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Publication numberUSD303786 S
Publication typeGrant
Application numberUS 07/019,549
Publication dateOct 3, 1989
Filing dateFeb 26, 1987
Publication number019549, 07019549, US D303786 S, US D303786S, US-S-D303786, USD303786 S, USD303786S
InventorsAlfred F. McCarthy
Original AssigneeAavid Engineering, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Spring-clip heat sink for a pair of electronic devices
US D303786 S
Abstract  available in
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Claims(1)
  1. The ornamental design for a spring-clip heat sink for a pair of electronic devices, as shown and described.
Description

FIG. 1 is a top, front perspective view of a spring-clip heat sink for a pair of electronic devices showing my new design, the electronic devices being shown in broken lines for illustrative purposes only;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a side elevational view thereof as seen from the left of FIG. 1;

FIG. 5 is a side elevational view thereof as seen from the right of FIG. 1;

FIG. 6 is a front elevational view thereof; and

FIG. 7 is a rear elevational view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US20040201964 *Jul 6, 2003Oct 14, 2004Sigl Dennis R.Snap-in heat sink for semiconductor mounting
Classifications
U.S. ClassificationD13/179