US D292400 S
Abstract available in
FIG. 1 is a front elevational view of a headset telephone showing our new design, the rear elevation being basically a mirror image;
FIGS. 2 and 3 are respectively top and bottom plan views thereof;
FIGS. 4 and 5 are respectively left and right side elevational views thereof; and
FIG. 6 is a cross-sectional view of the earphone interior taken along the line 6--6 in FIG. 1.