US D285302 S
Abstract available in
FIG. 1 is a perspective view of a leadless integrated-circuit chip-carrier heat sink showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a side elevational view thereof, looking toward the left side of the heat sink as it appears in FIG. 2; and
FIG. 6 is a bottom view thereof.