondability of metallized thin film substrates

Publications (2)

Publication Number Publication Date
USB542135I5 true USB542135I5 (en) 1976-02-10
US3986939A US3986939A (en) 1976-10-19

Family

ID=24162484

Family Applications (1)

Application Number Title Priority Date Filing Date
US05/542,135 Expired - Lifetime US3986939A (en) 1975-01-17 1975-01-17 Method for enhancing the bondability of metallized thin film substrates

Country Status (1)

Country Link
US (1) US3986939A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL58029A (en) * 1978-09-18 1982-01-31 Hughes Aircraft Co Method of producing printed circuitry
US4312897A (en) * 1978-09-18 1982-01-26 Hughes Aircraft Company Buried resist technique for the fabrication of printed wiring
US4361641A (en) * 1981-11-10 1982-11-30 University Patents, Inc. Electrolytic surface modulation
US5829124A (en) * 1995-12-29 1998-11-03 International Business Machines Corporation Method for forming metallized patterns on the top surface of a printed circuit board
US6274057B1 (en) * 1999-02-17 2001-08-14 Scitex Digital Printing, Inc. Method for etch formation of electrical contact posts on a charge plate used for ink jet printing
US6994918B2 (en) * 2003-08-12 2006-02-07 Johnson Morgan T Selective application of conductive material to circuit boards by pick and place
TWI262041B (en) * 2003-11-14 2006-09-11 Hitachi Chemical Co Ltd Formation method of metal layer on resin layer, printed wiring board, and production method thereof
US7767126B2 (en) * 2005-08-22 2010-08-03 Sipix Imaging, Inc. Embossing assembly and methods of preparation
KR101412795B1 (en) * 2009-01-29 2014-06-27 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using same
TWI719241B (en) * 2017-08-18 2021-02-21 景碩科技股份有限公司 Multilayer circuit board capable of doing electrical test and its manufacturing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3467540A (en) * 1966-01-25 1969-09-16 Siemag Siegener Masch Bau Method of increasing the adhesion of metal to a subsurface
US3745094A (en) * 1971-03-26 1973-07-10 Ibm Two resist method for printed circuit structure
US3862875A (en) * 1971-03-17 1975-01-28 Micro Science Associates Filler masking of small apertures

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3467540A (en) * 1966-01-25 1969-09-16 Siemag Siegener Masch Bau Method of increasing the adhesion of metal to a subsurface
US3862875A (en) * 1971-03-17 1975-01-28 Micro Science Associates Filler masking of small apertures
US3745094A (en) * 1971-03-26 1973-07-10 Ibm Two resist method for printed circuit structure

Also Published As

Publication number Publication date
US3986939A (en) 1976-10-19

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Legal Events

Date Code Title Description
AS Assignment

Owner name: AT & T TECHNOLOGIES, INC.,

Free format text: CHANGE OF NAME;ASSIGNOR:WESTERN ELECTRIC COMPANY, INCORPORATED;REEL/FRAME:004251/0868

Effective date: 19831229