Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.


  1. Advanced Patent Search
Publication numberUSD338402 S
Publication typeGrant
Application numberUS 07/822,822
Publication dateAug 17, 1993
Filing dateJan 21, 1992
Publication number07822822, 822822, US D338402 S, US D338402S, US-S-D338402, USD338402 S, USD338402S
InventorsBarry Gregerson, Jim Wagner
Original AssigneeEmpak, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Individual wafer package
US D338402 S
Abstract  available in
Previous page
Next page
  1. The ornamental design for an individual wafer package, as shown and described.

FIG. 1 is a perspective view of an individual wafer package showing our new design;

FIG. 2 is a left side elevational view thereof; the right side elevational view being a mirror image thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

U.S. ClassificationD09/418, D09/432