US D323628 S
FIG. 1 is a top, front and right side perspective view of a semiconductor wafer measuring instrument showing my new design;
FIG. 2 is a front elevational view;
FIG. 3 is a right side elevational view, the left side elevational view being a mirror image;
FIG. 4 is a top plan view;
FIG. 5 is a rear elevational view; and
FIG. 6 is a bottom plan view thereof.