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Publication numberUSD337993 S
Publication typeGrant
Application numberUS 07/576,901
Publication dateAug 3, 1993
Filing dateSep 4, 1990
Publication number07576901, 576901, US D337993 S, US D337993S, US-S-D337993, USD337993 S, USD337993S
InventorsJay Garthwaite, Fred Orbeta, Michael Shatzkin
Original AssigneeLeviton Manufacturing Co., Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Duplex modular jack housing
US D337993 S
Abstract  available in
Images(1)
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Claims(1)
  1. The ornamental design for a duplex modular jack housing, as shown.
Description

FIG. 1 is a front elevational view of the duplex modular jack housing according to the present invention;

FIG. 2 is a rear elevational view of the design of FIG. 1;

FIG. 3 is a top plan view of the design of FIG. 1;

FIG. 4 is a left side elevational view of the design of FIG. 1;

FIG. 5 is a right side elevational view of the design of FIG. 1; and,

FIG. 6 is an upper right perspective view of the design of FIG. 1.

Non-Patent Citations
Reference
1Circuit housing in IBM Technical Disclosure Bulletin vol. 18 No. 6, Nov. 1975.
2Data line protector p. 78 of Bell Atlantic Business Supplies Catalog, II edition, 1988.
3SE-625A2 jack assembly on p. 6 of Suttle 1985 Catalog.
Classifications
U.S. ClassificationD13/156, D13/184