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Publication numberUSD341820 S
Publication typeGrant
Application numberUS 07/933,504
Publication dateNov 30, 1993
Filing dateAug 21, 1992
Priority dateMar 4, 1992
Publication number07933504, 933504, US D341820 S, US D341820S, US-S-D341820, USD341820 S, USD341820S
InventorsSatomi Itoh
Original AssigneeItoh Research & Development Laboratory Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat dissipating device for a semiconductor package
US D341820 S
Abstract  available in
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  1. The ornamental design for a heat dissipating device for a semiconductor package, as shown and desscribed.

FIG. 1 is a front view of an embodiment of the heat dissipating device;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a perspective view thereof;

FIG. 6 is a sectional view taken along section line 6--6 in FIG. 2;

FIG. 7 is a sectional view taken along section line 7--7 in FIG. 2; and,

FIG. 8 is a view of the heat dissipating device shown in FIG. 1 attached to a semiconductor package, the latter being shown by broken lines only as it does not form any part of the claimed design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US20130058042 *Sep 3, 2011Mar 7, 2013Todd Richard SalamonLaminated heat sinks
U.S. ClassificationD13/179