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Publication numberUSD266071 S
Publication typeGrant
Application numberUS 06/154,972
Publication dateSep 7, 1982
Filing dateMay 30, 1980
Priority dateApr 1, 1980
Publication number06154972, 154972, US D266071 S, US D266071S, US-S-D266071, USD266071 S, USD266071S
InventorsYoshihiko Asanuma
Original AssigneeShowa Aluminum Kabushiki Kaisha
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat releasing plate for mounting semiconductor components
US D266071 S
Abstract  available in
Images(1)
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Claims(1)
  1. The ornamental design for heat releasing plate for mounting semiconductor components, as shown and described.
Description

FIG. 1 is a front view of the heat releasing plate for mounting semi-conductor components showing the new design;

FIG. 2 is a plan view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a right side view thereof; and

FIG. 5 is a sectional view taken on line 5--5 of FIG. 2.

Classifications
U.S. ClassificationD13/179