Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.


  1. Advanced Patent Search
Publication numberUSD319629 S
Publication typeGrant
Application numberUS 07/181,253
Publication dateSep 3, 1991
Filing dateApr 13, 1988
Publication number07181253, 181253, US D319629 S, US D319629S, US-S-D319629, USD319629 S, USD319629S
InventorsTerutomi Hasegawa, Nobumichi Goto
Original AssigneeIbiden Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Semiconductor substrate with conducting pattern
US D319629 S
Abstract  available in
Previous page
Next page
  1. The ornamental design for a semiconductor substrate with conducting pattern, as shown.

FIG. 1 is a top perspective view of a semi-conductor mounting device showing our new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a rear elevational view thereof; and

FIG. 6 is a front elevational view thereof;

FIG. 7 is a top plan view thereof; and

FIG. 8 is a bottom plan view thereof.

Non-Patent Citations
1Electronic Design, p. 190, dtd 10-16-86, Disc Controller Pictured Thereon.
2Electronic Design, p. 7, dtd 10-16-86, NCR IC Package Pictured Thereon.
3Electronics, p. 131, dtd 8-7-86, CMOS Chip Pictured Thereon.
4Electronics, p. 7, Feb. 24, 1986, by Fujitsu Microelectronics, Inc.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD734732 *Jan 7, 2014Jul 21, 2015Sumitomo Electric Fine Polymer, Inc.Circuit board material
USD788723 *Mar 4, 2015Jun 6, 2017Osram Sylvania Inc.Serrated light engine and circuit board
U.S. ClassificationD13/182