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Publication numberUSD326272 S
Publication typeGrant
Application numberUS 07/301,995
Publication dateMay 19, 1992
Filing dateJan 25, 1989
Priority dateJul 25, 1988
Publication number07301995, 301995, US D326272 S, US D326272S, US-S-D326272, USD326272 S, USD326272S
InventorsKen Nakao, Wataru Ohkase
Original AssigneeTel Sagami Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat insulating cylinder for thermal treatment of semiconductor wafers
US D326272 S
Images(3)
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Claims(1)
  1. The ornamental design for a heat insulating cylinder for thermal treatment of semiconductor wafers, as shown and described.
Description

FIG. 1 is a front elevational view of a heat insulating cylinder for thermal treatment of semiconductor wafers showing our new design;

FIG. 2 is a right side elevational view, the left side elevational view being a mirror image;

FIG. 3 is a top plan view;

FIG. 4 is a bottom plan view; and,

FIG. 5 is a rear elevational view thereof.

Classifications
U.S. ClassificationD15/144.1