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Publication numberUSD276719 S
Publication typeGrant
Application numberUS 06/397,051
Publication dateDec 11, 1984
Filing dateJul 12, 1982
Priority dateJan 14, 1982
Publication number06397051, 397051, US D276719 S, US D276719S, US-S-D276719, USD276719 S, USD276719S
InventorsMasahiro Sugimoto, Hidehiko Akasaki, Tetsushi Wakabayashi
Original AssigneeFujitsu Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Integrated circuit device
US D276719 S
Abstract  available in
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  1. The ornamental design for an integrated circuit device, as shown.

FIG. 1 is a bottom plan view of an integrated circuit device showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a rear elevational view thereof;

FIG. 7 is a perspective view thereof; and

FIG. 8 is a sectional view taken along line A--A of FIG. 2.

Non-Patent Citations
1Electronic Design, May 1959, FIG. 1-cutaway of heat exchanger.
2IBM Technical Disclosure, vol. 23, No. 9, Feb. 1981, center post heat sink; Nutter et al.
U.S. ClassificationD13/182, 174/16.3, D13/179