Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.


  1. Advanced Patent Search
Publication numberUSD266078 S
Publication typeGrant
Application numberUS 06/154,979
Publication dateSep 7, 1982
Filing dateMay 30, 1980
Priority dateMar 31, 1980
Publication number06154979, 154979, US D266078 S, US D266078S, US-S-D266078, USD266078 S, USD266078S
InventorsYoshihiko Asanuma
Original AssigneeShowa Aluminum Kabushiki Kaisha
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat releasing plate for mounting semiconductor components
US D266078 S
Abstract  available in
Previous page
Next page
  1. The ornamental design for a heat releasing plate for mounting semiconductor components, as shown and described.

FIG. 1 is a front view of the heat releasing plate for mounting semiconductor components showing the new design;

FIG. 2 is a plan view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side view thereof; and

FIG. 6 is a sectional view taken on line 6--6 of FIG. 1.

U.S. ClassificationD13/179