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Publication numberUSD288436 S
Publication typeGrant
Application numberUS 06/582,028
Publication dateFeb 24, 1987
Filing dateFeb 21, 1984
Publication number06582028, 582028, US D288436 S, US D288436S, US-S-D288436, USD288436 S, USD288436S
InventorsLinus E. Wallgren
Original AssigneePace, Incorporated
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Frame of dual in line package pads utilized to replace damaged pads on printed circuit boards
US D288436 S
Abstract  available in
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Claims(1)
  1. The ornamental design for a frame of dual in line package pads utilized to replace damaged pads on printed circuit boards, as shown and described.
Description

The sole FIGURE is a top plan view of the frame of dual in line package pads utilized to replace damaged pads on printed circuit boards showing my new design. The frame is flat with no substantial thickness and the bottom surface is identical to the top.

Classifications
U.S. ClassificationD13/182