US D344891 S
FIG. 1 is a top front perspective view of a disc package for semiconductor wafers;
FIG. 2 is a front elevational view thereof, the undisclosed rear portion is a mirror image of the front;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof; and,
FIG. 5 is a side elevation view thereof, the opposite side is a mirror image of the side shown.