US D319431 S
Abstract available in
FIG. 1 is a front, top and right side perspective view of a housing for electronic circuits showing my new design;
FIG. 2 is a top-plan view thereof;
FIG. 3 is a bottom-plan view thereof;
FIG. 4 is a front-elevational view thereof;
FIG. 5 is an inverted rear elevational view thereof; and,
FIG. 6 is a left side elevational view thereof, the right side elevational view thereof being a mirror image.