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Publication numberUSD339110 S
Publication typeGrant
Application numberUS 07/754,133
Publication dateSep 7, 1993
Filing dateSep 3, 1991
Publication number07754133, 754133, US D339110 S, US D339110S, US-S-D339110, USD339110 S, USD339110S
InventorsCarl A. Steen, Jr., Robert B. Widmayer
Original AssigneeMotorola, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat sink clip for surface-mount integrated circuit
US D339110 S
Abstract  available in
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Claims(1)
  1. The ornamental design for a heat sink clip for surface-mount integrated circuit, as shown and described.
Description

FIG. 1 is a front, top, and right side perspective view showing our new design for a heat sink clip for surface-mount integrated circuit;

FIG. 2 is a left elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a bottom plan view thereof; and,

FIG. 5 is a front, top, and right side perspective view showing an alternate embodiment for a heat sink clip for surface mount integrated circuit, the front, top, and left side perspective view being a mirror image.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6617685 *Aug 30, 1999Sep 9, 2003Sun Microsystems, Inc.Clip heat sink assembly
US7233497Oct 6, 2004Jun 19, 2007Hewlett-Packard Development Company, L.P.Surface mount heat sink
Classifications
U.S. ClassificationD13/179