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Publication numberUSD316251 S
Publication typeGrant
Application numberUS 07/287,982
Publication dateApr 16, 1991
Filing dateDec 19, 1988
Publication number07287982, 287982, US D316251 S, US D316251S, US-S-D316251, USD316251 S, USD316251S
InventorsDavid Y. Armstrong
Original AssigneeMosaic Semiconductor, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
In-line semiconductor package
US D316251 S
Abstract  available in
Images(3)
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Claims(1)
  1. The ornamental design for a in-line semiconductor package, as shown and described.
Description

FIG. 1 is a top, front and left side perspective view of an in-line semiconductor package showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a right side elevational view thereof;

FIG. 8 is a top, front and left side perspective view of an in-line semiconductor package showing a second embodiment of my new design;

FIG. 9 is a top plan view thereof;

FIG. 10 is a front elevational view thereof;

FIG. 11 is a bottom plan view thereof;

FIG. 12 is a rear elevational view thereof;

FIG. 13 is a right side elevational view thereof, the left side being a mirror image;

FIG. 14 is a top, front and left side perspective view of an in-line semiconductor package showing a third embodiment of my new design;

FIG. 15 is a bottom, left and rear perspective view thereof;

FIG. 16 is a top, front and left side perspective view of an in-line semiconductor package showing a fourth embodiment of my new design;

FIG. 17 is a bottom, left and rear perspective view thereof;

FIG. 18 is a top, front and left side perspective view of an in-line semiconductor package showing a fifth embodiment of my new design;

FIG. 19 is a bottom, left and rear perspective view thereof;

FIG. 20 is a right side elevational view of the third, fourth and fifth embodiments of my new design.

Non-Patent Citations
Reference
1Fujitsu Limited, Data Book-Memories, 1986-87 (pp. 1-28, 1-30, 1-129 and 1-147).
2Hitachi, IC Memory Data Book, Mar., 1988 (p. 7).
3Mitsubishi Electric Corp., Mitsubishi Semiconductors-IC Memories, 1987 (pp. 1-35, 1-38 and 1-40).
4NEC Electrics, Inc., Memory Products Data Book, 1989 (pp. 10-9 and 10-10).
5Samsung Semiconductor, MOS Memory Data Book, 1988 (pp. 46, 58, 72, 88 and 103).
6Toshiba America, Inc., MOS Memory, 1988 (pp. A-34, A-49, A-90 and A-111).
Classifications
U.S. ClassificationD13/182