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Publication numberUSD337993 S
Publication typeGrant
Application numberUS 07/576,901
Publication dateAug 3, 1993
Filing dateSep 4, 1990
Publication number07576901, 576901, US D337993 S, US D337993S, US-S-D337993, USD337993 S, USD337993S
InventorsJay Garthwaite, Fred Orbeta, Michael Shatzkin
Original AssigneeLeviton Manufacturing Co., Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Duplex modular jack housing
US D337993 S
Abstract  available in
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  1. The ornamental design for a duplex modular jack housing, as shown.

FIG. 1 is a front elevational view of the duplex modular jack housing according to the present invention;

FIG. 2 is a rear elevational view of the design of FIG. 1;

FIG. 3 is a top plan view of the design of FIG. 1;

FIG. 4 is a left side elevational view of the design of FIG. 1;

FIG. 5 is a right side elevational view of the design of FIG. 1; and,

FIG. 6 is an upper right perspective view of the design of FIG. 1.

Non-Patent Citations
1Circuit housing in IBM Technical Disclosure Bulletin vol. 18 No. 6, Nov. 1975.
2Data line protector p. 78 of Bell Atlantic Business Supplies Catalog, II edition, 1988.
3SE-625A2 jack assembly on p. 6 of Suttle 1985 Catalog.
U.S. ClassificationD13/156, D13/184