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Publication numberUSD342721 S
Publication typeGrant
Application numberUS 07/933,503
Publication dateDec 28, 1993
Filing dateAug 21, 1992
Priority dateMar 4, 1992
Publication number07933503, 933503, US D342721 S, US D342721S, US-S-D342721, USD342721 S, USD342721S
InventorsAkira Itoh
Original AssigneeItoh Research & Development Laboratory Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat dissipating device for a semiconductor package
US D342721 S
Abstract  available in
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  1. The ornamental design for a heat dissipating device for a semiconductor package, as shown and described.

FIG. 1 is a front view of an embodiment of the heat dissipating device for a semiconductor package;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a perspective view thereof;

FIG. 6 is a sectional view taken along section line 6--6 in FIG. 2; and,

FIG. 7 is the same view as in FIG. 4 showing the heat dissipating device attached to a semiconductor package shown in broken lines since the packages do not form any part of the claimed design.

Non-Patent Citations
1Air-Cooled Module on p. 1007 of IBM Technical Disclosure Bulletin vol. 20 No. 3 Aug. 1977.
2Heat Removal Module on p. 2249 of IBM Technical Disclosure Bulletin vol. 22 No. 6 Nov. 1979.
U.S. ClassificationD13/179, 257/722