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Publication numberUSD318461 S
Publication typeGrant
Application numberUS 07/181,252
Publication dateJul 23, 1991
Filing dateApr 13, 1988
Publication number07181252, 181252, US D318461 S, US D318461S, US-S-D318461, USD318461 S, USD318461S
InventorsTerutomi Hasegawa, Nobumichi Goto
Original AssigneeIbiden Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Semi-conductor mounting substrate
US D318461 S
Abstract  available in
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  1. The ornamental design for a semi-conductor mounting substrate, as shown.

FIG. 1 is a top perspective view of a semi-conductor mounting substrate showing our new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a rear elevational view thereof; and

FIG. 6 is a front elevational view thereof.

FIG. 7 is a top plan view thereof; and

FIG. 8 is a bottom plan view thereof.

Non-Patent Citations
1Electronic Design, p. 190, dtd 10-16-86, Disc Controll pictured thereon.
2Electronic Design, p. 7, dtd 10-16-86, NRC 1C package pictured thereon.
3Electronics, p. 131, dtd 8-7-86, CMOS chip pictured thereon.
4Electronics, p. 7, Feb. 24, 1986 by Fujitsu Microelectronics, Inc.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD734732 *Jan 7, 2014Jul 21, 2015Sumitomo Electric Fine Polymer, Inc.Circuit board material
USD752524May 9, 2013Mar 29, 2016Abb S.P.A.Circuit breaker
USD757659May 5, 2014May 31, 2016Abb S.P.A.Circuit breakers
USD789895Jul 6, 2015Jun 20, 2017Abb S.P.A.Circuit breaker
U.S. ClassificationD13/182