US D326272 S
FIG. 1 is a front elevational view of a heat insulating cylinder for thermal treatment of semiconductor wafers showing our new design;
FIG. 2 is a right side elevational view, the left side elevational view being a mirror image;
FIG. 3 is a top plan view;
FIG. 4 is a bottom plan view; and,
FIG. 5 is a rear elevational view thereof.