US D313686 S
Abstract available in
FIG. 1 is a perspective view of an integrated circuit chip carrier showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is an end elevational view thereof; and
FIG. 5 is a side elevational view thereof, the opposite side elevational view being a mirror image.