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Publication numberUSD269606 S
Publication typeGrant
Application numberUS 06/267,359
Publication dateJul 5, 1983
Filing dateMay 26, 1981
Publication number06267359, 267359, US D269606 S, US D269606S, US-S-D269606, USD269606 S, USD269606S
InventorsWilliam D. Jordan, Howard G. Hinshaw
Original AssigneeThermalloy Incorporated
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat sink or similar article
US D269606 S
Abstract  available in
Images(1)
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Claims(1)
  1. The ornamental design for a heat sink or similar article, substantially as shown.
Description

FIG. 1 is a bottom plan view of the heat sink or similar article showing our new design;

FIG. 2 is an end elevational view thereof as seen from the top of FIG. 4;

FIG. 3 is a side elevational view thereof as seen from the right of FIG. 4;

FIG. 4 is a top plan view thereof;

FIG. 5 is a side elevational view thereof as seen from the left of FIG. 4; and

FIG. 6 is an end elevational view thereof as seen from the bottom of FIG. 4.

Non-Patent Citations
Reference
1Amperex Transistor Brochure, 6-1966, Dual Heat Sink Clip.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6496371Mar 30, 2001Dec 17, 2002Intel CorporationHeat sink mounting method and apparatus
US6633485Nov 20, 2002Oct 14, 2003Illinois Tool Works Inc.Snap-in heat sink for semiconductor mounting
Classifications
U.S. ClassificationD13/179