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Publication numberUSD344891 S
Publication typeGrant
Application numberUS 07/829,171
Publication dateMar 8, 1994
Filing dateFeb 3, 1992
Publication number07829171, 829171, US D344891 S, US D344891S, US-S-D344891, USD344891 S, USD344891S
InventorsLarry Dressen
Original AssigneeEmpak, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Disc package for semiconductor wafers
US D344891 S
Abstract  available in
Images(3)
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Claims(1)
  1. The ornamental design for the disc package for semiconductor wafers, as shown and described.
Description

FIG. 1 is a top front perspective view of a disc package for semiconductor wafers;

FIG. 2 is a front elevational view thereof, the undisclosed rear portion is a mirror image of the front;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof; and,

FIG. 5 is a side elevation view thereof, the opposite side is a mirror image of the side shown.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6332656Apr 25, 2000Dec 25, 2001James W. GavesDispensing and storage unit for discs and the like
US7252199Mar 23, 2005Aug 7, 2007Entegris, Inc.Disk cassette system
Classifications
U.S. ClassificationD09/424, 206/710, 206/508