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Publication numberUSD282838 S
Publication typeGrant
Application numberUS 06/478,919
Publication dateMar 4, 1986
Filing dateMar 25, 1983
Publication number06478919, 478919, US D282838 S, US D282838S, US-S-D282838, USD282838 S, USD282838S
InventorsAlfred F. McCarthy
Original AssigneeAavid Engineering, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Slip-on heat sink for encased electrical packages
US D282838 S
Abstract  available in
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Claims(1)
  1. The ornamental design for a slip-on heat sink for encased electrical packages, substantially as shown.
Description

FIG. 1 is a perspective view of a slip-on heat sink for encasing electrical packages showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof, looking toward the left side of the heat sink as it is shown in FIG. 1;

FIG. 5 is a side elevational view thereof, looking toward the right side of the heat sink as it is shown in FIG. 1;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a bottom plan view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6633485Nov 20, 2002Oct 14, 2003Illinois Tool Works Inc.Snap-in heat sink for semiconductor mounting
US7443022 *May 18, 2005Oct 28, 2008Micron Technology, Inc.Board-on-chip packages
Classifications
U.S. ClassificationD13/179