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Publication numberUSD269084 S
Publication typeGrant
Application numberUS 06/252,030
Publication dateMay 24, 1983
Filing dateApr 8, 1981
Publication number06252030, 252030, US D269084 S, US D269084S, US-S-D269084, USD269084 S, USD269084S
InventorsAlfred F. McCarthy
Original AssigneeAavid Engineering, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Dual heat sink for electronic semiconductor devices
US D269084 S
Images(1)
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Claims(1)
  1. The ornamental design for a dual heat sink for electronic semiconductor devices, substantially as shown and described.
Description

FIG. 1 is a perspective view of a dual heat sink for electronic semiconductor devices showing my new design; the broken lines being shown for illustrative purposes, only;

FIG. 2 is a front elevational view of the same heat sink;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof, looking toward the right side of the heat sink as it is shown in FIG. 1;

FIG. 5 is a side elevational view thereof, looking toward the left side of the heat sink as it is shown in FIG. 1;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a bottom plan view thereof.

Non-Patent Citations
Reference
1Amperex Transistor Brocure, 6/1966, Extruded Aluminum Heat-Sink.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6633485Nov 20, 2002Oct 14, 2003Illinois Tool Works Inc.Snap-in heat sink for semiconductor mounting
Classifications
U.S. ClassificationD13/179