US D266071 S
Abstract available in
FIG. 1 is a front view of the heat releasing plate for mounting semi-conductor components showing the new design;
FIG. 2 is a plan view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a right side view thereof; and
FIG. 5 is a sectional view taken on line 5--5 of FIG. 2.